SG10201708389SA - Thermal treatment system with collector device - Google Patents

Thermal treatment system with collector device

Info

Publication number
SG10201708389SA
SG10201708389SA SG10201708389SA SG10201708389SA SG10201708389SA SG 10201708389S A SG10201708389S A SG 10201708389SA SG 10201708389S A SG10201708389S A SG 10201708389SA SG 10201708389S A SG10201708389S A SG 10201708389SA SG 10201708389S A SG10201708389S A SG 10201708389SA
Authority
SG
Singapore
Prior art keywords
treatment system
thermal treatment
collector device
collector
thermal
Prior art date
Application number
SG10201708389SA
Inventor
Didier Landru
Oleg Kononchuk
Sébastien Simon
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG10201708389SA publication Critical patent/SG10201708389SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
SG10201708389SA 2016-10-11 2017-10-11 Thermal treatment system with collector device SG10201708389SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1659810A FR3057391B1 (en) 2016-10-11 2016-10-11 THERMAL TREATMENT EQUIPMENT WITH COLLECTING DEVICE

Publications (1)

Publication Number Publication Date
SG10201708389SA true SG10201708389SA (en) 2018-05-30

Family

ID=57861004

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201708389SA SG10201708389SA (en) 2016-10-11 2017-10-11 Thermal treatment system with collector device

Country Status (7)

Country Link
US (1) US10510565B2 (en)
JP (1) JP7034656B2 (en)
KR (1) KR102399773B1 (en)
CN (1) CN107919302B (en)
FR (1) FR3057391B1 (en)
SG (1) SG10201708389SA (en)
TW (1) TWI736684B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101393235B1 (en) * 2012-11-13 2014-05-27 공주대학교 산학협력단 Power topology of fault ride through mode pwm switching and the control method
KR102188604B1 (en) * 2019-04-02 2020-12-09 주식회사 미래보 Apparatus for collecting by-product of semiconductor manufacturing process

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188672A (en) * 1990-06-28 1993-02-23 Applied Materials, Inc. Reduction of particulate contaminants in chemical-vapor-deposition apparatus
US5312245A (en) * 1993-07-16 1994-05-17 International Business Machines Corporation Particulate trap for vertical furnace
US5827370A (en) * 1997-01-13 1998-10-27 Mks Instruments, Inc. Method and apparatus for reducing build-up of material on inner surface of tube downstream from a reaction furnace
JPH10223538A (en) * 1997-02-07 1998-08-21 Tokyo Electron Ltd Vertical heat-treating apparatus
US6900413B2 (en) * 1998-08-12 2005-05-31 Aviza Technology, Inc. Hot wall rapid thermal processor
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus
FR2842193B1 (en) * 2002-07-12 2004-10-01 Messier Bugatti PROCESS AND PLANT FOR HIGH TEMPERATURE HEAT TREATMENT AND DENSIFICATION BY CHEMICAL STEAM INFILTRATION OF CARBON TEXTURES
WO2004008054A1 (en) * 2002-07-15 2004-01-22 Aviza Technology, Inc. Variable heater element for low to high temperature ranges
JP4734950B2 (en) * 2005-02-17 2011-07-27 株式会社デンソー Heat treatment equipment
US7312422B2 (en) * 2006-03-17 2007-12-25 Momentive Performance Materials Inc. Semiconductor batch heating assembly
US7632354B2 (en) * 2006-08-08 2009-12-15 Tokyo Electron Limited Thermal processing system with improved process gas flow and method for injecting a process gas into a thermal processing system
JP2008053515A (en) 2006-08-25 2008-03-06 Seiko Instruments Inc Semiconductor device and manufacturing method thereof
JP2011129567A (en) 2009-12-15 2011-06-30 Hitachi Kokusai Electric Inc Heat treatment apparatus
DE202010015018U1 (en) * 2010-11-07 2011-04-14 Bohnet, Hans Arrangement for producing structured substrates
JP5779957B2 (en) * 2011-04-20 2015-09-16 東京エレクトロン株式会社 Loading unit and processing system

Also Published As

Publication number Publication date
JP2018064094A (en) 2018-04-19
JP7034656B2 (en) 2022-03-14
CN107919302A (en) 2018-04-17
TW201816956A (en) 2018-05-01
KR102399773B1 (en) 2022-05-20
FR3057391B1 (en) 2019-03-29
US10510565B2 (en) 2019-12-17
CN107919302B (en) 2023-05-02
TWI736684B (en) 2021-08-21
US20180102264A1 (en) 2018-04-12
KR20180040112A (en) 2018-04-19
FR3057391A1 (en) 2018-04-13

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