SG10201602865TA - Cover tape - Google Patents

Cover tape

Info

Publication number
SG10201602865TA
SG10201602865TA SG10201602865TA SG10201602865TA SG10201602865TA SG 10201602865T A SG10201602865T A SG 10201602865TA SG 10201602865T A SG10201602865T A SG 10201602865TA SG 10201602865T A SG10201602865T A SG 10201602865TA SG 10201602865T A SG10201602865T A SG 10201602865TA
Authority
SG
Singapore
Prior art keywords
cover tape
tape
cover
Prior art date
Application number
SG10201602865TA
Inventor
Kazuya Sugimoto
Hisatsugu Tokunaga
Tadaaki Hirooka
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of SG10201602865TA publication Critical patent/SG10201602865TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2491/00—Presence of oils, fats or waxes
    • C09J2491/006—Presence of oils, fats or waxes in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
SG10201602865TA 2011-10-14 2012-10-12 Cover tape SG10201602865TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011226748 2011-10-14

Publications (1)

Publication Number Publication Date
SG10201602865TA true SG10201602865TA (en) 2016-05-30

Family

ID=48056202

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201401462QA SG11201401462QA (en) 2011-10-14 2012-10-12 Cover tape
SG10201602865TA SG10201602865TA (en) 2011-10-14 2012-10-12 Cover tape

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201401462QA SG11201401462QA (en) 2011-10-14 2012-10-12 Cover tape

Country Status (7)

Country Link
US (1) US9453146B2 (en)
JP (1) JP6113073B2 (en)
KR (1) KR101955745B1 (en)
CN (2) CN202953309U (en)
SG (2) SG11201401462QA (en)
TW (1) TWI568650B (en)
WO (1) WO2013054867A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103600553B (en) * 2013-11-19 2015-12-30 江西若邦科技股份有限公司 Cover strip on a kind of SMD heat-sealing type
CN103600918A (en) * 2013-11-19 2014-02-26 贵溪若邦电子科技有限公司 Manufacturing process for SMD (surface-mounted) heat-seal type upper cover tapes
TWI674970B (en) * 2015-01-27 2019-10-21 日商王子控股股份有限公司 Laminate, decorative molded article, and manufacturing method of decorative molded article
CN104960292B (en) * 2015-06-17 2017-01-25 浙江洁美电子科技股份有限公司 Packaging tape for carrier belt for electronic components and production method of packaging tape
JP2017013801A (en) * 2015-06-29 2017-01-19 住友ベークライト株式会社 Cover tape for packaging electronic parts
TWI580578B (en) * 2016-07-06 2017-05-01 俊馳材料科技股份有限公司 Cover Tape and Method for Manufacturing the same
CN106005531A (en) * 2016-07-06 2016-10-12 成都格虹电子科技有限责任公司 Cover tape heat-sealing process method
CN106480784B (en) * 2016-11-28 2018-05-15 浙江洁美电子信息材料有限公司 The manufacture method and cover strip of cover strip body paper, cover strip body paper
CN109449668A (en) * 2018-12-21 2019-03-08 张家界昱辰科技有限公司 A kind of mobile phone that mobile telephone SIM card slot is waterproof
JP7192532B2 (en) * 2019-01-29 2022-12-20 住友ベークライト株式会社 Cover tape for electronic component packaging and electronic component package
JP6950773B1 (en) * 2020-03-17 2021-10-13 大日本印刷株式会社 Cover tape and packaging for electronic component packaging
JP6950774B1 (en) * 2020-03-17 2021-10-13 大日本印刷株式会社 Cover tape and packaging for electronic component packaging
CN113426643B (en) * 2021-07-06 2023-08-22 靖江瑞泰电子材料有限公司 Heat-sealing cover tape with multilayer structure and preparation method thereof
CN113478931A (en) * 2021-07-06 2021-10-08 靖江瑞泰电子材料有限公司 Heat-sealing type middle-release cover tape and preparation method thereof

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60215039A (en) * 1984-04-02 1985-10-28 Kohjin Co Ltd Heat-sealable coated film
US4746574A (en) 1984-09-25 1988-05-24 Asahi Chemical Polyflex Ltd. Antistatic sheeting
JPS6178637A (en) * 1984-09-27 1986-04-22 旭化成株式会社 Antistatic film
JP2904613B2 (en) * 1991-05-31 1999-06-14 信越ポリマー株式会社 Cover tape film and mounted component package using the same
JP3241220B2 (en) 1994-10-28 2001-12-25 住友ベークライト株式会社 Cover tape for packaging chip-type electronic components
TW393405B (en) 1997-09-13 2000-06-11 Four Pillars Entpr Co Ltd Compound membrane for packaging
JP2000280411A (en) 1999-03-31 2000-10-10 Dainippon Printing Co Ltd Laminated plastic film, transparent conductive cover tape and package
JP2000327024A (en) 1999-05-17 2000-11-28 Shin Etsu Polymer Co Ltd Cover tape
JP2002337370A (en) * 2001-05-17 2002-11-27 Fuji Photo Film Co Ltd Laser thermal transfer recording method and image receiving sheet
WO2002096773A1 (en) * 2001-05-28 2002-12-05 Denki Kagaku Kogyo Kabushiki Kaisha Electronic component container
US6723402B2 (en) * 2001-12-21 2004-04-20 Eastman Kodak Company Protective layer for hydrophilic packaging material
JP2004051105A (en) 2002-07-16 2004-02-19 Dainippon Printing Co Ltd Cover tape
JP2004255736A (en) * 2003-02-26 2004-09-16 Toyobo Co Ltd Conductive polyester sheet and packaging container for electronic component comprising the same
JP2005306460A (en) * 2004-04-26 2005-11-04 Denki Kagaku Kogyo Kk Cover tape and electronic part packaging carrier tape system
US8148456B2 (en) * 2006-08-15 2012-04-03 Denki Kagaku Kogyo Kabushiki Kaisha Conductive resin composition and conductive sheets comprising the same
JP4894631B2 (en) 2007-05-31 2012-03-14 東洋紡績株式会社 Antistatic laminated film
JP5193524B2 (en) 2007-08-07 2013-05-08 帝人デュポンフィルム株式会社 Antistatic polyester film
US20100247939A1 (en) 2007-12-07 2010-09-30 Du Pont-Mitsui Polychemicals Co., Ltd. Ionomer, resin composition containing the ionomer, unstretched film, sheet or molded body each made of the composition, and laminate comprising layer of the unstretched film
TW200942604A (en) * 2008-02-20 2009-10-16 Mitsubishi Plastics Inc Antistatic resin composition
WO2010055804A1 (en) * 2008-11-12 2010-05-20 電気化学工業株式会社 Cover tape
JP5419607B2 (en) 2009-09-15 2014-02-19 三井・デュポンポリケミカル株式会社 Sealant material, cover tape, and packaging for transporting electronic components

Also Published As

Publication number Publication date
JPWO2013054867A1 (en) 2015-03-30
JP6113073B2 (en) 2017-04-12
CN202953309U (en) 2013-05-29
TW201336747A (en) 2013-09-16
CN103043302B (en) 2016-06-01
SG11201401462QA (en) 2014-09-26
CN103043302A (en) 2013-04-17
US9453146B2 (en) 2016-09-27
US20140248487A1 (en) 2014-09-04
KR101955745B1 (en) 2019-03-07
KR20140107183A (en) 2014-09-04
TWI568650B (en) 2017-02-01
WO2013054867A1 (en) 2013-04-18

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