SG10201509064PA - Carrier for separated electronic components and method for visual inspection of separated electronic components - Google Patents
Carrier for separated electronic components and method for visual inspection of separated electronic componentsInfo
- Publication number
- SG10201509064PA SG10201509064PA SG10201509064PA SG10201509064PA SG10201509064PA SG 10201509064P A SG10201509064P A SG 10201509064PA SG 10201509064P A SG10201509064P A SG 10201509064PA SG 10201509064P A SG10201509064P A SG 10201509064PA SG 10201509064P A SG10201509064P A SG 10201509064PA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic components
- separated electronic
- carrier
- visual inspection
- separated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Packaging Frangible Articles (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2005626A NL2005626C2 (en) | 2010-11-04 | 2010-11-04 | CARRIER FOR SEPARATED ELECTRONIC COMPONENTS AND METHOD FOR VISUAL INSPECTION OF SEPARATED ELECTRONIC COMPONENTS. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201509064PA true SG10201509064PA (en) | 2015-12-30 |
Family
ID=43734298
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013030028A SG189948A1 (en) | 2010-11-04 | 2011-11-03 | Carrier for separated electronic components and method for visual inspection of separated electronic components |
| SG10201509064PA SG10201509064PA (en) | 2010-11-04 | 2011-11-03 | Carrier for separated electronic components and method for visual inspection of separated electronic components |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013030028A SG189948A1 (en) | 2010-11-04 | 2011-11-03 | Carrier for separated electronic components and method for visual inspection of separated electronic components |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9487344B2 (en) |
| KR (1) | KR101876359B1 (en) |
| CN (1) | CN103222042B (en) |
| MY (1) | MY172957A (en) |
| NL (1) | NL2005626C2 (en) |
| SG (2) | SG189948A1 (en) |
| TW (1) | TWI548028B (en) |
| WO (1) | WO2012060703A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9048272B2 (en) * | 2008-09-25 | 2015-06-02 | Illinois Tool Works Inc. | Devices and method for handling microelectronics assemblies |
| NL2009147C2 (en) * | 2012-07-06 | 2014-01-07 | Fico Bv | DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIAL DRYING AND INSPECTION OF ELECTRONIC COMPONENTS. |
| JP6605946B2 (en) * | 2015-12-24 | 2019-11-13 | 株式会社ディスコ | Method for picking up chips from the chip storage tray |
| WO2021199359A1 (en) | 2020-03-31 | 2021-10-07 | 株式会社寺岡製作所 | Crosslinking-type adhesive agent composition and adhesive tape |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680605B2 (en) * | 1987-11-28 | 1994-10-12 | 株式会社村田製作所 | Electronic component chip holding jig and metal coating method for metallized surface of electronic component chip |
| US5337893A (en) * | 1992-07-22 | 1994-08-16 | Electro Scientific Industries, Inc. | High capacity carrier plate |
| US5546654A (en) * | 1994-08-29 | 1996-08-20 | General Electric Company | Vacuum fixture and method for fabricating electronic assemblies |
| US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
| US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
| JP2000030990A (en) * | 1998-07-16 | 2000-01-28 | Murata Mfg Co Ltd | Manufacture of chip component holding plate |
| US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
| DE10116406A1 (en) * | 2001-04-02 | 2002-10-17 | Power One Ag Uster | Device for manufacturing and testing electronic units, has bearer plate with externally contactable central electrical contact area for connecting voltage, load or signals to electronic units |
| JP2004093347A (en) * | 2002-08-30 | 2004-03-25 | Ando Electric Co Ltd | Autohandler |
| WO2004024594A1 (en) * | 2002-09-11 | 2004-03-25 | Entegris, Inc. | Carrier with tacky surfaces |
| US6926937B2 (en) * | 2002-09-11 | 2005-08-09 | Entegris, Inc. | Matrix tray with tacky surfaces |
| JP4413562B2 (en) * | 2003-09-05 | 2010-02-10 | 東京エレクトロン株式会社 | Processing system and processing method |
| JP2007003326A (en) * | 2005-06-23 | 2007-01-11 | Matsushita Electric Ind Co Ltd | Method and device for inspecting components on tray |
| JP2007182237A (en) * | 2006-01-05 | 2007-07-19 | Yamaha Corp | Storage container |
| SG136833A1 (en) * | 2006-05-02 | 2007-11-29 | Rokko Systems Pte Ltd | An improved net table |
| US20080187722A1 (en) * | 2007-02-07 | 2008-08-07 | Waldman Jaime I | Method for designing a leadless chip carrier |
| US8066470B2 (en) * | 2007-11-12 | 2011-11-29 | National Semiconductor Corporation | Waffle pack |
| NL2001642C2 (en) * | 2008-05-30 | 2009-12-01 | Fico Bv | Device and method for drying separated electronic components. |
| JP5452973B2 (en) * | 2009-04-28 | 2014-03-26 | 富士機械製造株式会社 | IMAGING DEVICE AND CUTTING MACHINE HAVING THE IMAGING DEVICE |
-
2010
- 2010-11-04 NL NL2005626A patent/NL2005626C2/en active
-
2011
- 2011-11-03 SG SG2013030028A patent/SG189948A1/en unknown
- 2011-11-03 US US13/883,381 patent/US9487344B2/en active Active
- 2011-11-03 WO PCT/NL2011/050749 patent/WO2012060703A1/en active Application Filing
- 2011-11-03 KR KR1020137014422A patent/KR101876359B1/en active IP Right Grant
- 2011-11-03 CN CN201180052032.0A patent/CN103222042B/en active Active
- 2011-11-03 SG SG10201509064PA patent/SG10201509064PA/en unknown
- 2011-11-03 MY MYPI2013001371A patent/MY172957A/en unknown
- 2011-11-03 TW TW100140057A patent/TWI548028B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103222042A (en) | 2013-07-24 |
| US20130300857A1 (en) | 2013-11-14 |
| US9487344B2 (en) | 2016-11-08 |
| TWI548028B (en) | 2016-09-01 |
| CN103222042B (en) | 2016-01-27 |
| TW201225207A (en) | 2012-06-16 |
| MY172957A (en) | 2019-12-16 |
| KR101876359B1 (en) | 2018-07-09 |
| WO2012060703A1 (en) | 2012-05-10 |
| SG189948A1 (en) | 2013-06-28 |
| KR20130140765A (en) | 2013-12-24 |
| NL2005626C2 (en) | 2012-05-07 |
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