JP5452973B2 - IMAGING DEVICE AND CUTTING MACHINE HAVING THE IMAGING DEVICE - Google Patents

Description

  The present invention relates to an image pickup apparatus that picks up images of a plurality of subjects substantially simultaneously and a cutting machine that picks up an image of a cutting tool or the like with the image pickup apparatus and detects the state of the cutting tool.

  For example, Patent Document 1 discloses a system for automatically inspecting wear or the like of a tool tip of a machine tool using a visual sensor. In this system, a slit is projected from a light projection window of a structure light unit to a chip, and a camera is photographed through the photographing window to automatically inspect wear of a tool chip.

  In Patent Document 2, a cutting tool (hereinafter also referred to as a tool) such as a cutting tool for cutting a workpiece, which is a workpiece, is imaged with a camera, and the breakage or wear of the tool is observed based on the image data. In the tool observation method, the tool is rotated or moved at least before or after machining the workpiece, and a plurality of image data is acquired, and the focused image data is selected from the plurality of image data. A tool observing method for observing breakage or wear of a tool is described.

JP-A-10-96616 JP 2001-269844 A

  The cutting tool includes an inner diameter tool and an outer diameter tool, but it is difficult to image these tools at the same position. That is, since the orientations of the tips of the inner diameter bit and the outer diameter bit are opposite to each other, the reference gauges of the inner diameter bit and the outer diameter bit that confirm that each bit is at the reference position are provided on the chuck, for example. In addition to being arranged, it is also necessary to move each byte to an imaging position where the reference gauge and the chip of the bite are stored in the imaging region of the camera and imaged (hereinafter also referred to as single vision). Therefore, problems such as a complicated mechanism for overlooking the reference gauge and the chip arise.

  On the other hand, Patent Document 1 and Patent Document 2 do not have a configuration that can cope with imaging or the like when the types of bytes are different. Moreover, since patent document 2 images using a some camera, a structure becomes complicated. In addition, even in an apparatus for inspecting or observing a tool by performing image processing on the tool tip using a camera as in Patent Document 1 and Patent Document 2, accuracy maintenance for the thermal displacement of the camera itself and the camera holding bracket is not possible. Have difficulty. That is, even if the camera is tilted slightly, the measurement error is geometrically enlarged according to the distance between the camera and the tool to be detected, and the measurement accuracy is lowered. Therefore, when the prior art of Patent Document 1 or Patent Document 2 is applied to a cutting machine, it is difficult to accurately measure the wear amount and displacement amount of the cutting tool with respect to the workpiece.

  An object of the present invention is to provide an imaging device capable of imaging subjects at different imaging positions substantially simultaneously, and a cutting machine capable of detecting the state of the cutting tool by imaging a cutting tool or the like with this imaging device.

An imaging apparatus according to the present invention includes an optical path separation unit that separates optical paths corresponding to subjects at different imaging positions in the same direction, and an imaging element disposed on the same optical path in the optical path separation unit. The optical path separation means blocks the optical path at the other imaging position when imaging the subject at one imaging position, and images the subject at the different imaging position with a time difference of optical path switching . In this case, a half mirror the imaging element side in the optical path separating means, towards after the half-mirror may be full mirror. In addition, a pair of shutters that open the optical path corresponding to the optical path separating means during imaging may be individually moved .
Further, an imaging apparatus according to the present invention includes an optical path separation unit that separates optical paths corresponding to subjects at different imaging positions, and an imaging element disposed on the same optical path in the optical path separation unit, and the optical path The separating means may block the optical path at the other imaging position when imaging the subject at one imaging position. In this case, one of the optical path separating means may be a half mirror and the other may be a full mirror. In addition, a shutter that opens the optical path corresponding to the optical path separating unit during imaging may be further provided.

Furthermore, the imaging apparatus according to the present invention may be configured such that the optical path of the half mirror is turned back to be the same as the optical path length of the full mirror. A mirror chamber that houses the imaging element and the mirror; and a shutter chamber that prevents air from flowing into the mirror chamber when the shutter is opened, and supplies air from the mirror chamber to the shutter chamber. Anyway.
Note that in the imaging apparatus according to the present invention, a plurality of imaging elements may be arranged on optical paths corresponding to subjects at different imaging positions. Moreover, you may make it the cutting machine provided with the imaging device which concerns on this invention be provided with one of the imaging devices mentioned above.

  A cutting machine provided with an imaging device according to the present invention images a subject at a different imaging position with any of the above-described imaging devices with a time difference of optical path switching. A cutting machine provided with an imaging device according to the present invention includes any one of the imaging devices described above, a reference gauge disposed on a workpiece holding chuck for measuring a position error of the imaging means, and one end of the chuck. And a reference body that is disposed so that a free end thereof corresponds to the reference gauge and serves as a reference for the amount of thermal displacement of the reference gauge, and the imaging device has one imaging position in the one optical path The free end of the reference body corresponding to the reference gauge and the free end of the reference body corresponding to the reference gauge and the cutting tool at the one imaging position as a subject are imaged in the same imaging area, or the one of the one optical path The reference gauge at the imaging position and the free end of the reference body corresponding to the reference gauge are imaged in the same imaging area as the subject and the other light The cutting tool of the other imaging position for imaging with a time difference of optical path switching in.

  Furthermore, a cutting machine provided with an imaging device according to the present invention is disposed on any one of the imaging devices described above, a reference gauge for measuring the position error of the imaging means, and a mounting base for mounting the cutting tool, and the cutting tool And a reference means for detecting the temperature of the mounting base, and the imaging device uses the reference gauge at one imaging position in the one optical path as a subject, and the other optical path. The reference means or cutting tool corresponding to the reference gauge at the other imaging position in the subject is used as a subject, and the reference gauge at the one imaging position in the one optical path is imaged and the other one in the other optical path is taken. The reference means or the cutting tool at the imaging position is imaged with an optical path switching time difference.

  In the imaging device according to the present invention or the cutting machine equipped with the imaging device, each shutter is opened and closed within a time period that is regarded as an instant (time difference of optical path switching), so there is no change in the position of each subject during imaging, and different imaging The subject at the position can be imaged in a state that can be said to be substantially one view. That is, according to the imaging device according to the present invention or the cutting machine including the imaging device, for example, 5 million pixels (short side is 17 mm and long side is 21.5 mm) without reducing the imaging region of the imaging device, for example, by division. Image size can be effectively used as it is, and image recognition is improved.

  In addition, according to the imaging device according to the present invention or the cutting machine equipped with the imaging device, it is possible to image the subject, for example, the inner diameter tool or the outer diameter tool, at different imaging positions. The type of bite, for example, an inner diameter bite or an outer shape bite or other special bite, can be imaged in a state that can be said to be practically one view. Furthermore, according to the imaging device according to the present invention or the cutting machine equipped with the imaging device, it is possible to image subjects at different imaging positions, for example, the amount of movement of the cutting tool can be reduced, and the moving mechanism of the cutting tool can be downsized. obtain.

It is a front view which shows the single axis | shaft type turret lathe of Example 1 which concerns on this invention. It is a side view which shows the principal part of the turret lathe shown in FIG. 3A and 3B are diagrams related to the imaging device shown in FIG. 2, in which FIG. 3A is an end view of the imaging device, and FIG. 3B is a plan view of the shutter. FIG. 4 is an end view showing a state in which the imaging device shown in FIG. It is a figure explaining the positional relationship when a bite or a reference gauge and an Invar body are stored in a camera field of view with the camera shown in FIG. 6 is an end view of an imaging apparatus according to Embodiment 2. FIG. FIG. 6 is a diagram relating to an imaging apparatus according to a third embodiment, where (A) is an end view of the imaging apparatus and (B) is a plan view of the shutter. 6 is an end view of an imaging apparatus according to Embodiment 4. FIG. FIG. 9 is an end view of an imaging apparatus according to Embodiment 5. 10 is an end view of an imaging apparatus according to Embodiment 6. FIG. It is a side view of a turret gauge. It is a bottom view of the turret gauge shown in FIG. It is a top view which shows the structure of the principal part of a 2-axis front lathe. It is a figure explaining the measurement base point B of the turret gauge shown in FIG. 13, and its visual field state. It is a figure explaining the measurement base point A of the turret gauge shown in FIG. 13, and its visual field state. It is a figure which shows the modification regarding a chuck | zipper. FIG. 17 is a side view of FIG. 16. It is a figure which shows the mode of an inspection of a cutting tool, (A) is a figure which shows a mode that the edge of the chip | tip is calculated | required, (B)-(D) is a figure which shows a mode that the nose of a chip | tip is calculated | required. It is a figure which shows the test | inspection mode of a cutting tool. It is a figure which shows the processing state of image recognition. It is a figure which shows the moving direction of a cutting tool.

  Hereinafter, specific Embodiments 1 to 6 will be described as modes for carrying out the present invention.

  Hereinafter, based on FIG. 1 thru | or FIG. 5, the imaging device which is Example 1 of this invention and a cutting machine provided with this imaging device are demonstrated. The cutting machine according to the first embodiment will be described as a single-axis type turret lathe (hereinafter simply referred to as a lathe) S.

(Schematic configuration of lathe S)
As shown in FIG. 1, in the lathe S, a headstock 10 fixed so that its axis line is parallel to the Z-axis direction (horizontal direction), a direction parallel to the Z-axis direction, and a direction orthogonal to the Z-axis direction. A turret device 20 that is movable in a direction parallel to the X-axis direction inclined backward by 60 degrees with respect to the vertical direction is arranged so as to face. A spindle 11 is supported on the spindle stock 10 so as to be rotatable about an axis parallel to the Z-axis direction. The main shaft 11 is rotationally driven by a main shaft drive motor (not shown). A chuck 12 that holds a workpiece W, which is a workpiece, is attached to the tip of the spindle 11 on the turret device 20 side. The headstock 10 and the spindle drive motor having such a configuration are disposed on the bed 13.

  The turret device 20 is provided with a turret tool post (hereinafter simply referred to as a tool post) 21 that is a mounting base so as to be able to rotate and index around an axis parallel to the Z-axis direction. On the tool post 21, a plurality of cutting tools 25, 26 (see FIG. 5) are attached at equal angular intervals on the circumference. The turret device 20 having such a configuration is arranged to be slidable in the X-axis direction and the Z-axis direction. The turret device 20 is moved via a ball screw mechanism (not shown) by an NC motor of an NC table (not shown). That is, the turret device 20 moves with respect to the headstock 10 that is fixedly arranged. On the other hand, the tool post 21 is rotationally driven by a turret motor (not shown).

  As shown in FIG. 1, a cover 14 that covers the headstock 10 and the turret device 20 is provided in the lathe S, and a partition wall 15 that partitions the headstock 10 side and the turret device 20 side is provided in the cover 14. ing. The partition wall 15 is mainly made of cutting powder or cutting fluid that scatters when the outer periphery or end surface of the workpiece W held by the chuck 12 by the cutting tools 25 and 26 shown in FIG. It is provided so as not to adhere to the table 10 or the like. That is, the headstock 10 side partitioned by the partition wall 15 is an isolation zone S1, and the turret device 20 side is a processing zone S2.

  The main shaft 11 protrudes from the hole provided in the partition wall 15 toward the machining zone S <b> 2, and a chuck 12 is attached to the tip of the main shaft 11. As shown in FIGS. 2 and 5, the reference gauge 18 arranged so as to slightly protrude from the outer periphery of the chuck 12 measures a position error of the imaging device 27 described later. It is commonly used for both of the machining tools 26. The reference gauge 18 is formed of heat-treated steel in order to prevent wear due to chips or the like.

  Since the reference gauge 18 has a small amount of protrusion from the outer peripheral surface of the chuck 12, the rotation range of the reference gauge 18 when the chuck 12 rotates is small. Further, since the reference gauge 18 is fixed to the chuck 12, it is easy to align the position when taking an image.

(Configuration related to imaging device 27)
As shown in FIGS. 1 and 2, an imaging device 27 is slidably disposed in the lathe S between the isolation zone S1 and the machining zone S2 (see FIG. 4). The imaging device 27 images, for example, the chips 25A and 26A shown in FIG. 5 (the cutting edge when the cutting tool is not a chip such as a cutting tool) of the cutting tools (hereinafter also referred to as cutting tools) 25 and 26 as subjects. That is, the imaging device 27 slides toward the processing zone S2 when imaging the chips 25A, 26A, and the like, and slides toward the isolation zone S1 when imaging is completed. The image data picked up by the image pickup device 27 is configured to be output to a CPU (not shown). Then, the CPU collates and calculates the displacements of the chips 25A and 26A, and corrects the machining position of the cutting tool based on the results.

As shown in FIG. 3A, the housing 27A of the imaging device 27 is partitioned into an imaging space (also referred to as a lens chamber) 28A and a dust-proof space (also referred to as a shutter chamber) 28B. Specifically, the lens chamber 28A of the rectangular tubular casing 27A includes, for example, a 5 million pixel camera (including a CCD 30A as an image sensor) 30, an imaging lens body 29, a full mirror 31A, and a half mirror 31B. And are stored.
The half mirror 31B is disposed between the imaging lens body 29 and the full mirror 31A, and is a mirror that partially reflects and drops a part of incident subject light. The half mirror 31B (also referred to as a beam splitter) includes a flat plate type, a prism type, a wedge substrate type, or the like.

  The full mirror 31A and the half mirror 31B described above are arranged so that the fields of view of the respective imaging optical systems have the same size. That is, the full mirror 31A and the half mirror 31B are provided so that each subject can be alternately imaged. For example, when the subject (chip) 23A indicated by the two-dot chain line in FIG. 3A is imaged with the full mirror 31A, the optical path of the half mirror 31B is blocked, and when the subject (chip) 24A is imaged with the half mirror 31B. The optical path of the full mirror 31A is configured to be blocked.

  Accordingly, the optical path between the imaging lens body 29 of the camera 30 and two subjects (for example, bytes 23, 24, etc.) is bent at a right angle by the pair of mirrors 31A and 31B, respectively, so that one visual field region (synonymous with imaging region). The subject is imaged within the range of. Then, as shown in FIG. 3, for example, the chip 23A of the bite 23 is first imaged in one visual field area, and the chip 24A of the bite 24 is continuously imaged in one visual field area after the above imaging. The field of view has a short side of 17 mm (2000 pixels) and a long side of 21.5 mm (2500 pixels) when a 5 million pixel camera is used.

  Between the lens chamber 28A and the shutter chamber 28B, the focusing lens 33 is disposed on the optical path corresponding to the full mirror 31A, and the transparent protective glass 34 is disposed on the optical path corresponding to the half mirror 31B. Here, the focusing lens 33 adjusts two series of focal lengths LA (for example, 100 mm). Note that the imaging space is always maintained at a predetermined atmospheric pressure, for example, +0.5 atmospheric pressure.

  A hole 27B is formed between the lens chamber 28A and the shutter chamber 28B, and compressed air (hereinafter also referred to as air) is sent from the hole 27B to the shutter chamber 28B. That is, the shutter chamber 28B is always pressurized to a pressure state lower than that of the lens chamber 28A, for example, +0.11 MPa. Therefore, since the shutter chamber 28B is pressurized, it prevents the coolant liquid or chips from flowing into the shutter chamber 28B. In addition, an air connection port (not shown) is arranged in the lens chamber 28A, and an air passage for supplying air generated by the compressor is provided between the air connection port and the compressor (not shown). Then, air is continuously blown out to the lens chamber 28A from before the shutter 38 or 39, which will be described later, is opened until the closing is completed.

  Openings 27C and 27D are formed in portions of the shutter chamber 28B facing the focusing lens 33 and the protective glass 34, respectively. Shutters 38 and 39 as switching means are slidably disposed between the casing 27A and the support piece 27E, and open or close the opening 27C or 27D. That is, the shutter 38 or 39 that blocks the optical path described above is configured to slide using the air in the air passage described above. Further, openings 27F and 27G are formed in the support piece 27E so as to face the openings 27C and 27D.

  As shown in FIG. 3B, the planar shape of the shutter 38 is a strip shape, and the planar shape of the shutter 39 is a substantially L-shape. The shutters 38 and 39 move so as to face the openings 27G and 27F, and open and close the openings 27C and 27D.

  That is, the shutters 38 and 39 open the respective optical paths, and the camera 30 captures an image of the tip 24A (indicated by a two-dot chain line in the drawing) of the cutting tool 24 that is the subject shown in FIG. The shutters 38 and 39 are closed to prevent coolant liquid or chips from flowing into the shutter chamber 28B. The shutters 38 and 39 are always closed and do not open the optical path at the same time. As the shutter, for example, a liquid crystal shutter that opens and closes by switching on / off of a voltage or an optical path switching mechanism may be applied.

  As shown in FIGS. 1 and 2, illumination light sources 43 and 44 are arranged at positions on the optical path opposite to the mirrors 31 </ b> A and 31 </ b> B (see FIG. 3) of the imaging device 27, respectively. These light sources 43 and 44 are comprised by light emitting LED etc., for example.

(Schematic configuration regarding the slide mechanism of the imaging device 27)
As shown in FIGS. 1 and 4, the imaging device 27 is disposed at a predetermined location of the partition wall 15 and is connected to a slide mechanism (not shown) (for example, a cylinder that is operated by air in an air passage). Therefore, as described above, the imaging device 27 slides between the isolation zone S1 and the processing zone S2, and retracts from the processing zone S2 to the isolation zone S1 immediately before the cutting process. The reason for retracting the imaging device 27 is to prevent interference with a cutting tool or the like mounted on the cutting turret device 20 and to improve the workability of the imaging device 27 by avoiding the visual disturbance of the operator during the cutting operation. It is.

  As shown in FIG. 4, a synthetic resin (for example, urethane rubber) seal cover 40 is disposed between the imaging device 27 and the partition wall 15. That is, the imaging device 27 is held in a state of being fitted into the seal cover 40. The seal cover 40 prevents the image pickup device 27 during the slide from pinching chips in the processing zone and prevents the coolant from seeping into the isolation zone S1.

  In addition, a guide port 40 </ b> A that surrounds the imaging device 27 is opened. Then, air is sent out from an air passage (not shown) to the guide port 40A (see the arrow in FIG. 4), and the air is blown out from the gap between the imaging device 27 and the seal cover 40 (see the thick arrow in FIG. 4). .

  Note that, at the position where the imaging device 27 is retracted to the isolation zone S <b> 1 (the standby position indicated by the solid line in FIG. 4), the tip of the imaging device 27 (the portion facing the seal cover 40) is slightly processed zone from the seal cover 40. It is set in advance so that it protrudes to S2 or is flush with the surface.

(Schematic configuration regarding chuck)
As shown in FIG. 5, an invar body 47, which is a reference body, is disposed on the outer peripheral side of the chuck 12 so as to face the reference gauge 18 described above. In other words, the tip 47A of the invar body 47, the reference gauge 18 and the tip 26A of the bit 26 are housed in the field of view of the image pickup device 27 and can be imaged (synonymous with a single view). 26 is arranged. It should be noted that the byte 26 moves to a predetermined position in the one-view A area (referred to as “A frame” in the figure) or the one-view B area (referred to as “B frame” in the figure) of the image pickup device 27 when detecting the chip. Is set in advance.

  The invar body 47 is formed in, for example, a prismatic shape using a material (for example, invar which is invariable steel) having a smaller thermal expansion coefficient than the heat-treated steel constituting the lathe S (see FIG. 1). The invar body 47 has one end fixed by a fastening member (such as a bolt) not shown. Therefore, a stopper (not shown) for preventing popping out is arranged on the free end side of the invar body 47 in a state slightly separated from the invar body 47. The counterweight 72 for preventing vibration is arranged on the opposite side of the place where the invar body 47 is arranged.

(Operation of this embodiment)
At the time of chip detection, as shown in FIG. 5, when the reference gauge 18 and the chip 25A or 26A of the cutting tool 25 or 26 are stored in the field of view of the camera 30, the cutting edge of the reference gauge 18 and the cutting tool 25 or 26 is used. The height of the upper surface of 25A or 26A is set to the same height.

  At the time of chip detection, as shown in FIG. 4, the imaging device 27 is slid from the isolation zone S1 to the processing zone S2, and the light sources 43 and 44 shown in FIG. When detecting the chip 26A of the cutting tool 26 shown in FIG. 5, the image pickup device 27 at the image pickup position (state shown by the broken line in FIG. 4) slides the shutter 38 as shown in FIG. Open the light path. The camera 30 images the tip 47 </ b> A of the invar body 47, the reference gauge 18, and the tip 26 </ b> A of the bite 26, which are subjects located in the one-view vision A area. In other words, since the optical path on the shutter 39 side is blocked, the half mirror 31B reflects the subject light in the single vision A area to the camera 30.

  On the other hand, when the chip 25A of the cutting tool 25 shown in FIG. 5 is detected (in this case, the cutting tool 26 is not in the first viewing A area), as shown in FIG. 3, first, the shutter 38 is slid to change the optical path on the half mirror 31B side. Open. The camera 30 images the tip 47A of the invar body 47 and the reference gauge 18 which are subjects located in the one-view vision A area. In other words, since the optical path on the shutter 39 side is blocked, the half mirror 31B reflects the subject light in the single vision A area to the camera 30.

  Immediately after imaging, the shutter 38 is closed and the shutter 39 is slid to open the optical path on the full mirror 31A side. The shutters 38 and 39 are switched at a time difference (synonymous with substantially the same time), for example, 0.5 seconds. Further, in order to reduce the impact when the shutter 38 or 39 is opened or closed, the load on the shutters 38 and 39 is reduced and the shutter 38 or 39 is driven by air or the like.

  Then, as shown in FIG. 5, the camera 30 captures an image of the chip 25 </ b> A of the bite 25 that is a subject located in the single vision B area. That is, since the optical path on the shutter 38 side is blocked, the full mirror 31A reflects the subject light in the first-view B area to the camera 30. At this time, since the half mirror 31B transmits the subject light reflected by the full mirror 31A, the camera 30 captures an image of only the subject in the single vision B area.

  In the present embodiment, the shutter 38 or 39 is opened and closed within the time that is regarded as the moment (the optical path switching time difference), so that there is no change in the position of the subject at the time of imaging, and the tip 47A of the invar body 47, the reference gauge 18 and the bit 25 The chip 25 </ b> A can be imaged in a state that can be said to be substantially one vision. That is, according to the present embodiment, for example, 5 million pixels (the short side is 17 mm and the long side is 21.5 mm) without reducing the imaging region (synonymous with the image recognition region) of the camera 30 by dividing, for example. Can be effectively used as it is, and image recognition is improved.

  Further, according to the present embodiment, since the one vision B area and the one vision A area of the camera 30 can be separated by a predetermined distance LA (see FIGS. 3 and 5), for example, a reference gauge for an inner diameter tool is provided separately. Therefore, it is possible to pick up an image of a bit type, for example, an inner diameter bit or an outer shape bit or other special bite in a state that can be regarded as one view. Furthermore, according to the present embodiment, since the one-view vision B area and the one-view vision A area are separated from each other by a predetermined distance LA (for example, 100 mm), for example, interference of the inner diameter tool 25 can be prevented.

  When cutting, first, air is sent from an air passage (not shown) to the guide port 40A of the seal cover 40 shown in FIG. 4, and then the imaging device 27 is slid to the isolation zone S1 (see the solid line in FIG. 4). That is, as shown in FIG. 4, immediately before the imaging device 27 returns to the standby position, air blows out from the gap between the imaging device 27 and the seal cover 40, so that the coolant or chips in the processing zone S2 are isolated. Intake into the zone S1 can be prevented. Further, after the imaging device 27 returns to the standby position, the air sending from the air passage to the guide port 40A of the seal cover 40 is stopped.

  Note that the edges of the chips 25A and 26A shown in FIG. 5 can be obtained using, for example, a seek line. The seek line is a line segment having a free length and inclination set in the two-dimensional virtual screen, and obtains the position of the edge with respect to the center position in the line direction.

  A second embodiment of the imaging apparatus according to the present invention will be described with reference to FIG. However, substantially the same parts as those of the image pickup apparatus 27 shown in FIG. 3 of the first embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described.

  As shown in FIG. 6, the second embodiment is an example in which the optical path is turned back so as to be equal to the optical path length of the full mirror with respect to the half mirror. That is, the present embodiment is an example of avoiding, for example, that the other screen size is larger or smaller than the one screen size when the optical path lengths are different.

  Specifically, the half mirror 31B is disposed closer to the full mirror 31A with a half distance (for example, 50 mm) of a predetermined distance LA between the single vision B area and the single vision A area (see FIG. 5). A pair of folding full mirrors (hereinafter also simply referred to as “folding mirrors”) 78 and 79 are arranged in parallel so as to be inclined in the same direction, and guide incident subject light to the half mirror 31B. That is, the folding mirror 78 folds the optical path on the protective glass 34 side to the mirror 79 and guides it to the half mirror 31B. Therefore, the folding mirror 79 is disposed so as to face the half mirror 31B.

  Since the optical path lengths of both the half mirror 31B and the full mirror 31A are the same, the protective glass 35 is disposed on the shutter chamber 28B instead of the focusing lens on the optical path on the full mirror 31A side. Further, the shutter chamber 28B of the present embodiment is disposed outside the housing 27A. In the shutter chamber 28B, optical path holes 80A and 80B are formed so as to correspond to the folding mirror 78 and the full mirror 31A.

  The pair of shutters 38 and 39 for switching the optical path has a shorter length in the longitudinal direction than in the first embodiment. Here, the shutters 38 and 39 are individually operated only at the time of imaging in order to enhance the dustproof effect by closing the hole 80A or 80B of the shutter chamber 28B except at the time of imaging.

  In this embodiment, since the folding mirrors 78 and 79 are interposed in front of the half mirror 31B, the optical path length of the full mirror 31A is the same as that of the half mirror 31B. That is, according to the present embodiment, since the optical path lengths of both the half mirror 31B and the full mirror 31A are the same, a focusing lens for correcting the focus is not necessary.

  Also, as compared to the case where the optical path lengths are different (that is, the respective screen sizes are different), in this embodiment, it is not necessary to make the screen sizes the same, so that the software is simplified. That is, according to the present embodiment, the pixel sizes of the single vision B area and the single vision A area shown in FIG. 5 are the same, so that image processing using an algorithm is simplified. Other configurations and operational effects are the same as those of the first embodiment.

  Note that if the light source 43 or 44 shown in FIG. 1 is switched on and off separately, it is not necessary to switch the shutter during imaging. In this case, one shutter can be used.

  Embodiment 3 of the image pickup apparatus according to the present invention will be described with reference to FIG. However, substantially the same parts as those of the image pickup apparatus 27 shown in FIG. 3 of the first embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described. In the third embodiment, as shown in FIG. 7A, the pair of mirrors is made into full mirrors 31A and 32, and the full mirror 32 near the camera 30 is rotatable.

  Specifically, the rotation device 81 is connected to the full mirror 32 near the camera 30. Then, when imaging the subject on the full mirror 31A side (one-view vision B area), the full mirror 32 is rotated through the rotating device 81 so as to be in the retracted position indicated by a two-dot chain line, and the light from the full mirror 31A and the camera 30 is obtained. Evacuate from the street.

  On the other hand, when the subject on the full mirror 32 side (one viewing A area) is imaged, the full mirror 32 is rotated via the rotating device 81 so that the imaging position is at a predetermined angle indicated by the solid line, and the subject in the one viewing A area is selected. Take an image. In this case, the subject light from the full mirror 31A is blocked by the full mirror 32 and is not imaged.

  In this example, a stopper (not shown) is arranged so that the full mirror 32 can be temporarily stopped at the imaging position and the retracted position, respectively. Further, the full mirror 32 may be stopped at a predetermined angle such as a stepping motor as a driving means of the rotating device.

  In the present embodiment, since the full mirror 32 is rotatably arranged, the optical path is switched to each. That is, according to the present embodiment, since the optical paths are respectively switched by the rotation of the full mirror 32, a single shutter 82 can be obtained.

  Therefore, as shown in FIG. 7B, one shutter 82 has a rectangular hole 82 </ b> A formed in a portion corresponding to the full mirror 32. That is, the shutter 82 is not a means for switching the optical path, but merely prevents the coolant liquid or chips from entering the shutter chamber 28B. Other configurations and operational effects are the same as those of the first embodiment.

  Embodiment 4 of the image pickup apparatus according to the present invention will be described with reference to FIG. However, substantially the same parts as those of the image pickup apparatus 27 shown in FIG. 6 of the second embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described. Example 4 is an example in which Examples 2 and 3 are combined as shown in FIG.

  Specifically, the pair of mirrors is made into full mirrors 31A and 32, the full mirror 32 near the camera 30 is rotatable, and the optical path is turned back with respect to the full mirror 32 near the camera 30 so as to be the same as the optical path length of the full mirror 31A. It has a configuration.

  Therefore, according to the present embodiment, since the optical path lengths of both the full mirrors 32 and 31A are the same, a focusing lens for correcting the focus becomes unnecessary. Further, according to the present embodiment, the pixel sizes of the single vision B area and the single vision A area shown in FIG. 5 are the same, so that the image processing using the algorithm is simplified. Furthermore, according to the present embodiment, since the optical paths are respectively switched by the rotation of the full mirror 32, a single shutter 82 can be obtained.

  Embodiment 5 of the imaging apparatus according to the present invention will be described with reference to FIG. However, substantially the same parts as those of the image pickup apparatus 27 shown in FIG. 3 of the first embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described. In the fifth embodiment, as shown in FIG. 9, a pair of cameras are arranged on optical paths respectively corresponding to subjects at different imaging positions.

  Specifically, the cameras 30 and 84 and the imaging lens bodies 29 and 83 are arranged in parallel. The pair of full mirrors 31A and 32 corresponding to the cameras 30 and 84 are arranged so as to face the openings 27F and 27G, respectively. Then, the camera (including the CCD 84 </ b> A that is an image sensor) 84 images the subject in the single-view vision A area by the optical path of the imaging lens body 83 and the full mirror 32. On the other hand, the camera 30 captures an image of a subject in the single vision B area by the optical path of the imaging lens body 29 and the full mirror 31A.

  Here, in this embodiment, since the pair of cameras 30 and 84 are provided, a focusing lens is not necessary, and the protective glass 35 can be obtained. That is, in this embodiment, the cameras 30 and 84 are focused. According to the present embodiment, since it is configured to be able to image in two series of optical paths, it is possible to simultaneously image subjects in the single vision A area and the single vision B area.

  In this example, the shutters 38 and 39 are a pair, but one shutter may be used. Further, if the rigidity of the cameras 30 and 34 is increased and the first vision A area and the first vision B area are imaged at the same time, it is equivalent to one vision of the first vision A area and the first vision B area. .

  Embodiment 5 of the imaging apparatus according to the present invention will be described with reference to FIG. However, substantially the same parts as those of the image pickup apparatus 27 shown in FIG. 9 of the fifth embodiment are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described. Example 6 is an example in which a pair of cameras are arranged in different directions, for example, 90 degrees, as shown in FIG.

  Specifically, the pair of cameras 30 and 84 and the imaging lens bodies 29 and 83 are fixed to both ends of a support body 85 having a substantially L-shaped planar shape. That is, the camera 30 and the imaging lens body 29 are connected to the end portion 85A of the support body 85 in a horizontal state. Then, the camera 30 bends the optical path between the subject (for example, the bite 24) at a right angle by the mirror 31A and images the subject within the range of one visual field region (one-view vision A area).

  On the other hand, the camera 84 and the imaging lens body 83 are coupled to the end portion 85B of the support body 85 in a vertical state. The camera 84 (including the imaging lens body 83) is arranged so that the optical path of one subject (for example, the bite 23) is in a straight line, and images the subject within the range of one field of view area (one viewing field B area). . In this embodiment, the optical path length from the subject to the imaging lens body is set in advance so as to be the same.

  In FIG. 10, a configuration such as a shutter is omitted. Also, if the rigidity of the cameras 30 and 84 and the support body 85 is increased and the support body 85 is made of Invar, there is no relative change due to the temperature of the cameras 30 and 84, and the one-view vision A area and the first view. If the view B area is imaged at the same time, it is equivalent to viewing the first view A area and the first view B area one view.

(Configuration of 2-axis front lathe)
Here, with reference to FIGS. 11 to 15, subjects other than the tool arranged on the tool post 21 (see FIG. 13), the reference gauge 18 arranged on the chuck 12 and the invar body 47 (specifically, the turret gauge). 46) will be described.

  That is, the turret gauge 46 shown in FIGS. 11 and 12 is an example applied to the biaxial front lathe shown in FIG. Specifically, the two main shafts 11 are provided on the left and right sides so as to extend horizontally and in parallel, and a work holding chuck 12 is provided at the front end of each main shaft 11. The tool post 21 is disposed in parallel with the axis of each spindle 11 at the left and right positions of the left and right spindles 11. Each tool post 21 is configured to be movable in the front-rear direction by the driving device 19 and rotatable about the axis of the tool post 21. Various cutting tools (for example, a cutting tool 25 for inner diameter processing, a cutting tool 26 for outer diameter processing, etc.) are held on the outer peripheral portion of each tool post 21, and by rotating each tool post 21, it is possible to cut a workpiece. The byte to be used is selected.

(Configuration of turret gauge 46)
The turret gauge 40 which is a reference means is a gauge for measuring the degree of thermal expansion / contraction with a lathe body including a lathe tool post. As shown in FIG. 13, the turret gauge 46 is configured to be attached to a predetermined position (one of the cutting tool mounting positions) of the tool post 21.

  The turret gauge 46 includes an invar body 47 that is a reference body, and a gauge body 48 that is an object to be measured and attachment means. The invar body 47 is formed in, for example, a prismatic shape using a material (for example, invar which is invariable steel) having a smaller thermal expansion coefficient than the heat-treated steel constituting the lathe shown in FIG. Note that it is sufficient that there is a difference in thermal expansion coefficient between the material to be measured and the reference body, and it is desirable that the difference is particularly remarkable as much as possible.

  Usually, since the object to be measured uses steel, which is a structure of a machine tool (synonymous with a cutting machine), the reference body uses invar having a very low thermal expansion coefficient or twice the thermal expansion coefficient of steel. Aluminum alloy or triple magnesium alloy may be used. On the other hand, the gauge body 48 is formed in a substantially right triangle shape using heat-treated steel which is the same material as the tool post 21 shown in FIG.

  As shown in FIG. 11, the gauge body 48 is formed with a hole 48 </ b> A for inserting the invar body 47. The hole 48A is slightly larger than the thickness of the invar body 47, and a gap is formed so that the invar body 47 does not interfere with the wall constituting the hole 48A. As shown in FIG. 11, the invar body 47 is fixed to the gauge body 48 by a stopper 49 </ b> B that is a fastening means at one end. The stopper 49B is embedded in the turret gauge 45 so that the stopper 49B is flush with the turret gauge 46.

  The invar body 47 has a predetermined distance L1 from the fixed end, which is one end thereof, to the oblique tip 47A that is the free end. When the invar body 47 is attached to the gauge body 48, the invar body 47 is supported by the gauge body 48 at only one point, and the other is free. The reason for this is that if the invar body 47 is fixed at two or more points, a bimetal effect is generated due to the difference in thermal expansion coefficient between the invar body 47 and the gauge body 48, which causes deformation. Because.

  As shown in FIG. 11, the gauge main body 48 is formed with right-angled edges, and the two edges are point A and point B (measurement base points), which are measurement base points in the X direction and the Z direction, respectively. . Here, the distance between the edges in the X direction at the points A and B is set to the reference dimension LX in the X direction, and the distance between the edges in the Z direction is set to the reference dimension LZ in the Z direction.

  The invar body 47 has a thermal expansion coefficient of about 1/10 that of steel, and when the temperature of the turret gauge 46 changes by 1 ° C., the difference between the point A of the gauge body 48 and the tip 47A of the invar body 47 is 1.8 μm. Become. Since the CPU (not shown) detects the lengths of the reference dimensions LX and LZ based on the image data at the predetermined dimensions at the predetermined temperature, the accuracy of the gauge body 48 may vary to some extent.

  Here, the predetermined temperature is a predetermined temperature (20 to 22 degrees which is a normal environmental temperature) designated for detecting and measuring the dimension of the turret gauge 46 and the like, and the predetermined dimension is the turret gauge 46 at the predetermined temperature. And so on. At the initial setting of the machine, the temperature of the gauge body 48 is measured, and the distance between the points A and B of the gauge body 48 is acquired within 1 μm.

  This acquisition method is performed by performing image processing on points A and B of the gauge body 48 and the reference gauge 18 in the same imaging region. A parallelism measurement reference surface 48B is formed on the gauge body 48, and the turret gauge 46 is positioned in parallel with the tool post 21 using the parallelism measurement reference surface 48B.

  For example, when imaging with the imaging device 27 shown in FIG. 6, as shown in FIG. 14, the reference gauge 18 fixed to the chuck 12 is imaged in the first-view B area, and the point A of the gauge body 48 and the invar body 47. The tip 47A (or bite 26) is imaged in the first-view A area. On the other hand, as shown in FIG. 15, the reference gauge 18 fixed to the chuck 12 is imaged in the single vision B area, and the gauge body 48 (or bite 26) is imaged in the single vision A area. 14 and 15 correspond to ranges in the one-viewing vision A area and the one-viewing vision B area of the imaging device 27 shown in FIG.

(Modifications related to chuck)
Hereinafter, modifications related to the chuck will be described. However, substantially the same parts as those in the configuration of the chuck 12 shown in FIG. 5 of the first embodiment described above are denoted by the same reference numerals, description thereof is omitted or simplified, and different parts are mainly described.

  As shown in FIGS. 16 and 17, the tip of the chuck 17 is a small diameter portion 17 </ b> A. The chuck 17 is formed with a notch 17B (see FIG. 17) along the axial direction of the chuck 17. As shown in FIG. 16, the notch 17 </ b> B is formed from the outer periphery of the small diameter portion 17 </ b> A to the large diameter base end portion (this portion becomes a “through hole”).

  The cylindrical invar body 86 is fixed at the proximal end portion of the chuck 17 by a bolt 49A which is a fastening member at one end. The tip 86A of the invar body 86 has a semicircular shape as shown in FIG.

  That is, as shown in FIG. 16, the tip 86A of the invar body 86, the reference gauge 18, and the tip 26A of the bit 26 are housed in, for example, the visual field region (one-viewer A area) of the imaging device 27 shown in FIG. . In the chuck 17 shown in FIG. 16, even if the length of the invar body 86 is long, it can be arranged through the through hole of the chuck 17, so that the long invar body 86 can be mounted on a collet chuck, for example. . Further, since the through hole of the invar body 86 is formed in the chuck 17, a counterweight can be eliminated.

  Further, in the first to sixth embodiments, the imaging device 27 may be configured to be rotatable so that the single vision A area and the single vision B area can be arbitrarily changed in a horizontal direction or a vertical direction.

(Image recognition processing method)
The image recognition processing method for a cutting tool according to the present embodiment will be described in detail with reference to FIGS. Here, in the above-mentioned 5 million pixel camera 30 (see FIG. 3), the positioning recognition accuracy of the chip edge and the like described with reference to FIG. 18A is ± 0.25 μm (= 1/34 pixel). Image recognition can be performed, and image recognition can be performed with an accuracy of ± 0.45 μm (= 1/19 pixel) for the cutting line Lcm or Lbm described with reference to FIGS.

  In other words, even with an optical system camera with 5 million pixels (actual size per pixel is 8.6 μm), the recognition accuracy of recent image processing technology has been improved, so that it is possible to fully recognize chip breakage and wear. In addition, the temperature of the gauge body 48 can be measured in units of 1 ° C. Note that the solid line partial frame in FIG. 18 is an imaging region showing the chip 26A (including the case of 25A), and is a comprehensive detection area used when the chip 26A is detected as a whole. The two-dot chain line partial frame in FIG. 18 is a blade edge detection area used when detecting the tip of the tip 26A.

  First, the detection method of the chip 26A is performed as follows. As shown in FIG. 18A, the edge of the chip 26A is obtained by setting a plurality of seek lines La. The edges of the chip 26A before and after use are obtained and pattern matching is performed. If the positions of the edges differ below a threshold value, it is determined that the chip 26A is broken. On the other hand, when the positions of the edges are different from each other by a threshold value or more, it is determined that the chips 26A are inflated (also referred to as a component cutting edge) by welding chips. Note that the threshold value has a width of 20 μm, for example, and the width can be arbitrarily changed.

  The tip nose can also be determined using the seek line. First, as shown in FIG. 18B, a plurality of seek lines Lb directed downward are set at predetermined intervals, and a seek line Lbm having a maximum luminance value (a point changing from dark to bright) is the lowest point. The X direction cutting line is obtained. Similarly, as shown in FIG. 18C, a plurality of seek lines Lc directed to the left are set at predetermined intervals, and a seek line in which the maximum value of luminance (a point changing from dark to bright) is the leftmost point. Lcm is calculated | required and it is set as a Z direction cutting line. Next, as shown in FIG. 18D, a distance Rz between the X direction cutting line Lbm and a line Lbp parallel to the X direction cutting line Lbm and passing through the edge Ec of the Z direction cutting line Lcm is obtained. Similarly, a distance Rx between the Z direction cutting line Lcm and a line Lcp parallel to the Z direction cutting line Lcm and passing through the edge Eb of the X direction cutting line Lbm is obtained. The larger of the distance Rz and the distance Rx is set as the nose. If the nose of the tip 26A after use is greater than the set value than the nose of the tip 26A before use, it is determined that the tip 26A is worn.

  That is, in the imaging device 27 of the first to sixth embodiments, the reference gauge 18 for measuring the position error of the imaging device 27, the tip 47A of the invar body 47 adjacent to the reference gauge 18, and the tips 26A (see FIG. 5 or 16) with the camera 30 or 84 in the same field of view, and the chip 26A is processed after the chip 26A, the reference gauge 18 and the tip 47A of the invar body 47 are in the reference position. The state can be accurately detected.

(Technical field)
This technical field relates to an image recognition processing method for recognizing an object such as a cutting tool and an image recognition processing method for a cutting tool.

(Background technology)
In Patent Document 1 described above, a program for performing image processing and analysis using an image processor is stored in the program memory 65 (see paragraph number “0052”). An image (11 frames) corresponding to 11 bright lines is acquired by successive projection and photographing (see paragraph number “0072”, FIG. 11 and FIG. 13). Note that, as described above, Patent Document 2 discloses that a plurality of image data is acquired by rotating or moving a tool at least before or after a workpiece is processed, and the plurality of image data is in focus. The selected image data is selectively used.

(Issue to solve)
In Patent Document 1 and Patent Document 2, the byte position recognition accuracy when performing image recognition processing is not improved. That is, in Patent Document 1 or Patent Document 2, it is difficult to accurately recognize an image such as the wear amount and displacement amount of a cutting tool.

  On the other hand, in the 5 million pixel camera, the X-direction cutting line or the Z-direction cutting line described above obtains an important position that is a tangent to the contour curve (tip tip curve) of the bite, and therefore the position recognition accuracy is important. In the so-called multi-step pattern matching (hereinafter referred to as “MS”) algorithm, even if the position recognition accuracy of one seek line is low, the overall averaged accuracy increases as the seek line data increases.

  The following content is to provide an image recognition processing method and an image recognition processing method for a cutting tool that improve the position recognition accuracy when an object such as a cutting tool is recognized.

  As the image recognition processing method, at least one of the subject or the imaging means is relatively moved, and the amount of movement is set to a value smaller than the pixel (for example, an integer 1 / N of the pixel pitch). At the same time, the second average value calculated N times with an integer (N) of the pixel pitch is used as the position data of the subject. Then, the standard deviation of the recognition value over a plurality of times is calculated, the standard deviation is multiplied by a coefficient, and the multiplication value is added to or subtracted from the second average value. The tool edge position data is used.

  Note that the above description is a cutting machine using a numerical control system, and an image of a cutting tool is captured and processed using an imaging unit before and after cutting, and the state of the cutting tool (defect / expansion / This is applied to an image recognition processing method for detecting the amount of thermal displacement of the above-mentioned cutting machine. Then, the processing position of the cutting tool is corrected based on the subject, for example, the position data of the cutting tool or the edge position data.

(Cut line position data acquisition method)
Hereinafter, an image recognition processing method for a cutting tool will be described with reference to FIGS. In the cutting line position data acquisition method, the cutting tool 26 shown in FIG. 5 is moved in the Z direction by 1 μm, for example, eight times, each image is taken, and the Z direction cutting line position data is acquired by the following method.

  First, a cutting line position vector (a set of Z position and X position) is calculated at the position of the cutting tool 26. Next, the pitch of the seek line is set every 1 μm, and the edge position (the intersection position of the seek line and the chip outline) is selected to have the maximum value (or may be the minimum value). In order to increase accuracy, the maximum value is set as the center (the position of the Z-direction cutting line in FIG. 19), and the average value (ave) at the edge positions of 25 seek lines in the vertical direction (or left and right) and Calculate the standard deviation (σ). In this case, the total number of seek lines is 51.

As shown in FIG. 19, when the tip 26A protrudes in the minus direction in the Z direction (or X direction), the cutting line position (Cp) expression in the Z direction can be calculated by the following expression.
Cp = ave−1.1σ

  Here, when the tip 26A protrudes in the plus direction in the Z direction (or X direction), it is necessary to change the-symbol in the above formula to a + symbol. The coefficient 1.1 in the above equation is a numerical value calculated from experimental values. Further, the position of the cutting line in the X direction is also calculated according to the procedure described above. Then, the accumulated value of the movement amount of the bytes is subtracted from each calculated Cp value. Finally, the second average value in the eight data is calculated, and the position vector obtained from the second average value is calculated.

  Note that the pitch for moving the byte is measured N times by an integer (N) of the pixel pitch. For example, when one side of a pixel (synonymous with a pixel) is 8 μm, data is acquired 8 times at a rate of 1/8 pixel, that is, every 1 μm, and position data as the second average value is recorded. That is, since each pixel is moved by 1 / N, different image data can be acquired, and the image recognition accuracy is improved. The byte may be moved, for example, by 1/4 pixel or 1/2 pixel.

  Here, the reason why the pixel pitch is moved by an integer (N) is as follows. When the image data is acquired using a value smaller than the pixel (for example, an integer fraction of the pixel pitch) as the movement amount, it can be acquired as a separate image under the influence of nonlinearity due to the pixel described later. As an experimental result, in one pixel (8.4 μm square), the recognition accuracy was improved to 2 μm in one image data acquisition, and the recognition accuracy was improved to 0.4 μm in eight image data acquisitions.

  Note that when at least one of a subject, for example, a byte or a camera, is relatively moved to acquire a plurality of times of image data, if the amount of movement is the same or an integer multiple of the pixel size, the theoretically the same image data is obtained. Since the data is acquired, the data amount does not substantially increase. This is the same as the case where the same image data is acquired a plurality of times without moving the subject or the like. That is, in these cases, it is a wasteful work.

(Influence of non-linearity by pixels)
As shown in FIG. 20, the light receiving portion of the pixel has a substantially L shape, for example, different from the outer shape, and the image data also changes as the amount of light received by the light receiving portion changes. Here, if the subject indicated by the solid line is moved to the position of the two-dot chain line, the received light amounts of the image 1 and the pixel 2 do not change. On the other hand, since the subject is moving on the light receiving part area on the L-shape, which is limited to a region smaller than the pixel, the amount of received light changes more than the original ratio. That is, the change in the amount of light received by each pixel with respect to the movement of the subject is nonlinear. Therefore, if the pixel pitch is moved by an integer, different image data can be acquired, and the image recognition accuracy is improved.

  In addition, although it is a figure moved to a Z direction in FIG. 20, it moves also to a X direction and acquires the position data of a X direction cutting line. Further, as shown in FIG. 21, it may be moved obliquely in the Z direction and the X direction by 1 μm. Further, the position data may be acquired by using M (integer offset amount μm) +1 pixel as a subject movement amount. For example, 1 + 8 = 9 μm, 2 + 16 = 18 μm, 3 + 24 = 25 μm, 4 + 32 = 36 μm, etc.

  Note that the present invention is not limited to the short-axis lathe and the 2-axis front lathe described in the first to sixth embodiments, but various cutting machines such as a milling machine (machines that move a cutting tool and a workpiece relatively). Applicable to.

  DESCRIPTION OF SYMBOLS 12 ... Chuck, 18 ... Standard gauge, 21 ... Turret tool post (mounting base), 25 ... Inner diameter machining tool, 25A ... Cutting edge, 26 ... Outer diameter machining tool, 26A ... Cutting edge, 27 ... Imaging device (Imaging) Means), 30 ... camera, 38, 39 ... shutter (switching means), 46 ... turret gauge (measuring means), 47, 86 ... invar body (reference body), 47A, 86A ... tip of the invar body, 48 ... gauge body (Measurement object, mounting means), 78, 79 ... Full mirror for turning (turning mirror means), S ... Lathe (cutting machine), W ... Workpiece

Claims (8)

An optical path separating unit that separates optical paths respectively corresponding to subjects at different imaging positions in the same direction, and an image sensor disposed on the same optical path in the optical path separating unit,
The optical path separation means blocks the optical path at the other imaging position when imaging the subject at one imaging position, and images the subject at the different imaging position with a time difference of optical path switching. An imaging device.   The imaging apparatus according to claim 1, wherein the imaging element side of the optical path separating unit is a half mirror, and a rear side of the half mirror is a full mirror.   3. The imaging apparatus according to claim 1, wherein a pair of shutters that open the optical path corresponding to the optical path separating unit during imaging are individually moved.   4. The imaging apparatus according to claim 2, wherein the optical path is turned back to the half mirror so as to be equal to the optical path length of the full mirror.   5. The imaging device according to claim 3, further comprising: a mirror chamber that houses the imaging element and the mirror; and a shutter chamber that prevents air from flowing into the mirror chamber when the shutter is opened. An image pickup apparatus for supplying air to the shutter chamber.   A cutting machine provided with the imaging device according to claim 1. 6. The imaging device according to claim 1, a reference gauge disposed on a workpiece holding chuck for measuring a position error of the imaging means, one end fixed to the chuck, and a free end A reference body arranged to correspond to the reference gauge and serving as a reference for the amount of thermal displacement of the reference gauge,
The imaging device has the same imaging region with the reference gauge at one imaging position in the one optical path and the free end of the reference body corresponding to the reference gauge and the cutting tool at the one imaging position as a subject. Or the other end of the reference body corresponding to the reference gauge at the one imaging position in the one optical path as an object in the same imaging area and the other A cutting machine provided with an imaging device for imaging a cutting tool at the other imaging position in an optical path with a time difference of optical path switching. An imaging device according to any one of claims 1 to 5, a reference gauge for measuring a position error of the imaging means, and a mounting base on which a cutting tool is mounted, and detecting the displacement amount of the cutting tool and the mounting A reference means for detecting the temperature of the table,
In the imaging apparatus, the reference gauge at one imaging position in the one optical path is a subject, and the reference means or cutting tool corresponding to the reference gauge at the other imaging position in the other optical path is a subject. ,
The reference gauge at the one imaging position in the one optical path is imaged, and the reference means or the cutting tool at the other imaging position in the other optical path is imaged with an optical path switching time difference. A cutting machine provided with an imaging device.

Images