SG10201508354YA - Protective film detecting apparatus and protective film detecting method - Google Patents
Protective film detecting apparatus and protective film detecting methodInfo
- Publication number
- SG10201508354YA SG10201508354YA SG10201508354YA SG10201508354YA SG10201508354YA SG 10201508354Y A SG10201508354Y A SG 10201508354YA SG 10201508354Y A SG10201508354Y A SG 10201508354YA SG 10201508354Y A SG10201508354Y A SG 10201508354YA SG 10201508354Y A SG10201508354Y A SG 10201508354YA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- film detecting
- detecting apparatus
- detecting method
- protective
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
- G06T2207/20224—Image subtraction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014221400A JP6393583B2 (en) | 2014-10-30 | 2014-10-30 | Protective film detection apparatus and protective film detection method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508354YA true SG10201508354YA (en) | 2016-05-30 |
Family
ID=55853206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508354YA SG10201508354YA (en) | 2014-10-30 | 2015-10-08 | Protective film detecting apparatus and protective film detecting method |
Country Status (6)
Country | Link |
---|---|
US (1) | US9613415B2 (en) |
JP (1) | JP6393583B2 (en) |
KR (1) | KR102340012B1 (en) |
CN (1) | CN105572075B (en) |
SG (1) | SG10201508354YA (en) |
TW (1) | TWI655050B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6688695B2 (en) * | 2016-06-24 | 2020-04-28 | 株式会社ディスコ | Protective film coating device and protective film coating method |
JP6765949B2 (en) * | 2016-12-12 | 2020-10-07 | 株式会社ディスコ | Wafer processing method |
JP2018121031A (en) * | 2017-01-27 | 2018-08-02 | 株式会社ディスコ | Laser processing device |
TWI831656B (en) * | 2018-01-04 | 2024-02-01 | 日商東京威力科創股份有限公司 | Substrate processing device and substrate processing method |
WO2019207633A1 (en) * | 2018-04-24 | 2019-10-31 | ディスコ ハイテック ヨーロッパ ゲーエムベーハー | Alignment device and alignment method |
JP7011348B2 (en) * | 2018-06-12 | 2022-01-26 | 株式会社 エフケー光学研究所 | Foreign matter inspection device and foreign matter inspection method |
JP7325897B2 (en) * | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | Machining device and machining method of workpiece |
CN110084957A (en) * | 2019-04-28 | 2019-08-02 | 深圳回收宝科技有限公司 | A kind of method, apparatus, portable terminal and the storage medium of terminal detection |
JP7430451B2 (en) * | 2020-04-02 | 2024-02-13 | 株式会社ディスコ | cutting equipment |
GB202014596D0 (en) | 2020-09-16 | 2020-10-28 | Third Dimension Software Ltd | Optical triangulation measurement apparatus and method |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63234141A (en) * | 1987-03-23 | 1988-09-29 | Hitachi Plant Eng & Constr Co Ltd | Method and device for evaluating cleaning effect |
JP3358099B2 (en) * | 1994-03-25 | 2002-12-16 | オムロン株式会社 | Optical sensor device |
JPH10305420A (en) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device |
JPH1114548A (en) * | 1997-06-20 | 1999-01-22 | Iinuma Gauge Seisakusho:Kk | Inspection method for orientation film for liquid-crystal display element and manufacture of liquid-crystal display element |
US8154711B1 (en) * | 2004-10-01 | 2012-04-10 | Ingo Werner Scheer | Spray diagnostic and control method and system |
US7760355B2 (en) * | 2005-07-27 | 2010-07-20 | The Curators Of The University Of Missouri | Focused droplet nebulizer for evaporative light scattering detector |
JP4777783B2 (en) | 2006-01-26 | 2011-09-21 | 株式会社ディスコ | Laser processing equipment |
US7664608B2 (en) * | 2006-07-14 | 2010-02-16 | Hitachi High-Technologies Corporation | Defect inspection method and apparatus |
JP2009158763A (en) * | 2007-12-27 | 2009-07-16 | Disco Abrasive Syst Ltd | Protective film coating apparatus |
WO2010036352A1 (en) * | 2008-09-23 | 2010-04-01 | Quantalife, Inc | Droplet-based assay system |
CN102113021B (en) * | 2008-12-25 | 2013-11-27 | 松下电器产业株式会社 | Image processing device and pseudo-3d image creation device |
JP5478173B2 (en) * | 2009-09-18 | 2014-04-23 | 株式会社ディスコ | Laser processing equipment |
JP2011176035A (en) * | 2010-02-23 | 2011-09-08 | Disco Corp | Method for cleaning wafer |
CN102331420A (en) * | 2010-07-13 | 2012-01-25 | 合肥普庆新材料科技有限公司 | Reagent and detection method for detecting zirconium membrane on surface of metal |
JP2012037425A (en) * | 2010-08-09 | 2012-02-23 | Jfe Steel Corp | Method for inspecting polycrystal silicon wafer and device thereof |
JP5836650B2 (en) * | 2011-06-08 | 2015-12-24 | シャープ株式会社 | Semiconductor substrate cleaning apparatus and cleaning method, and semiconductor device manufacturing method |
JP5949192B2 (en) * | 2012-06-12 | 2016-07-06 | 富士通セミコンダクター株式会社 | Semiconductor device manufacturing method and semiconductor device defect testing apparatus |
US20140227889A1 (en) * | 2013-02-13 | 2014-08-14 | University Of Central Florida Research Foundation, Inc. | Laser-based materials processing apparatus, method and applications |
JP2014215068A (en) * | 2013-04-23 | 2014-11-17 | 株式会社ディスコ | Protective film detection apparatus |
-
2014
- 2014-10-30 JP JP2014221400A patent/JP6393583B2/en active Active
-
2015
- 2015-09-01 TW TW104128827A patent/TWI655050B/en active
- 2015-09-23 KR KR1020150134505A patent/KR102340012B1/en active IP Right Grant
- 2015-10-08 SG SG10201508354YA patent/SG10201508354YA/en unknown
- 2015-10-19 CN CN201510677364.8A patent/CN105572075B/en active Active
- 2015-10-28 US US14/924,915 patent/US9613415B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105572075A (en) | 2016-05-11 |
CN105572075B (en) | 2020-10-09 |
US20160125591A1 (en) | 2016-05-05 |
TW201615315A (en) | 2016-05-01 |
TWI655050B (en) | 2019-04-01 |
KR102340012B1 (en) | 2021-12-16 |
JP2016090271A (en) | 2016-05-23 |
US9613415B2 (en) | 2017-04-04 |
KR20160051595A (en) | 2016-05-11 |
JP6393583B2 (en) | 2018-09-19 |
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