SG10201506247RA - Data center with fin modules - Google Patents

Data center with fin modules

Info

Publication number
SG10201506247RA
SG10201506247RA SG10201506247RA SG10201506247RA SG10201506247RA SG 10201506247R A SG10201506247R A SG 10201506247RA SG 10201506247R A SG10201506247R A SG 10201506247RA SG 10201506247R A SG10201506247R A SG 10201506247RA SG 10201506247R A SG10201506247R A SG 10201506247RA
Authority
SG
Singapore
Prior art keywords
data center
fin modules
fin
modules
center
Prior art date
Application number
SG10201506247RA
Other languages
English (en)
Inventor
Isaac A Salpeter
Original Assignee
Amazon Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/853,192 external-priority patent/US8238082B2/en
Priority claimed from US12/853,190 external-priority patent/US8238104B2/en
Application filed by Amazon Tech Inc filed Critical Amazon Tech Inc
Publication of SG10201506247RA publication Critical patent/SG10201506247RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1498—Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Sources (AREA)
SG10201506247RA 2010-08-09 2011-08-08 Data center with fin modules SG10201506247RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/853,192 US8238082B2 (en) 2010-08-09 2010-08-09 Modular system for outdoor data center
US12/853,190 US8238104B2 (en) 2010-08-09 2010-08-09 Data center with fin modules

Publications (1)

Publication Number Publication Date
SG10201506247RA true SG10201506247RA (en) 2015-09-29

Family

ID=45567912

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013010004A SG187798A1 (en) 2010-08-09 2011-08-08 Data center with fin modules
SG10201506247RA SG10201506247RA (en) 2010-08-09 2011-08-08 Data center with fin modules

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013010004A SG187798A1 (en) 2010-08-09 2011-08-08 Data center with fin modules

Country Status (8)

Country Link
EP (2) EP2941110B1 (fr)
JP (2) JP5678187B2 (fr)
CN (2) CN104363738B (fr)
AU (2) AU2011289601B2 (fr)
CA (1) CA2807812C (fr)
ES (1) ES2550486T3 (fr)
SG (2) SG187798A1 (fr)
WO (1) WO2012021441A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717036B (zh) 2013-03-06 2015-06-03 华为技术有限公司 射频拉远模块以及通信设备
CN104837318A (zh) * 2015-05-04 2015-08-12 亚翔系统集成科技（苏州）股份有限公司 一种模块式数据处理中心及其空调方法
CN109616793A (zh) * 2017-06-20 2019-04-12 富士康(昆山)电脑接插件有限公司 电连接器组件
TWI681285B (zh) * 2018-12-13 2020-01-01 國立臺灣科技大學 雙氣流散熱系統
DE102019115126A1 (de) * 2019-06-05 2020-12-10 Cloud & Heat Technologies GmbH Rechenzentrum-Modul und Verfahren
CN113473764B (zh) * 2020-03-31 2022-12-06 华为技术有限公司 一种交换机插框及机柜系统
CN112423529A (zh) * 2020-10-26 2021-02-26 苏州浪潮智能科技有限公司 一种具有换新风应急通风系统的单机柜及数据中心
CN115003135B (zh) * 2022-07-21 2023-03-24 浙江电联通信机房工程技术有限公司 一种模块一体化5g云储存汇聚机房

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970701885A (ko) * 1994-03-11 1997-04-12 크레인, 스탠포드 더블유 고대역폭 컴퓨터를 위한 모듈 구조(modular architecture for high bandwidth computers)
US6052276A (en) * 1997-10-27 2000-04-18 Citicorp Development Center, Inc. Passive backplane computer
JP3755568B2 (ja) * 1999-07-26 2006-03-15 三菱電機株式会社 開閉器制御端末
JP2002050889A (ja) * 2000-07-31 2002-02-15 Furukawa Electric Co Ltd:The 電子部品内蔵型筐体
US20030033463A1 (en) * 2001-08-10 2003-02-13 Garnett Paul J. Computer system storage
JP2005524884A (ja) * 2001-08-10 2005-08-18 サン・マイクロシステムズ・インコーポレーテッド コンピュータシステム
TWI249682B (en) * 2004-05-19 2006-02-21 Quanta Comp Inc Blade server system
US7113401B2 (en) * 2004-10-25 2006-09-26 International Business Machines Corporation System for airflow management in electronic enclosures
US7751333B2 (en) * 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
WO2008039773A2 (fr) * 2006-09-25 2008-04-03 Rackable Systems, Inc. Centre de données basé dans un contenant
US20080244052A1 (en) 2007-03-29 2008-10-02 Thomas Michael Bradicich Adapter blade with interposer for expanded capability of a blade server chassis system
US8032767B2 (en) * 2008-04-02 2011-10-04 Microsoft Corporation Power-efficient state setting of data-center elements
CN201467613U (zh) * 2009-07-02 2010-05-12 北京东土科技股份有限公司 一种密闭壳体电子设备的组合散热装置

Also Published As

Publication number Publication date
EP2604100B1 (fr) 2015-07-29
JP2013539107A (ja) 2013-10-17
CN103141168A (zh) 2013-06-05
EP2941110B1 (fr) 2020-12-16
CA2807812A1 (fr) 2012-02-16
WO2012021441A1 (fr) 2012-02-16
AU2011289601B2 (en) 2015-03-12
CN104363738B (zh) 2017-07-28
AU2015202979B2 (en) 2016-06-23
ES2550486T3 (es) 2015-11-10
CA2807812C (fr) 2016-07-19
CN104363738A (zh) 2015-02-18
JP5993036B2 (ja) 2016-09-14
CN103141168B (zh) 2014-11-26
JP2015092391A (ja) 2015-05-14
EP2604100A1 (fr) 2013-06-19
EP2941110A1 (fr) 2015-11-04
AU2011289601A1 (en) 2013-03-28
SG187798A1 (en) 2013-03-28
JP5678187B2 (ja) 2015-02-25
AU2015202979A1 (en) 2015-06-18

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