SG10201406804WA - Coating treatment apparatus, coating and developing treatment system, coating treatment method, and recording medium having program recorded thereon for executing coating treatment method - Google Patents
Coating treatment apparatus, coating and developing treatment system, coating treatment method, and recording medium having program recorded thereon for executing coating treatment methodInfo
- Publication number
- SG10201406804WA SG10201406804WA SG10201406804WA SG10201406804WA SG10201406804WA SG 10201406804W A SG10201406804W A SG 10201406804WA SG 10201406804W A SG10201406804W A SG 10201406804WA SG 10201406804W A SG10201406804W A SG 10201406804WA SG 10201406804W A SG10201406804W A SG 10201406804WA
- Authority
- SG
- Singapore
- Prior art keywords
- coating
- coating treatment
- treatment method
- recording medium
- executing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/04—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a surface receptive to ink or other liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
- G16Z99/00—Subject matter not provided for in other main groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
- H01L2224/0341—Manufacturing methods by blanket deposition of the material of the bonding area in liquid form
- H01L2224/03418—Spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A90/00—Technologies having an indirect contribution to adaptation to climate change
- Y02A90/10—Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011098684 | 2011-04-26 | ||
JP2012049740A JP5789546B2 (en) | 2011-04-26 | 2012-03-06 | Coating processing apparatus, coating and developing processing system, coating processing method, and recording medium recording a program for executing the coating processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201406804WA true SG10201406804WA (en) | 2014-11-27 |
Family
ID=47054352
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406804WA SG10201406804WA (en) | 2011-04-26 | 2012-04-17 | Coating treatment apparatus, coating and developing treatment system, coating treatment method, and recording medium having program recorded thereon for executing coating treatment method |
SG2012028486A SG185229A1 (en) | 2011-04-26 | 2012-04-17 | Coating treatment apparatus, coating and developing treatment system, coating treatment method, and recording medium having program recorded thereon for executing coating treatment method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012028486A SG185229A1 (en) | 2011-04-26 | 2012-04-17 | Coating treatment apparatus, coating and developing treatment system, coating treatment method, and recording medium having program recorded thereon for executing coating treatment method |
Country Status (6)
Country | Link |
---|---|
US (2) | US9162247B2 (en) |
JP (1) | JP5789546B2 (en) |
KR (1) | KR101676066B1 (en) |
CN (1) | CN102759860B (en) |
SG (2) | SG10201406804WA (en) |
TW (1) | TWI545404B (en) |
Families Citing this family (28)
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JP5096849B2 (en) * | 2007-09-13 | 2012-12-12 | 株式会社Sokudo | Substrate processing apparatus and substrate processing method |
US10262880B2 (en) * | 2013-02-19 | 2019-04-16 | Tokyo Electron Limited | Cover plate for wind mark control in spin coating process |
JP6032189B2 (en) * | 2013-12-03 | 2016-11-24 | 東京エレクトロン株式会社 | Coating film forming apparatus, coating film forming method, and storage medium |
JP6272138B2 (en) * | 2014-05-22 | 2018-01-31 | 東京エレクトロン株式会社 | Application processing equipment |
US9209062B1 (en) * | 2014-05-28 | 2015-12-08 | Spintrac Systems, Inc. | Removable spin chamber with vacuum attachment |
CN104646248A (en) * | 2015-01-28 | 2015-05-27 | 天津森普捷科技有限公司 | Method and device for preparing thin film materials by spin-coating method |
WO2016206708A1 (en) * | 2015-06-22 | 2016-12-29 | Ev Group E. Thallner Gmbh | Coating chamber |
JP6461749B2 (en) | 2015-08-26 | 2019-01-30 | 東芝メモリ株式会社 | Substrate processing method and substrate processing apparatus |
EP3357588B1 (en) | 2015-09-30 | 2021-07-21 | Suntory Holdings Limited | Preform coating device and preform coating method |
KR102637163B1 (en) * | 2015-11-24 | 2024-02-16 | 도쿄엘렉트론가부시키가이샤 | Substrate liquid processing device, substrate liquid processing method, and storage medium |
JP6815799B2 (en) * | 2016-09-13 | 2021-01-20 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
JP6899265B2 (en) * | 2017-06-27 | 2021-07-07 | 東京エレクトロン株式会社 | Coating treatment method, coating treatment equipment and storage medium |
CN111491744A (en) | 2017-12-25 | 2020-08-04 | 三得利控股株式会社 | Preform coating apparatus |
KR102121240B1 (en) * | 2018-05-03 | 2020-06-18 | 세메스 주식회사 | Apparatus and Method for treating substrate |
JP7090468B2 (en) * | 2018-05-15 | 2022-06-24 | 東京エレクトロン株式会社 | Board processing equipment and board processing method |
CN108816641A (en) * | 2018-06-30 | 2018-11-16 | 浙江天地环保科技有限公司 | The coating process and device of perovskite light-absorption layer in a kind of perovskite solar battery |
CN112655074A (en) * | 2018-09-10 | 2021-04-13 | 东京毅力科创株式会社 | Coating film forming method and coating film forming apparatus |
JP7202968B2 (en) | 2019-05-09 | 2023-01-12 | 東京エレクトロン株式会社 | Coating treatment method, coating treatment apparatus and storage medium |
JP7232737B2 (en) * | 2019-08-07 | 2023-03-03 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP7344726B2 (en) * | 2019-09-13 | 2023-09-14 | 東京エレクトロン株式会社 | Coating treatment method, coating treatment device, and storage medium |
JP7402655B2 (en) * | 2019-10-17 | 2023-12-21 | 東京エレクトロン株式会社 | Substrate processing equipment |
CN111361301B (en) * | 2020-04-01 | 2021-06-15 | 杭州美迪凯光电科技股份有限公司 | Ink-jet printing preparation method of LENS functional film |
CN112642644B (en) * | 2020-11-19 | 2022-03-29 | 浙江万基光学有限公司 | Intelligent film coating device for processing reflective material |
CN115672670A (en) * | 2021-07-28 | 2023-02-03 | 上海芯源微企业发展有限公司 | Air supply system and control method thereof |
CN114497321B (en) * | 2022-02-08 | 2024-04-05 | 亚世光电(集团)股份有限公司 | LED film separation method |
CN114643157B (en) * | 2022-03-23 | 2023-01-10 | 江苏长川科技有限公司 | Painting equipment for transformer radiating fins |
CN115889081B (en) * | 2022-11-30 | 2023-06-27 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer wax pasting device and method thereof |
CN116550543B (en) * | 2023-05-16 | 2023-10-27 | 苏州锐智航智能科技有限公司 | Off-line type vacuum glue filling machine and control system |
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CN101165854A (en) * | 2006-10-19 | 2008-04-23 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
JP5096849B2 (en) * | 2007-09-13 | 2012-12-12 | 株式会社Sokudo | Substrate processing apparatus and substrate processing method |
JP5133641B2 (en) | 2007-09-27 | 2013-01-30 | 東京エレクトロン株式会社 | Coating processing method, coating processing apparatus, and computer-readable storage medium |
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JP5485672B2 (en) * | 2009-12-07 | 2014-05-07 | 株式会社Sokudo | Substrate processing apparatus and substrate processing method |
JP5189114B2 (en) * | 2010-01-29 | 2013-04-24 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
JP5107372B2 (en) * | 2010-02-04 | 2012-12-26 | 東京エレクトロン株式会社 | Heat treatment apparatus, coating and developing treatment system, heat treatment method, coating and developing treatment method, and recording medium on which program for executing the heat treatment method or coating and developing treatment method is recorded |
JP5296021B2 (en) * | 2010-07-23 | 2013-09-25 | 東京エレクトロン株式会社 | Coating processing method, program, computer storage medium, and coating processing apparatus |
-
2012
- 2012-03-06 JP JP2012049740A patent/JP5789546B2/en active Active
- 2012-04-17 US US13/448,526 patent/US9162247B2/en active Active
- 2012-04-17 SG SG10201406804WA patent/SG10201406804WA/en unknown
- 2012-04-17 SG SG2012028486A patent/SG185229A1/en unknown
- 2012-04-23 TW TW101114370A patent/TWI545404B/en active
- 2012-04-25 KR KR1020120043163A patent/KR101676066B1/en active IP Right Grant
- 2012-04-25 CN CN201210124293.5A patent/CN102759860B/en active Active
-
2015
- 2015-07-30 US US14/813,820 patent/US9947534B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN102759860A (en) | 2012-10-31 |
SG185229A1 (en) | 2012-11-29 |
US9162247B2 (en) | 2015-10-20 |
KR20120121361A (en) | 2012-11-05 |
TW201319757A (en) | 2013-05-16 |
US20120276753A1 (en) | 2012-11-01 |
JP5789546B2 (en) | 2015-10-07 |
US9947534B2 (en) | 2018-04-17 |
JP2012238838A (en) | 2012-12-06 |
TWI545404B (en) | 2016-08-11 |
KR101676066B1 (en) | 2016-11-14 |
CN102759860B (en) | 2016-06-01 |
US20150371853A1 (en) | 2015-12-24 |
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