SG10201406466VA - Through-type furnace for substrates to be fitted with components and die bonder - Google Patents

Through-type furnace for substrates to be fitted with components and die bonder

Info

Publication number
SG10201406466VA
SG10201406466VA SG10201406466VA SG10201406466VA SG10201406466VA SG 10201406466V A SG10201406466V A SG 10201406466VA SG 10201406466V A SG10201406466V A SG 10201406466VA SG 10201406466V A SG10201406466V A SG 10201406466VA SG 10201406466V A SG10201406466V A SG 10201406466VA
Authority
SG
Singapore
Prior art keywords
substrates
fitted
components
type furnace
die bonder
Prior art date
Application number
SG10201406466VA
Inventor
Guido Suter
Kevin Domancich
Daniel Andreas Scherer
Reto Weibel
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG10201406466VA publication Critical patent/SG10201406466VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201406466VA 2013-11-20 2014-10-09 Through-type furnace for substrates to be fitted with components and die bonder SG10201406466VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01938/13A CH708881B1 (en) 2013-11-20 2013-11-20 Continuous furnace for substrates, which are equipped with components, and Die Bonder.

Publications (1)

Publication Number Publication Date
SG10201406466VA true SG10201406466VA (en) 2015-06-29

Family

ID=53029246

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406466VA SG10201406466VA (en) 2013-11-20 2014-10-09 Through-type furnace for substrates to be fitted with components and die bonder

Country Status (12)

Country Link
US (1) US9666460B2 (en)
JP (1) JP6485766B2 (en)
KR (1) KR102277075B1 (en)
CN (1) CN104658928B (en)
CH (1) CH708881B1 (en)
DE (1) DE102014116147A1 (en)
FR (1) FR3013432B1 (en)
HK (1) HK1206866A1 (en)
MX (1) MX2014014057A (en)
MY (1) MY180095A (en)
SG (1) SG10201406466VA (en)
TW (1) TWI634614B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160365317A1 (en) * 2015-06-14 2016-12-15 Tel Nexx, Inc. Method and apparatus for forming emi shielding layers on semiconductor packages
CH711296B1 (en) * 2015-07-07 2019-03-15 Besi Switzerland Ag Continuous furnace and die bonder with a continuous furnace.
CN110231006B (en) * 2019-06-10 2020-07-17 苏州博昇科技有限公司 Air coupling ultrasonic interference method
DE102020119877A1 (en) * 2020-07-28 2022-02-03 Siegfried Hofmann Gmbh Device for moving at least one assembly between a staging area and a work area
CN115172231B (en) * 2022-09-08 2022-11-25 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Rapid heating and cooling eutectic heating table with atmosphere protection

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US2227295A (en) * 1938-10-22 1940-12-31 Electric Furnace Co Apparatus for brazing
US2366088A (en) * 1944-04-27 1944-12-26 John L Coody Pipe heating furnace
US3840999A (en) * 1973-05-16 1974-10-15 Sun Chemical Corp Apparatus for radiation-curing of coating on multi-sided object
US4543059A (en) * 1984-07-18 1985-09-24 Quartz Engineering & Materials, Inc. Slotted cantilever diffusion tube system and method and apparatus for loading
US4752219A (en) * 1984-10-04 1988-06-21 Btu Engineering Corporation Wafer softlanding system and cooperative door assembly
JPS6230635A (en) * 1985-07-30 1987-02-09 Chugai Ro Kogyo Kaisha Ltd Evacuation furnace for cathode ray tube
US4744712A (en) * 1986-05-06 1988-05-17 Ron Mitchell Apparatus and method for an improved wafer handling system for cantilever type diffusion tubes
FR2625038B1 (en) * 1987-12-22 1990-08-17 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
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US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
EP0634783B1 (en) * 1993-07-16 1997-08-06 Semiconductor Systems, Inc. Thermal process module for substrate coat/develop system
US5997588A (en) * 1995-10-13 1999-12-07 Advanced Semiconductor Materials America, Inc. Semiconductor processing system with gas curtain
US5839870A (en) * 1996-03-13 1998-11-24 Novus Corporation Transfer system for use with a horizontal furnace
JP3758783B2 (en) * 1997-02-03 2006-03-22 有限会社さいたまシンクライト Cure device
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
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TW585845B (en) * 2000-07-13 2004-05-01 Koninkl Philips Electronics Nv Oven and process for manufacturing an envelope for use in a display tube
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JP3770238B2 (en) * 2002-03-22 2006-04-26 セイコーエプソン株式会社 Electronic device manufacturing apparatus and electronic device manufacturing method
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US8336757B2 (en) * 2011-01-04 2012-12-25 Asm Assembly Automation Ltd Apparatus for transporting substrates for bonding
CH705229B1 (en) 2011-07-08 2015-06-15 Esec Ag Method and apparatus for the assembly of semiconductor chips.
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DE102011053340A1 (en) * 2011-09-07 2013-03-07 Roth & Rau Ag Continuous furnace of substrate processing system, has heating unit and gas supply unit that are formed inside the interior spaces

Also Published As

Publication number Publication date
MX2014014057A (en) 2015-05-28
FR3013432B1 (en) 2018-02-02
DE102014116147A1 (en) 2015-05-21
JP6485766B2 (en) 2019-03-20
US20150136836A1 (en) 2015-05-21
KR20150057981A (en) 2015-05-28
JP2015103803A (en) 2015-06-04
CN104658928B (en) 2018-11-30
FR3013432A1 (en) 2015-05-22
CN104658928A (en) 2015-05-27
CH708881B1 (en) 2017-06-15
CH708881A1 (en) 2015-05-29
TW201521144A (en) 2015-06-01
MY180095A (en) 2020-11-21
HK1206866A1 (en) 2016-01-15
US9666460B2 (en) 2017-05-30
TWI634614B (en) 2018-09-01
KR102277075B1 (en) 2021-07-14

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