SG10201403209PA - Article storage facility and article storage method - Google Patents

Article storage facility and article storage method

Info

Publication number
SG10201403209PA
SG10201403209PA SG10201403209PA SG10201403209PA SG10201403209PA SG 10201403209P A SG10201403209P A SG 10201403209PA SG 10201403209P A SG10201403209P A SG 10201403209PA SG 10201403209P A SG10201403209P A SG 10201403209PA SG 10201403209P A SG10201403209P A SG 10201403209PA
Authority
SG
Singapore
Prior art keywords
article storage
storage
sections
display
facility
Prior art date
Application number
SG10201403209PA
Inventor
Takahara Masahiro
Ueda Toshihito
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of SG10201403209PA publication Critical patent/SG10201403209PA/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B81/00—Cabinets or racks specially adapted for other particular purposes, e.g. for storing guns or skis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

38 TITLE OF THE INVENTION: ARTICLE STORAGE FACILITY AND 5 Proper article storage management is made possible in the article storage facility which stores articles in containers and in an inactive gas environment. The article storage facility includes a storage rack having storage sections, a transport portion which transports containers to the storage sections, gas supplying portions each of which supplies inactive gas to the 10 container stored in the storage section, and a display. The display displays display sections such that the arrangement of the display sections corresponds to the arrangement of the storage sections in the storage rack and displays a supply state of inactive gas in each of the display sections. 15 Fig. 7
SG10201403209PA 2013-06-26 2014-06-12 Article storage facility and article storage method SG10201403209PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013134266A JP5884779B2 (en) 2013-06-26 2013-06-26 Goods storage facility

Publications (1)

Publication Number Publication Date
SG10201403209PA true SG10201403209PA (en) 2015-01-29

Family

ID=52115754

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201403209PA SG10201403209PA (en) 2013-06-26 2014-06-12 Article storage facility and article storage method

Country Status (6)

Country Link
US (1) US9364086B2 (en)
JP (1) JP5884779B2 (en)
KR (1) KR102214426B1 (en)
CN (1) CN104249895B (en)
SG (1) SG10201403209PA (en)
TW (1) TWI603903B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418812B1 (en) * 2012-10-31 2014-07-16 크린팩토메이션 주식회사 Apparatus for stocking and purging wafer at ceiling
SG11201506166UA (en) * 2013-03-05 2015-09-29 Murata Machinery Ltd Measurement unit and purge gas flow rate measuring method
JP6102759B2 (en) * 2014-01-16 2017-03-29 株式会社ダイフク Goods transport cart
US9875921B2 (en) * 2015-05-07 2018-01-23 Fabmatics Gmbh Flexible purge management system
SG11201801385XA (en) * 2015-08-28 2018-03-28 Murata Machinery Ltd Storage apparatus and storage method
JP6414525B2 (en) * 2015-09-02 2018-10-31 株式会社ダイフク Storage facilities
JP6409716B2 (en) * 2015-09-02 2018-10-24 株式会社ダイフク Storage shelf
JP6551240B2 (en) * 2016-01-06 2019-07-31 株式会社ダイフク Article storage rack and article storage facility provided with the same
JP6572854B2 (en) * 2016-09-09 2019-09-11 株式会社ダイフク Container storage equipment
JP6690740B2 (en) * 2017-02-20 2020-04-28 村田機械株式会社 Purge stocker
US11608229B2 (en) * 2017-09-08 2023-03-21 Murata Machinery, Ltd. Storage system and purge method in storage system
US11437258B2 (en) * 2018-08-30 2022-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same
JP7090513B2 (en) * 2018-09-06 2022-06-24 東京エレクトロン株式会社 Board processing equipment and purging method
JP7093318B2 (en) * 2019-02-18 2022-06-29 台湾大福高科技設備股▲分▼有限公司 Goods storage equipment
KR102256132B1 (en) * 2020-02-18 2021-05-25 (주)캔탑스 Automated Material Handling System for Managing Carrier Internal Pollution
CN112087702A (en) * 2020-07-28 2020-12-15 国网山东省电力公司枣庄供电公司 Wired microphone storage and detection integrated device
JP7000615B1 (en) 2021-03-31 2022-01-19 大陽日酸株式会社 Cylinder storage
CN115838029B (en) * 2023-02-24 2023-05-16 江苏环亚医用科技集团股份有限公司 Robot for drug delivery

Family Cites Families (18)

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JPS5869604A (en) * 1981-10-15 1983-04-25 Daifuku Co Ltd Automatic storehouse with stock display device
JPH0873010A (en) 1994-09-02 1996-03-19 Murata Mach Ltd Destination instruction device in carrier system
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
KR100646906B1 (en) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 Substrate processing apparatus and substrate processing method
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US6901971B2 (en) * 2001-01-10 2005-06-07 Entegris, Inc. Transportable container including an internal environment monitor
JP4506050B2 (en) * 2001-07-25 2010-07-21 東京エレクトロン株式会社 Processing system and management method of object to be processed
JP2006188322A (en) * 2005-01-05 2006-07-20 Olympus Corp Storage device, storage system and storage method
CN101263590B (en) * 2005-08-03 2010-05-19 恩特格林斯公司 A transfer container
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
US20080030341A1 (en) * 2006-08-02 2008-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Electronic rack and material management systems utilizing the same
JP4756372B2 (en) * 2006-09-13 2011-08-24 株式会社ダイフク Substrate processing method
JP4670808B2 (en) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 Container transport system and measuring container
JP5274267B2 (en) * 2009-01-07 2013-08-28 セコム株式会社 Safe deposit system and safe deposit management program
JP5236518B2 (en) * 2009-02-03 2013-07-17 株式会社ダン・タクマ Storage system and storage method
JP4945010B1 (en) * 2011-12-21 2012-06-06 三菱電機インフォメーションシステムズ株式会社 Shelf management system and shelf management program in semiconductor production line
US9325923B2 (en) 2013-03-14 2016-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods to mitigate transient current for sensors
US9257320B2 (en) * 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication

Also Published As

Publication number Publication date
CN104249895B (en) 2018-07-20
JP5884779B2 (en) 2016-03-15
US9364086B2 (en) 2016-06-14
TWI603903B (en) 2017-11-01
KR20150002451A (en) 2015-01-07
TW201505939A (en) 2015-02-16
CN104249895A (en) 2014-12-31
US20150003942A1 (en) 2015-01-01
JP2015009911A (en) 2015-01-19
KR102214426B1 (en) 2021-02-08

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