SG11201506166UA - Measurement unit and purge gas flow rate measuring method - Google Patents
Measurement unit and purge gas flow rate measuring methodInfo
- Publication number
- SG11201506166UA SG11201506166UA SG11201506166UA SG11201506166UA SG11201506166UA SG 11201506166U A SG11201506166U A SG 11201506166UA SG 11201506166U A SG11201506166U A SG 11201506166UA SG 11201506166U A SG11201506166U A SG 11201506166UA SG 11201506166U A SG11201506166U A SG 11201506166UA
- Authority
- SG
- Singapore
- Prior art keywords
- flow rate
- gas flow
- measurement unit
- measuring method
- purge gas
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/56—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using electric or magnetic effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
- G01F1/20—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow
- G01F1/28—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow by drag-force, e.g. vane type or impact flowmeter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Separation Of Gases By Adsorption (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013043068 | 2013-03-05 | ||
| PCT/JP2014/052066 WO2014136506A1 (en) | 2013-03-05 | 2014-01-30 | Measurement unit and purge gas flow rate measuring method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201506166UA true SG11201506166UA (en) | 2015-09-29 |
Family
ID=51491032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201506166UA SG11201506166UA (en) | 2013-03-05 | 2014-01-30 | Measurement unit and purge gas flow rate measuring method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9645000B2 (en) |
| EP (1) | EP2966678B1 (en) |
| JP (1) | JP5984030B2 (en) |
| KR (1) | KR101680165B1 (en) |
| CN (1) | CN104937709B (en) |
| SG (1) | SG11201506166UA (en) |
| TW (1) | TWI594936B (en) |
| WO (1) | WO2014136506A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5888288B2 (en) * | 2013-06-26 | 2016-03-16 | 株式会社ダイフク | Inspection equipment for goods storage facilities |
| CN108140598B (en) * | 2015-08-31 | 2022-09-16 | 村田机械株式会社 | Blowing-out device, blowing-out stocker and blowing-out method |
| JP6579067B2 (en) * | 2016-09-09 | 2019-09-25 | 株式会社ダイフク | Flow measuring device and flow measuring system |
| JP6817757B2 (en) * | 2016-09-16 | 2021-01-20 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate transfer method |
| JP6614174B2 (en) * | 2017-02-08 | 2019-12-04 | 株式会社ダイフク | Flow measurement system |
| CN109781172A (en) * | 2018-12-10 | 2019-05-21 | 广东恒鑫智能装备股份有限公司 | A kind of wind speed and pressure detection machine |
| KR20230054858A (en) * | 2020-10-05 | 2023-04-25 | 무라다기카이가부시끼가이샤 | flow measuring device |
| KR20220135290A (en) * | 2021-03-29 | 2022-10-07 | 삼성전자주식회사 | Carrier for measurement and wafer transfer system including the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4308975B2 (en) * | 1999-05-27 | 2009-08-05 | 株式会社日立国際電気 | Substrate processing apparatus, substrate processing method, and semiconductor element forming method |
| JP4569135B2 (en) * | 2004-03-15 | 2010-10-27 | 凸版印刷株式会社 | Photomask storage container |
| US7328727B2 (en) * | 2004-04-18 | 2008-02-12 | Entegris, Inc. | Substrate container with fluid-sealing flow passageway |
| JP4670808B2 (en) * | 2006-12-22 | 2011-04-13 | ムラテックオートメーション株式会社 | Container transport system and measuring container |
| JP2010027787A (en) * | 2008-07-17 | 2010-02-04 | Tokyo Electron Ltd | End point detection method, substrate treatment method, substrate-treating device, and substrate treatment system |
| JP5155848B2 (en) * | 2008-12-18 | 2013-03-06 | 日本ケンブリッジフィルター株式会社 | N2 purge device for FOUP |
| TWI346638B (en) * | 2008-12-26 | 2011-08-11 | Gudeng Prec Industral Co Ltd | A purging valve and a wafer container having the purging valve |
| US8591809B2 (en) * | 2010-03-15 | 2013-11-26 | Samsung Electronics Co., Ltd. | Substrate transfer container, gas purge monitoring tool, and semiconductor manufacturing equipment with the same |
| JP5874691B2 (en) * | 2013-06-26 | 2016-03-02 | 株式会社ダイフク | Inert gas supply equipment |
| JP5888288B2 (en) * | 2013-06-26 | 2016-03-16 | 株式会社ダイフク | Inspection equipment for goods storage facilities |
| JP5884779B2 (en) * | 2013-06-26 | 2016-03-15 | 株式会社ダイフク | Goods storage facility |
-
2014
- 2014-01-30 JP JP2015504202A patent/JP5984030B2/en active Active
- 2014-01-30 WO PCT/JP2014/052066 patent/WO2014136506A1/en active Application Filing
- 2014-01-30 SG SG11201506166UA patent/SG11201506166UA/en unknown
- 2014-01-30 EP EP14761109.9A patent/EP2966678B1/en active Active
- 2014-01-30 KR KR1020157017116A patent/KR101680165B1/en active IP Right Grant
- 2014-01-30 US US14/763,546 patent/US9645000B2/en active Active
- 2014-01-30 CN CN201480005157.1A patent/CN104937709B/en active Active
- 2014-03-03 TW TW103106998A patent/TWI594936B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2966678A1 (en) | 2016-01-13 |
| CN104937709B (en) | 2017-05-31 |
| US9645000B2 (en) | 2017-05-09 |
| TWI594936B (en) | 2017-08-11 |
| CN104937709A (en) | 2015-09-23 |
| EP2966678A4 (en) | 2016-11-02 |
| WO2014136506A1 (en) | 2014-09-12 |
| JP5984030B2 (en) | 2016-09-06 |
| US20150369643A1 (en) | 2015-12-24 |
| KR20150088880A (en) | 2015-08-03 |
| TW201442932A (en) | 2014-11-16 |
| JPWO2014136506A1 (en) | 2017-02-09 |
| KR101680165B1 (en) | 2016-11-28 |
| EP2966678B1 (en) | 2017-08-16 |
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