SG10201402786PA - Thick print copper pastes for aluminum nitride substrates - Google Patents
Thick print copper pastes for aluminum nitride substratesInfo
- Publication number
- SG10201402786PA SG10201402786PA SG10201402786PA SG10201402786PA SG10201402786PA SG 10201402786P A SG10201402786P A SG 10201402786PA SG 10201402786P A SG10201402786P A SG 10201402786PA SG 10201402786P A SG10201402786P A SG 10201402786PA SG 10201402786P A SG10201402786P A SG 10201402786PA
- Authority
- SG
- Singapore
- Prior art keywords
- oxide
- aluminum nitride
- nitride substrates
- thick print
- copper pastes
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- 229910052796 boron Inorganic materials 0.000 abstract 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 239000002318 adhesion promoter Substances 0.000 abstract 1
- 229910000416 bismuth oxide Inorganic materials 0.000 abstract 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract 1
- 229940112669 cuprous oxide Drugs 0.000 abstract 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910001386 lithium phosphate Inorganic materials 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 abstract 1
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 abstract 1
- 239000011787 zinc oxide Substances 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
- 229910001928 zirconium oxide Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Engineering (AREA)
Abstract
THICK PRINT COPPER PASTES FOR ALUMINUM NITRIDE SUBSTRATES Abstract The invention provides an electroconductive paste comprising 50–90 wt. % of copper particle, 0.5–10 wt. % of a glass frit, 0.1–5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5–20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided. Fig. 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361832426P | 2013-06-07 | 2013-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201402786PA true SG10201402786PA (en) | 2015-01-29 |
Family
ID=52005714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201402786PA SG10201402786PA (en) | 2013-06-07 | 2014-05-30 | Thick print copper pastes for aluminum nitride substrates |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9799421B2 (en) |
| JP (1) | JP2014239040A (en) |
| KR (1) | KR20140143714A (en) |
| CN (1) | CN104240790B (en) |
| SG (1) | SG10201402786PA (en) |
| TW (1) | TW201511036A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104715805B (en) * | 2015-03-09 | 2017-01-18 | 无锡海古德新技术有限公司 | Unleaded thick film conductive paste for aluminium nitride substrate |
| CN104992744B (en) * | 2015-06-17 | 2019-08-30 | 宁波职业技术学院 | A kind of thick-film circuit resistor paste and preparation method thereof for stainless steel substrate |
| EP3702072A1 (en) | 2015-09-07 | 2020-09-02 | Hitachi Chemical Company, Ltd. | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
| JP2019509237A (en) * | 2015-12-22 | 2019-04-04 | ヘレウス ドイチュラント ゲーエムベーハー ウント カンパニー カーゲー | Thick film paste intervening ceramics joined by metal or metal hybrid foil |
| JP6688500B2 (en) * | 2016-06-29 | 2020-04-28 | ナミックス株式会社 | Conductive paste and solar cell |
| CN106205772B (en) * | 2016-07-01 | 2018-07-03 | 中国科学院深圳先进技术研究院 | Copper-based electrocondution slurry and its preparation and its application in chip package copper copper is bonded |
| JP6885188B2 (en) * | 2017-04-28 | 2021-06-09 | 住友金属鉱山株式会社 | Method for manufacturing conductive composition and terminal electrode |
| JP6879035B2 (en) * | 2017-04-28 | 2021-06-02 | 住友金属鉱山株式会社 | Conductive composition, method of manufacturing conductors, and method of forming wiring for electronic components |
| US10431700B2 (en) * | 2017-06-09 | 2019-10-01 | Giga Solar Materials Corp. | Conductive paste composition for providing enhanced adhesion strength to a semiconductor substrate and its use |
| US20200013522A1 (en) * | 2017-06-29 | 2020-01-09 | Heraeus Precious Metals North America Conshohocken Llc | Copper-containing thick print eletroconductive pastes |
| JP7221609B2 (en) * | 2018-08-08 | 2023-02-14 | 日本特殊陶業株式会社 | Method for manufacturing conductive paste |
| JP7256260B2 (en) * | 2018-09-07 | 2023-04-11 | フエロ コーポレーション | Conductive thick film paste for silicon nitride and other substrates |
| CN110942840A (en) * | 2019-12-13 | 2020-03-31 | 新昌中国计量大学企业创新研究院有限公司 | Lead-free copper conductor paste for aluminum nitride substrate |
| JPWO2022196653A1 (en) * | 2021-03-17 | 2022-09-22 | ||
| CN113380440B (en) * | 2021-06-18 | 2023-03-10 | 福建瑞升电子科技有限公司 | Low-temperature copper electrode slurry and preparation method thereof |
| CN113470865B (en) * | 2021-09-06 | 2021-12-21 | 西安宏星电子浆料科技股份有限公司 | Environment-friendly silver conductor paste for aluminum nitride |
| CN115831435B (en) * | 2022-11-28 | 2023-09-01 | 苏州三环科技有限公司 | Slurry for resistor and preparation method and application thereof |
Family Cites Families (32)
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|---|---|---|---|---|
| US4172919A (en) * | 1977-04-22 | 1979-10-30 | E. I. Du Pont De Nemours And Company | Copper conductor compositions containing copper oxide and Bi2 O3 |
| US4376725A (en) * | 1980-10-17 | 1983-03-15 | Rca Corporation | Conductor inks |
| JPS5879837A (en) * | 1981-10-31 | 1983-05-13 | Tdk Corp | Electrically conductive paste composition |
| JP2568075B2 (en) * | 1986-11-20 | 1996-12-25 | 旭硝子株式会社 | Conductor composition |
| US4880567A (en) * | 1987-08-20 | 1989-11-14 | General Electric Company | Thick film copper conductor inks |
| US5089172A (en) * | 1987-08-31 | 1992-02-18 | Ferro Corporation | Thick film conductor compositions for use with an aluminum nitride substrate |
| JPH0690882B2 (en) | 1988-08-05 | 1994-11-14 | 日本電気株式会社 | Conductive paste |
| US4937016A (en) | 1989-02-01 | 1990-06-26 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Copper conductor composition |
| JP2631010B2 (en) * | 1989-03-31 | 1997-07-16 | 昭栄化学工業株式会社 | Thick film copper paste |
| JPH0346706A (en) * | 1989-07-14 | 1991-02-28 | Showa Denko Kk | Copper paste |
| JPH06318403A (en) | 1993-05-07 | 1994-11-15 | Murata Mfg Co Ltd | Copper paste for forming conductive coating film |
| JPH07192529A (en) * | 1993-12-24 | 1995-07-28 | Miyoshi Denshi Kk | Thick film copper composition for thick conductive coating formation with high plating resistance |
| US6165247A (en) * | 1997-02-24 | 2000-12-26 | Superior Micropowders, Llc | Methods for producing platinum powders |
| JP3756283B2 (en) * | 1997-03-31 | 2006-03-15 | 三ツ星ベルト株式会社 | Copper conductor paste for aluminum nitride substrate and aluminum nitride substrate |
| JP2001243836A (en) | 1999-12-21 | 2001-09-07 | Murata Mfg Co Ltd | Conductive paste and printed circuit board using it |
| JP3965075B2 (en) * | 2002-05-15 | 2007-08-22 | 京都エレックス株式会社 | Copper paste composition for multilayer ceramic capacitor external electrode |
| CN1213441C (en) * | 2003-03-07 | 2005-08-03 | 中国科学院上海硅酸盐研究所 | Leadless thick film conductor slurry composition for aluminium nitride substrate |
| JP4868716B2 (en) | 2004-04-28 | 2012-02-01 | 三井金属鉱業株式会社 | Flake copper powder and conductive paste |
| US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
| KR20070065379A (en) | 2004-10-08 | 2007-06-22 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Conductive ink |
| JP4799881B2 (en) | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | Conductive ink |
| JP5203970B2 (en) | 2006-12-25 | 2013-06-05 | ナミックス株式会社 | Conductive paste for electrode formation on crystalline silicon substrate |
| JP4291857B2 (en) | 2007-01-24 | 2009-07-08 | 三ツ星ベルト株式会社 | Copper conductor paste, conductor circuit board and electronic components |
| JP4456612B2 (en) * | 2007-03-15 | 2010-04-28 | 三ツ星ベルト株式会社 | Copper conductor paste, conductor circuit board and electronic components |
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| CN101436441B (en) | 2008-12-09 | 2011-06-15 | 彩虹集团公司 | Thick film nanometer gold electrode slurry and preparation method thereof |
| US20110083874A1 (en) | 2009-10-09 | 2011-04-14 | E. I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
| US8562872B2 (en) * | 2010-09-15 | 2013-10-22 | Cheil Industries, Inc. | Paste for solar cell electrode and solar cell prepared using the same |
| TW201232564A (en) | 2010-12-17 | 2012-08-01 | Du Pont | Conductive paste composition containing lithium, and articles made therefrom |
| EP2669346A4 (en) | 2011-01-27 | 2015-05-20 | Hitachi Chemical Co Ltd | Conductive binder composition and method for producing the same, bonded unit, and solar cell module and method for producing the same |
| US20130049148A1 (en) | 2011-02-22 | 2013-02-28 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
| WO2012129554A2 (en) | 2011-03-24 | 2012-09-27 | E. I. Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
-
2014
- 2014-05-28 US US14/288,567 patent/US9799421B2/en active Active
- 2014-05-30 SG SG10201402786PA patent/SG10201402786PA/en unknown
- 2014-06-03 KR KR1020140067668A patent/KR20140143714A/en not_active Application Discontinuation
- 2014-06-06 JP JP2014117916A patent/JP2014239040A/en active Pending
- 2014-06-06 TW TW103119798A patent/TW201511036A/en unknown
- 2014-06-09 CN CN201410253606.6A patent/CN104240790B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201511036A (en) | 2015-03-16 |
| JP2014239040A (en) | 2014-12-18 |
| US9799421B2 (en) | 2017-10-24 |
| US20140363681A1 (en) | 2014-12-11 |
| CN104240790A (en) | 2014-12-24 |
| CN104240790B (en) | 2018-12-04 |
| KR20140143714A (en) | 2014-12-17 |
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