SG10201400531YA - Semiconductor Wafer With A Layer Of AlzGa1-zN And Process For Producing It - Google Patents
Semiconductor Wafer With A Layer Of AlzGa1-zN And Process For Producing ItInfo
- Publication number
- SG10201400531YA SG10201400531YA SG10201400531YA SG10201400531YA SG10201400531YA SG 10201400531Y A SG10201400531Y A SG 10201400531YA SG 10201400531Y A SG10201400531Y A SG 10201400531YA SG 10201400531Y A SG10201400531Y A SG 10201400531YA SG 10201400531Y A SG10201400531Y A SG 10201400531YA
- Authority
- SG
- Singapore
- Prior art keywords
- alzga1
- producing
- layer
- semiconductor wafer
- wafer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02516—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02609—Crystal orientation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20130158844 EP2779213B1 (en) | 2013-03-12 | 2013-03-12 | Semiconductor wafer with a layer of AlzGa1-zN and process for producing it |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201400531YA true SG10201400531YA (en) | 2014-10-30 |
Family
ID=47877882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201400531YA SG10201400531YA (en) | 2013-03-12 | 2014-03-11 | Semiconductor Wafer With A Layer Of AlzGa1-zN And Process For Producing It |
Country Status (8)
Country | Link |
---|---|
US (1) | US9147726B2 (en) |
EP (1) | EP2779213B1 (en) |
JP (1) | JP5938428B2 (en) |
KR (1) | KR101556054B1 (en) |
CN (1) | CN104051232B (en) |
MY (1) | MY185237A (en) |
SG (1) | SG10201400531YA (en) |
TW (1) | TWI524552B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108281378B (en) * | 2012-10-12 | 2022-06-24 | 住友电气工业株式会社 | Group III nitride composite substrate, semiconductor device, and methods for manufacturing group III nitride composite substrate and semiconductor device |
EP3051575A1 (en) | 2015-01-30 | 2016-08-03 | Siltronic AG | Semiconductor wafer comprising a monocrystalline group-IIIA nitride layer |
US10243105B2 (en) | 2015-02-10 | 2019-03-26 | iBeam Materials, Inc. | Group-III nitride devices and systems on IBAD-textured substrates |
WO2016130725A1 (en) | 2015-02-10 | 2016-08-18 | iBeam Materials, Inc. | Epitaxial hexagonal materials on ibad-textured substrates |
USRE49869E1 (en) | 2015-02-10 | 2024-03-12 | iBeam Materials, Inc. | Group-III nitride devices and systems on IBAD-textured substrates |
US10581398B2 (en) * | 2016-03-11 | 2020-03-03 | Akoustis, Inc. | Method of manufacture for single crystal acoustic resonator devices using micro-vias |
US10923345B2 (en) * | 2016-03-23 | 2021-02-16 | Iqe Plc | Epitaxial metal oxide as buffer for epitaxial III-V layers |
WO2018004666A1 (en) * | 2016-07-01 | 2018-01-04 | Intel Corporation | Techniques for monolithic co-integration of polycrystalline thin-film bulk acoustic resonator devices and monocrystalline iii-n semiconductor transistor devices |
EP3539155A4 (en) * | 2016-11-10 | 2020-06-17 | The Government of the United States of America, as represented by the Secretary of the Navy | Scandium-containing iii-n etch-stop layers for selective etching of iii-nitrides and related materials |
CN108346694B (en) * | 2017-01-23 | 2020-10-02 | Imec 非营利协会 | III-N based substrates for power electronics and methods of making same |
US11557716B2 (en) * | 2018-02-20 | 2023-01-17 | Akoustis, Inc. | Method and structure of single crystal electronic devices with enhanced strain interface regions by impurity introduction |
US11054673B2 (en) | 2018-05-11 | 2021-07-06 | Raytheon Bbn Technologies Corp. | Photonic devices |
US11262604B2 (en) * | 2018-05-11 | 2022-03-01 | Raytheon Bbn Technologies Corp. | Photonic devices |
CN110491771A (en) * | 2019-07-11 | 2019-11-22 | 华南理工大学 | The preparation method of metal oxide thin-film transistor and preparation method thereof and passivation layer |
CN112735944A (en) * | 2021-01-05 | 2021-04-30 | 西安电子科技大学 | Nitrogen polar surface GaN material and manufacturing method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3813740B2 (en) * | 1997-07-11 | 2006-08-23 | Tdk株式会社 | Substrates for electronic devices |
US7020374B2 (en) * | 2003-02-03 | 2006-03-28 | Freescale Semiconductor, Inc. | Optical waveguide structure and method for fabricating the same |
EP1975988B1 (en) * | 2007-03-28 | 2015-02-25 | Siltronic AG | Multilayered semiconductor wafer and process for its production |
JP4597259B2 (en) * | 2009-03-27 | 2010-12-15 | Dowaホールディングス株式会社 | Group III nitride semiconductor growth substrate, group III nitride semiconductor epitaxial substrate, group III nitride semiconductor device, group III nitride semiconductor free-standing substrate, and methods of manufacturing the same |
WO2012176411A1 (en) * | 2011-06-24 | 2012-12-27 | 住友化学株式会社 | Transistor semiconductor substrate, transistor, and method of manufacturing transistor semiconductor substrate |
-
2013
- 2013-03-12 EP EP20130158844 patent/EP2779213B1/en active Active
-
2014
- 2014-03-05 US US14/197,296 patent/US9147726B2/en active Active
- 2014-03-06 JP JP2014043708A patent/JP5938428B2/en active Active
- 2014-03-10 MY MYPI2014000679A patent/MY185237A/en unknown
- 2014-03-10 KR KR1020140027875A patent/KR101556054B1/en active IP Right Grant
- 2014-03-11 CN CN201410087745.6A patent/CN104051232B/en active Active
- 2014-03-11 SG SG10201400531YA patent/SG10201400531YA/en unknown
- 2014-03-12 TW TW103108616A patent/TWI524552B/en active
Also Published As
Publication number | Publication date |
---|---|
JP5938428B2 (en) | 2016-06-22 |
US20140264776A1 (en) | 2014-09-18 |
EP2779213A1 (en) | 2014-09-17 |
KR101556054B1 (en) | 2015-09-25 |
KR20140111971A (en) | 2014-09-22 |
MY185237A (en) | 2021-04-30 |
JP2014209576A (en) | 2014-11-06 |
TW201436282A (en) | 2014-09-16 |
EP2779213B1 (en) | 2015-05-06 |
US9147726B2 (en) | 2015-09-29 |
CN104051232B (en) | 2017-04-12 |
CN104051232A (en) | 2014-09-17 |
TWI524552B (en) | 2016-03-01 |
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