SE9901253D0 - Dispensing assembly - Google Patents

Dispensing assembly

Info

Publication number
SE9901253D0
SE9901253D0 SE9901253A SE9901253A SE9901253D0 SE 9901253 D0 SE9901253 D0 SE 9901253D0 SE 9901253 A SE9901253 A SE 9901253A SE 9901253 A SE9901253 A SE 9901253A SE 9901253 D0 SE9901253 D0 SE 9901253D0
Authority
SE
Sweden
Prior art keywords
assembly
nozzle
machine
viscous medium
eject mechanism
Prior art date
Application number
SE9901253A
Other languages
English (en)
Swedish (sv)
Inventor
William Holm
Johan Kronstedt
Haakan Sandell
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE9901253A priority Critical patent/SE9901253D0/xx
Publication of SE9901253D0 publication Critical patent/SE9901253D0/xx
Priority to EP00921290A priority patent/EP1169894A1/de
Priority to EP00919247A priority patent/EP1165250B1/de
Priority to CN00806047A priority patent/CN1122583C/zh
Priority to AT00919247T priority patent/ATE305822T1/de
Priority to JP2000611536A priority patent/JP4502518B2/ja
Priority to KR1020017012815A priority patent/KR100687385B1/ko
Priority to PCT/SE2000/000673 priority patent/WO2000061297A1/en
Priority to AU39948/00A priority patent/AU3994800A/en
Priority to AU41621/00A priority patent/AU4162100A/en
Priority to JP2000610618A priority patent/JP4574864B2/ja
Priority to PCT/SE2000/000672 priority patent/WO2000062587A1/en
Priority to DE60022992T priority patent/DE60022992T2/de
Priority to CNB008060487A priority patent/CN1200596C/zh
Priority to KR1020017012817A priority patent/KR100687384B1/ko
Priority to US09/971,022 priority patent/US6578773B2/en
Priority to US09/971,023 priority patent/US6540152B2/en
Priority to JP2009222841A priority patent/JP2010036186A/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
    • B05B12/1472—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet separate supply lines supplying different materials to separate outlets of the spraying apparatus

Landscapes

  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Massaging Devices (AREA)
  • Electron Tubes For Measurement (AREA)
  • Surgical Instruments (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Eye Examination Apparatus (AREA)
  • Feeding And Guiding Record Carriers (AREA)
  • Spray Control Apparatus (AREA)
  • Nozzles (AREA)
SE9901253A 1999-04-08 1999-04-08 Dispensing assembly SE9901253D0 (sv)

Priority Applications (18)

Application Number Priority Date Filing Date Title
SE9901253A SE9901253D0 (sv) 1999-04-08 1999-04-08 Dispensing assembly
KR1020017012817A KR100687384B1 (ko) 1999-04-08 2000-04-07 분배 조립체
AU39948/00A AU3994800A (en) 1999-04-08 2000-04-07 Dispensing assembly
JP2000610618A JP4574864B2 (ja) 1999-04-08 2000-04-07 分与アセンブリ
CN00806047A CN1122583C (zh) 1999-04-08 2000-04-07 一种散布粘性介质液滴的组件及其连接装置和更换方法
AT00919247T ATE305822T1 (de) 1999-04-08 2000-04-07 Auftragsvorrichtung
JP2000611536A JP4502518B2 (ja) 1999-04-08 2000-04-07 粘性媒体の小滴を噴射する組立体及び基板に付着物を提供する機械
KR1020017012815A KR100687385B1 (ko) 1999-04-08 2000-04-07 분배 조립체
PCT/SE2000/000673 WO2000061297A1 (en) 1999-04-08 2000-04-07 Dispensing assembly
EP00921290A EP1169894A1 (de) 1999-04-08 2000-04-07 Abgabevorrichtung
AU41621/00A AU4162100A (en) 1999-04-08 2000-04-07 Dispensing assembly
EP00919247A EP1165250B1 (de) 1999-04-08 2000-04-07 Auftragsvorrichtung
PCT/SE2000/000672 WO2000062587A1 (en) 1999-04-08 2000-04-07 Dispensing assembly
DE60022992T DE60022992T2 (de) 1999-04-08 2000-04-07 Auftragsvorrichtung
CNB008060487A CN1200596C (zh) 1999-04-08 2000-04-07 散布组件
US09/971,023 US6540152B2 (en) 1999-04-08 2001-10-05 Dispensing assembly
US09/971,022 US6578773B2 (en) 1999-04-08 2001-10-05 Dispensing assembly
JP2009222841A JP2010036186A (ja) 1999-04-08 2009-09-28 分配組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901253A SE9901253D0 (sv) 1999-04-08 1999-04-08 Dispensing assembly

Publications (1)

Publication Number Publication Date
SE9901253D0 true SE9901253D0 (sv) 1999-04-08

Family

ID=20415146

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901253A SE9901253D0 (sv) 1999-04-08 1999-04-08 Dispensing assembly

Country Status (10)

Country Link
US (2) US6540152B2 (de)
EP (2) EP1169894A1 (de)
JP (3) JP4574864B2 (de)
KR (2) KR100687385B1 (de)
CN (2) CN1200596C (de)
AT (1) ATE305822T1 (de)
AU (2) AU4162100A (de)
DE (1) DE60022992T2 (de)
SE (1) SE9901253D0 (de)
WO (2) WO2000062587A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0101503D0 (sv) 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
SE0104210D0 (sv) * 2001-12-14 2001-12-14 Mydata Automation Ab Viscous medium feeder
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
KR101026935B1 (ko) * 2003-12-10 2011-04-04 엘지디스플레이 주식회사 디스펜서 정렬장치 및 그 방법
EP1701231A1 (de) 2005-03-08 2006-09-13 Mydata Automation AB Kalibrierverfahren
US20060214028A1 (en) * 2005-03-25 2006-09-28 Hynes Anthony J Dispensing device for atomized reactive material, system and method of use thereof
US20060283981A1 (en) * 2005-06-16 2006-12-21 Mead William T Spray coating nozzle assembly for coating remote areas
US8453595B2 (en) * 2005-11-14 2013-06-04 Mydata Automation Ab Jetting apparatus and method of improving the performance of a jetting apparatus
US7798434B2 (en) * 2006-12-13 2010-09-21 Nordson Corporation Multi-plate nozzle and method for dispensing random pattern of adhesive filaments
KR100985325B1 (ko) * 2007-12-16 2010-10-04 엘지전자 주식회사 컨벡션 장치 및 조리기기
US8074902B2 (en) * 2008-04-14 2011-12-13 Nordson Corporation Nozzle and method for dispensing random pattern of adhesive filaments
ES2671545T3 (es) * 2008-08-22 2018-06-07 Liebel-Flarsheim Company Llc Inyector de potencia con una funcionalidad de constante de decaimiento
US20120089232A1 (en) 2009-03-27 2012-04-12 Jennifer Hagyoung Kang Choi Medical devices with galvanic particulates
JP5655237B2 (ja) * 2010-12-17 2015-01-21 アピックヤマダ株式会社 液状樹脂供給装置及び樹脂モールド装置
US10642286B2 (en) 2012-04-20 2020-05-05 Nordson Corporation Device, system, and method for tracking the configuration or operational history of a nozzle in a fluid jetting system
US8944001B2 (en) 2013-02-18 2015-02-03 Nordson Corporation Automated position locator for a height sensor in a dispensing system
US10082417B2 (en) 2013-12-30 2018-09-25 Nordson Corporation Calibration methods for a viscous fluid dispensing system
US9707584B2 (en) 2014-07-09 2017-07-18 Nordson Corporation Dual applicator fluid dispensing methods and systems
USD967212S1 (en) * 2020-09-14 2022-10-18 Robatech Ag Device for melting glue
USD967215S1 (en) * 2020-09-14 2022-10-18 Robatech Ag Device for melting glue
USD967211S1 (en) * 2020-09-14 2022-10-18 Robatech Ag Device for melting glue
USD967213S1 (en) * 2020-09-14 2022-10-18 Robatech Ag Device for melting glue
USD967214S1 (en) * 2020-09-14 2022-10-18 Robatech Ag Device for melting glue
USD969891S1 (en) * 2021-03-14 2022-11-15 Robatech Ag Device for melting glue
CN116234312B (zh) * 2023-05-05 2023-09-22 长鑫存储技术有限公司 半导体结构及其制作方法、存储器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970985A (en) * 1989-05-01 1990-11-20 Slautterback Corporation Apparatus for tailing reduction in hot-melt dispensing of droplet patterns
SE461822B (sv) 1988-07-08 1990-03-26 Mydata Automation Ab Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort
US5042688A (en) * 1988-10-17 1991-08-27 Micro Robotics Systems Inc. Method for controlling accurate dispensing of adhesive droplets
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5408746A (en) * 1993-04-30 1995-04-25 Hewlett-Packard Company Datum formation for improved alignment of multiple nozzle members in a printer
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
JPH091026A (ja) * 1995-06-23 1997-01-07 Hitachi Techno Eng Co Ltd ペースト塗布機
JP3011259B2 (ja) * 1995-07-28 2000-02-21 日立テクノエンジニアリング株式会社 ペースト塗布機
US6082289A (en) * 1995-08-24 2000-07-04 Speedline Technologies, Inc. Liquid dispensing system with controllably movable cartridge
US5855323A (en) * 1996-11-13 1999-01-05 Sandia Corporation Method and apparatus for jetting, manufacturing and attaching uniform solder balls
US6224180B1 (en) * 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
JP3980115B2 (ja) * 1997-04-22 2007-09-26 松下電器産業株式会社 電子部品接着用ボンドの塗布装置
JPH10341074A (ja) 1997-06-09 1998-12-22 Matsushita Electric Ind Co Ltd 粘性材の塗布方法
JP3766918B2 (ja) * 1997-06-13 2006-04-19 日野自動車株式会社 多色少量塗装制御システム
US6387184B1 (en) * 1998-01-09 2002-05-14 Fastar, Ltd. System and method for interchangeably interfacing wet components with a coating apparatus
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar

Also Published As

Publication number Publication date
EP1165250B1 (de) 2005-10-05
CN1346584A (zh) 2002-04-24
WO2000062587A1 (en) 2000-10-19
KR20020024578A (ko) 2002-03-30
KR20020024579A (ko) 2002-03-30
JP2002542611A (ja) 2002-12-10
JP2002540936A (ja) 2002-12-03
US6540152B2 (en) 2003-04-01
DE60022992D1 (de) 2006-02-16
CN1122583C (zh) 2003-10-01
CN1346299A (zh) 2002-04-24
EP1165250A1 (de) 2002-01-02
US20020047052A1 (en) 2002-04-25
EP1169894A1 (de) 2002-01-09
JP4502518B2 (ja) 2010-07-14
US20020043570A1 (en) 2002-04-18
KR100687385B1 (ko) 2007-02-28
US6578773B2 (en) 2003-06-17
JP4574864B2 (ja) 2010-11-04
WO2000061297A1 (en) 2000-10-19
KR100687384B1 (ko) 2007-02-28
CN1200596C (zh) 2005-05-04
ATE305822T1 (de) 2005-10-15
AU4162100A (en) 2000-11-14
DE60022992T2 (de) 2006-05-18
JP2010036186A (ja) 2010-02-18
AU3994800A (en) 2000-11-14

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