SE9803671L - Kretskort och förfarande för framställning av kretskortet - Google Patents
Kretskort och förfarande för framställning av kretskortetInfo
- Publication number
- SE9803671L SE9803671L SE9803671A SE9803671A SE9803671L SE 9803671 L SE9803671 L SE 9803671L SE 9803671 A SE9803671 A SE 9803671A SE 9803671 A SE9803671 A SE 9803671A SE 9803671 L SE9803671 L SE 9803671L
- Authority
- SE
- Sweden
- Prior art keywords
- circuit board
- substrates
- section
- making
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803671A SE513352C2 (sv) | 1998-10-26 | 1998-10-26 | Kretskort och förfarande för framställning av kretskortet |
PCT/SE1999/001930 WO2000025558A1 (en) | 1998-10-26 | 1999-10-26 | A circuit board and a method for manufacturing the same |
AU14306/00A AU1430600A (en) | 1998-10-26 | 1999-10-26 | A circuit board and a method for manufacturing the same |
US09/426,951 US6449168B1 (en) | 1998-10-26 | 1999-10-26 | Circuit board and a method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803671A SE513352C2 (sv) | 1998-10-26 | 1998-10-26 | Kretskort och förfarande för framställning av kretskortet |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9803671D0 SE9803671D0 (sv) | 1998-10-26 |
SE9803671L true SE9803671L (sv) | 2000-04-27 |
SE513352C2 SE513352C2 (sv) | 2000-08-28 |
Family
ID=20413092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9803671A SE513352C2 (sv) | 1998-10-26 | 1998-10-26 | Kretskort och förfarande för framställning av kretskortet |
Country Status (4)
Country | Link |
---|---|
US (1) | US6449168B1 (sv) |
AU (1) | AU1430600A (sv) |
SE (1) | SE513352C2 (sv) |
WO (1) | WO2000025558A1 (sv) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001160663A (ja) * | 1999-12-02 | 2001-06-12 | Nec Corp | 回路基板 |
US6633005B2 (en) * | 2001-10-22 | 2003-10-14 | Micro Mobio Corporation | Multilayer RF amplifier module |
JP3575478B2 (ja) * | 2002-07-03 | 2004-10-13 | ソニー株式会社 | モジュール基板装置の製造方法、高周波モジュール及びその製造方法 |
JP3734807B2 (ja) * | 2003-05-19 | 2006-01-11 | Tdk株式会社 | 電子部品モジュール |
US6933596B2 (en) * | 2003-07-01 | 2005-08-23 | Northrop Grumman Corporation | Ultra wideband BGA |
JP4339739B2 (ja) * | 2004-04-26 | 2009-10-07 | 太陽誘電株式会社 | 部品内蔵型多層基板 |
US8345433B2 (en) * | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
WO2006025084A1 (ja) * | 2004-08-30 | 2006-03-09 | Spansion Llc | 積層型半導体装置用キャリア構成、この製造方法及び積層型半導体装置の製造方法 |
TWI336608B (en) * | 2006-01-31 | 2011-01-21 | Sony Corp | Printed circuit board assembly and method of manufacturing the same |
KR100737098B1 (ko) * | 2006-03-16 | 2007-07-06 | 엘지이노텍 주식회사 | 전자파 차폐장치 및 그 제조 공정 |
US20070235214A1 (en) * | 2006-03-30 | 2007-10-11 | Hall Stephen H | Moisture resistant printed circuit board |
DE102006018161A1 (de) * | 2006-04-19 | 2007-10-25 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Elektronisches Bauelementmodul |
US8159828B2 (en) * | 2007-02-23 | 2012-04-17 | Alpha & Omega Semiconductor, Inc. | Low profile flip chip power module and method of making |
US8259454B2 (en) * | 2008-04-14 | 2012-09-04 | General Electric Company | Interconnect structure including hybrid frame panel |
US20120314390A1 (en) * | 2010-03-03 | 2012-12-13 | Mutual-Tek Industries Co., Ltd. | Multilayer circuit board |
US20110216514A1 (en) * | 2010-03-03 | 2011-09-08 | Mutual-Tek Industries Co., Ltd. | Combined multilayer circuit board having embedded components and manufacturing method of the same |
DE102010018499A1 (de) * | 2010-04-22 | 2011-10-27 | Schweizer Electronic Ag | Leiterplatte mit Hohlraum |
CN103052281A (zh) * | 2011-10-14 | 2013-04-17 | 富葵精密组件(深圳)有限公司 | 嵌入式多层电路板及其制作方法 |
DE102011088256A1 (de) * | 2011-12-12 | 2013-06-13 | Zf Friedrichshafen Ag | Multilayer-Leiterplatte sowie Anordnung mit einer solchen |
US10765428B2 (en) | 2016-08-15 | 2020-09-08 | Covidien Lp | Hermetic force sensors for surgical devices |
US10345165B2 (en) | 2016-09-08 | 2019-07-09 | Covidien Lp | Force sensor for surgical devices |
AT519891A1 (de) * | 2017-05-09 | 2018-11-15 | Hitzinger Gmbh | Leiterplatte |
US10588231B2 (en) | 2017-05-18 | 2020-03-10 | Covidien Lp | Hermetically sealed printed circuit boards |
US10973142B2 (en) | 2017-05-18 | 2021-04-06 | Covidien Lp | Hermetically sealed printed circuit boards |
US10667408B2 (en) | 2017-05-18 | 2020-05-26 | Covidien Lp | Fully encapsulated electronics and printed circuit boards |
US11229122B2 (en) * | 2019-10-04 | 2022-01-18 | Physight Solutions Llc | Increasing exposure of integrated circuit components |
US11534086B2 (en) | 2020-10-30 | 2022-12-27 | Medtronic Minimed, Inc. | Low-profile wearable medical device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4276558A (en) | 1979-06-15 | 1981-06-30 | Ford Aerospace & Communications Corp. | Hermetically sealed active microwave integrated circuit |
US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
US4745381A (en) * | 1985-10-14 | 1988-05-17 | Nec Corporation | Microwave connector assembly capable of being readily connected to microwave circuit components |
US4737208A (en) * | 1986-09-29 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of fabricating multilayer structures with nonplanar surfaces |
US5041943A (en) * | 1989-11-06 | 1991-08-20 | Allied-Signal Inc. | Hermetically sealed printed circuit board |
US5206712A (en) * | 1990-04-05 | 1993-04-27 | General Electric Company | Building block approach to microwave modules |
US5229727A (en) | 1992-03-13 | 1993-07-20 | General Electric Company | Hermetically sealed microstrip to microstrip transition for printed circuit fabrication |
CA2109441C (en) * | 1992-10-29 | 1997-05-13 | Yuhei Kosugi | Composite microwave circuit module assembly and its connection structure |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
JPH0722730A (ja) * | 1993-07-06 | 1995-01-24 | Murata Mfg Co Ltd | 複合電子部品 |
US6031723A (en) * | 1994-08-18 | 2000-02-29 | Allen-Bradley Company, Llc | Insulated surface mount circuit board construction |
JP2682477B2 (ja) | 1994-11-16 | 1997-11-26 | 日本電気株式会社 | 回路部品の実装構造 |
US5642262A (en) * | 1995-02-23 | 1997-06-24 | Altera Corporation | High-density programmable logic device in a multi-chip module package with improved interconnect scheme |
US5629578A (en) * | 1995-03-20 | 1997-05-13 | Martin Marietta Corp. | Integrated composite acoustic transducer array |
JPH09148749A (ja) | 1995-11-20 | 1997-06-06 | Sumise Device:Kk | 多層回路基板のキャビティ成形方法 |
JPH09162320A (ja) * | 1995-12-08 | 1997-06-20 | Shinko Electric Ind Co Ltd | 半導体パッケージおよび半導体装置 |
JPH09199856A (ja) | 1996-01-16 | 1997-07-31 | Hitachi Chem Co Ltd | 半導体素子搭載用キャビティー付きプリント配線板の製造方法 |
JPH1022645A (ja) | 1996-07-08 | 1998-01-23 | Nippon Avionics Co Ltd | キャビティ付きプリント配線板の製造方法 |
US6064116A (en) * | 1997-06-06 | 2000-05-16 | Micron Technology, Inc. | Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
SE9803670L (sv) | 1998-10-26 | 2000-04-27 | Ericsson Telefon Ab L M | Förfarande vid framställning av kretskort |
-
1998
- 1998-10-26 SE SE9803671A patent/SE513352C2/sv not_active IP Right Cessation
-
1999
- 1999-10-26 WO PCT/SE1999/001930 patent/WO2000025558A1/en active Application Filing
- 1999-10-26 AU AU14306/00A patent/AU1430600A/en not_active Abandoned
- 1999-10-26 US US09/426,951 patent/US6449168B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU1430600A (en) | 2000-05-15 |
SE9803671D0 (sv) | 1998-10-26 |
SE513352C2 (sv) | 2000-08-28 |
WO2000025558A1 (en) | 2000-05-04 |
US6449168B1 (en) | 2002-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |