SE9803671L - Kretskort och förfarande för framställning av kretskortet - Google Patents

Kretskort och förfarande för framställning av kretskortet

Info

Publication number
SE9803671L
SE9803671L SE9803671A SE9803671A SE9803671L SE 9803671 L SE9803671 L SE 9803671L SE 9803671 A SE9803671 A SE 9803671A SE 9803671 A SE9803671 A SE 9803671A SE 9803671 L SE9803671 L SE 9803671L
Authority
SE
Sweden
Prior art keywords
circuit board
substrates
section
making
component
Prior art date
Application number
SE9803671A
Other languages
English (en)
Other versions
SE9803671D0 (sv
SE513352C2 (sv
Inventor
Mats Soederholm
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9803671A priority Critical patent/SE513352C2/sv
Publication of SE9803671D0 publication Critical patent/SE9803671D0/sv
Priority to PCT/SE1999/001930 priority patent/WO2000025558A1/en
Priority to AU14306/00A priority patent/AU1430600A/en
Priority to US09/426,951 priority patent/US6449168B1/en
Publication of SE9803671L publication Critical patent/SE9803671L/sv
Publication of SE513352C2 publication Critical patent/SE513352C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE9803671A 1998-10-26 1998-10-26 Kretskort och förfarande för framställning av kretskortet SE513352C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9803671A SE513352C2 (sv) 1998-10-26 1998-10-26 Kretskort och förfarande för framställning av kretskortet
PCT/SE1999/001930 WO2000025558A1 (en) 1998-10-26 1999-10-26 A circuit board and a method for manufacturing the same
AU14306/00A AU1430600A (en) 1998-10-26 1999-10-26 A circuit board and a method for manufacturing the same
US09/426,951 US6449168B1 (en) 1998-10-26 1999-10-26 Circuit board and a method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9803671A SE513352C2 (sv) 1998-10-26 1998-10-26 Kretskort och förfarande för framställning av kretskortet

Publications (3)

Publication Number Publication Date
SE9803671D0 SE9803671D0 (sv) 1998-10-26
SE9803671L true SE9803671L (sv) 2000-04-27
SE513352C2 SE513352C2 (sv) 2000-08-28

Family

ID=20413092

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9803671A SE513352C2 (sv) 1998-10-26 1998-10-26 Kretskort och förfarande för framställning av kretskortet

Country Status (4)

Country Link
US (1) US6449168B1 (sv)
AU (1) AU1430600A (sv)
SE (1) SE513352C2 (sv)
WO (1) WO2000025558A1 (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160663A (ja) * 1999-12-02 2001-06-12 Nec Corp 回路基板
US6633005B2 (en) * 2001-10-22 2003-10-14 Micro Mobio Corporation Multilayer RF amplifier module
JP3575478B2 (ja) * 2002-07-03 2004-10-13 ソニー株式会社 モジュール基板装置の製造方法、高周波モジュール及びその製造方法
JP3734807B2 (ja) * 2003-05-19 2006-01-11 Ｔｄｋ株式会社 電子部品モジュール
US6933596B2 (en) * 2003-07-01 2005-08-23 Northrop Grumman Corporation Ultra wideband BGA
JP4339739B2 (ja) * 2004-04-26 2009-10-07 太陽誘電株式会社 部品内蔵型多層基板
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
WO2006025084A1 (ja) * 2004-08-30 2006-03-09 Spansion Llc 積層型半導体装置用キャリア構成、この製造方法及び積層型半導体装置の製造方法
TWI336608B (en) * 2006-01-31 2011-01-21 Sony Corp Printed circuit board assembly and method of manufacturing the same
KR100737098B1 (ko) * 2006-03-16 2007-07-06 엘지이노텍 주식회사 전자파 차폐장치 및 그 제조 공정
US20070235214A1 (en) * 2006-03-30 2007-10-11 Hall Stephen H Moisture resistant printed circuit board
DE102006018161A1 (de) * 2006-04-19 2007-10-25 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektronisches Bauelementmodul
US8159828B2 (en) * 2007-02-23 2012-04-17 Alpha & Omega Semiconductor, Inc. Low profile flip chip power module and method of making
US8259454B2 (en) * 2008-04-14 2012-09-04 General Electric Company Interconnect structure including hybrid frame panel
US20120314390A1 (en) * 2010-03-03 2012-12-13 Mutual-Tek Industries Co., Ltd. Multilayer circuit board
US20110216514A1 (en) * 2010-03-03 2011-09-08 Mutual-Tek Industries Co., Ltd. Combined multilayer circuit board having embedded components and manufacturing method of the same
DE102010018499A1 (de) * 2010-04-22 2011-10-27 Schweizer Electronic Ag Leiterplatte mit Hohlraum
CN103052281A (zh) * 2011-10-14 2013-04-17 富葵精密组件(深圳)有限公司 嵌入式多层电路板及其制作方法
DE102011088256A1 (de) * 2011-12-12 2013-06-13 Zf Friedrichshafen Ag Multilayer-Leiterplatte sowie Anordnung mit einer solchen
US10765428B2 (en) 2016-08-15 2020-09-08 Covidien Lp Hermetic force sensors for surgical devices
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
AT519891A1 (de) * 2017-05-09 2018-11-15 Hitzinger Gmbh Leiterplatte
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
US11229122B2 (en) * 2019-10-04 2022-01-18 Physight Solutions Llc Increasing exposure of integrated circuit components
US11534086B2 (en) 2020-10-30 2022-12-27 Medtronic Minimed, Inc. Low-profile wearable medical device

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Publication number Priority date Publication date Assignee Title
US4276558A (en) 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
US4745381A (en) * 1985-10-14 1988-05-17 Nec Corporation Microwave connector assembly capable of being readily connected to microwave circuit components
US4737208A (en) * 1986-09-29 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Method of fabricating multilayer structures with nonplanar surfaces
US5041943A (en) * 1989-11-06 1991-08-20 Allied-Signal Inc. Hermetically sealed printed circuit board
US5206712A (en) * 1990-04-05 1993-04-27 General Electric Company Building block approach to microwave modules
US5229727A (en) 1992-03-13 1993-07-20 General Electric Company Hermetically sealed microstrip to microstrip transition for printed circuit fabrication
CA2109441C (en) * 1992-10-29 1997-05-13 Yuhei Kosugi Composite microwave circuit module assembly and its connection structure
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
JPH0722730A (ja) * 1993-07-06 1995-01-24 Murata Mfg Co Ltd 複合電子部品
US6031723A (en) * 1994-08-18 2000-02-29 Allen-Bradley Company, Llc Insulated surface mount circuit board construction
JP2682477B2 (ja) 1994-11-16 1997-11-26 日本電気株式会社 回路部品の実装構造
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
US5629578A (en) * 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
JPH09148749A (ja) 1995-11-20 1997-06-06 Sumise Device:Kk 多層回路基板のキャビティ成形方法
JPH09162320A (ja) * 1995-12-08 1997-06-20 Shinko Electric Ind Co Ltd 半導体パッケージおよび半導体装置
JPH09199856A (ja) 1996-01-16 1997-07-31 Hitachi Chem Co Ltd 半導体素子搭載用キャビティー付きプリント配線板の製造方法
JPH1022645A (ja) 1996-07-08 1998-01-23 Nippon Avionics Co Ltd キャビティ付きプリント配線板の製造方法
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
SE9803670L (sv) 1998-10-26 2000-04-27 Ericsson Telefon Ab L M Förfarande vid framställning av kretskort

Also Published As

Publication number Publication date
AU1430600A (en) 2000-05-15
SE9803671D0 (sv) 1998-10-26
SE513352C2 (sv) 2000-08-28
WO2000025558A1 (en) 2000-05-04
US6449168B1 (en) 2002-09-10

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