SE9803067L - Sputterstation - Google Patents

Sputterstation

Info

Publication number
SE9803067L
SE9803067L SE9803067A SE9803067A SE9803067L SE 9803067 L SE9803067 L SE 9803067L SE 9803067 A SE9803067 A SE 9803067A SE 9803067 A SE9803067 A SE 9803067A SE 9803067 L SE9803067 L SE 9803067L
Authority
SE
Sweden
Prior art keywords
chamber
sputter source
axis
transport
sputtering
Prior art date
Application number
SE9803067A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE521639C2 (en
SE9803067D0 (en
Inventor
Roman Schertler
Original Assignee
Balzers Hochvakuum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE29716440U external-priority patent/DE29716440U1/en
Application filed by Balzers Hochvakuum filed Critical Balzers Hochvakuum
Publication of SE9803067D0 publication Critical patent/SE9803067D0/en
Publication of SE9803067L publication Critical patent/SE9803067L/en
Publication of SE521639C2 publication Critical patent/SE521639C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Spray Control Apparatus (AREA)

Abstract

The sputtering station for disk-shaped workpieces includes an airlock chamber (3), a sputter source (7) with a working surface (7a), a transport chamber (1) with openings respectively into the airlock chamber and to the sputter source for transfer of a workpiece (23), and a transport unit (13). The airlock chamber (3) and the working surface (7a) of the sputter source lie on the same lateral axis (Q) and face one another on opposite sides of the transport chamber. The transport unit (13) is pivotably driven about an axis (A1) which is oriented perpendicular to the axis (Q) and jointly with the latter defines a vertical plane (E). The unit (13) is provided with at least one radially extendable/retractable carrier arm (19) with a workpiece seating (21). Also claimed is a sputtering installation incorporating such a sputtering station.
SE9803067A 1997-09-12 1998-09-10 Sputterstation SE521639C2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29716440U DE29716440U1 (en) 1997-09-12 1997-09-12 Sputtering station

Publications (3)

Publication Number Publication Date
SE9803067D0 SE9803067D0 (en) 1998-09-10
SE9803067L true SE9803067L (en) 1999-03-13
SE521639C2 SE521639C2 (en) 2003-11-18

Family

ID=27771784

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9803067A SE521639C2 (en) 1997-09-12 1998-09-10 Sputterstation

Country Status (4)

Country Link
CH (1) CH693508A5 (en)
HK (1) HK1020287A1 (en)
NL (1) NL1010046C2 (en)
SE (1) SE521639C2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160139A (en) * 1984-01-30 1985-08-21 Fujitsu Ltd Shifting process
US4857160A (en) * 1988-07-25 1989-08-15 Oerlikon-Buhrle U.S.A. Inc. High vacuum processing system and method
DE4117969C2 (en) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vacuum chamber
GB2272225B (en) * 1992-10-06 1996-07-17 Balzers Hochvakuum A method for masking a workpiece and a vacuum treatment facility
DE4427984C2 (en) * 1994-08-08 2003-07-03 Unaxis Deutschland Holding Device for feeding in and out of workpieces in a coating chamber
NL1000138C2 (en) * 1995-04-13 1996-10-15 Od & Me Bv Substrate processing devices as well as methods suitable for use with such devices.

Also Published As

Publication number Publication date
HK1020287A1 (en) 2000-04-07
SE521639C2 (en) 2003-11-18
NL1010046C2 (en) 2004-08-17
CH693508A5 (en) 2003-09-15
SE9803067D0 (en) 1998-09-10
NL1010046A1 (en) 1999-03-15

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