SE9403323L - Pressningsförfarande samt press avsedd för användning vid förfarandet - Google Patents

Pressningsförfarande samt press avsedd för användning vid förfarandet

Info

Publication number
SE9403323L
SE9403323L SE9403323A SE9403323A SE9403323L SE 9403323 L SE9403323 L SE 9403323L SE 9403323 A SE9403323 A SE 9403323A SE 9403323 A SE9403323 A SE 9403323A SE 9403323 L SE9403323 L SE 9403323L
Authority
SE
Sweden
Prior art keywords
pressure
pressure chamber
press
under
pressing procedure
Prior art date
Application number
SE9403323A
Other languages
Unknown language ( )
English (en)
Other versions
SE9403323D0 (sv
SE502457C2 (sv
Inventor
Bernt Ekstroem
Original Assignee
Metfoils Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metfoils Ab filed Critical Metfoils Ab
Priority to SE9403323A priority Critical patent/SE502457C2/sv
Publication of SE9403323D0 publication Critical patent/SE9403323D0/sv
Priority to PCT/SE1995/001114 priority patent/WO1996010486A1/en
Priority to AU36907/95A priority patent/AU3690795A/en
Publication of SE9403323L publication Critical patent/SE9403323L/sv
Publication of SE502457C2 publication Critical patent/SE502457C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Press Drives And Press Lines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE9403323A 1994-10-03 1994-10-03 Pressningsförfarande samt press avsedd för användning vid förfarandet SE502457C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9403323A SE502457C2 (sv) 1994-10-03 1994-10-03 Pressningsförfarande samt press avsedd för användning vid förfarandet
PCT/SE1995/001114 WO1996010486A1 (en) 1994-10-03 1995-10-02 Pressing process and a press used at the process
AU36907/95A AU3690795A (en) 1994-10-03 1995-10-02 Pressing process and a press used at the process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403323A SE502457C2 (sv) 1994-10-03 1994-10-03 Pressningsförfarande samt press avsedd för användning vid förfarandet

Publications (3)

Publication Number Publication Date
SE9403323D0 SE9403323D0 (sv) 1994-10-03
SE9403323L true SE9403323L (sv) 1995-10-23
SE502457C2 SE502457C2 (sv) 1995-10-23

Family

ID=20395447

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403323A SE502457C2 (sv) 1994-10-03 1994-10-03 Pressningsförfarande samt press avsedd för användning vid förfarandet

Country Status (3)

Country Link
AU (1) AU3690795A (sv)
SE (1) SE502457C2 (sv)
WO (1) WO1996010486A1 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336864B2 (ja) * 1996-01-18 2002-10-21 松下電工株式会社 積層体の製造方法およびその製造装置
DE19859613C2 (de) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
CN102625586A (zh) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 一种新型油压式铜箔导电压合机
WO2015183655A1 (en) * 2014-05-30 2015-12-03 Saint-Gobain Ceramics & Plastics, Inc. Hot press and methods of using
JP2017525148A (ja) * 2014-07-17 2017-08-31 セダル エクイプメント エッセエレエレＣｅｄａｌ Ｅｑｕｉｐｍｅｎｔ Ｓｒｌ 印刷回路用多層シートの製造装置および関連方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0254901A3 (en) * 1986-07-18 1990-05-23 Tektronix, Inc. Lamination method and apparatus
CH673435A5 (sv) * 1987-05-27 1990-03-15 Fela Planungs Ag

Also Published As

Publication number Publication date
WO1996010486A1 (en) 1996-04-11
AU3690795A (en) 1996-04-26
SE9403323D0 (sv) 1994-10-03
SE502457C2 (sv) 1995-10-23

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