SE9403323L - Pressing procedure and presses intended for use in the process - Google Patents

Pressing procedure and presses intended for use in the process

Info

Publication number
SE9403323L
SE9403323L SE9403323A SE9403323A SE9403323L SE 9403323 L SE9403323 L SE 9403323L SE 9403323 A SE9403323 A SE 9403323A SE 9403323 A SE9403323 A SE 9403323A SE 9403323 L SE9403323 L SE 9403323L
Authority
SE
Sweden
Prior art keywords
pressure
pressure chamber
press
under
pressing procedure
Prior art date
Application number
SE9403323A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE9403323D0 (en
SE502457C2 (en
Inventor
Bernt Ekstroem
Original Assignee
Metfoils Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metfoils Ab filed Critical Metfoils Ab
Priority to SE9403323A priority Critical patent/SE9403323L/en
Publication of SE9403323D0 publication Critical patent/SE9403323D0/en
Priority to PCT/SE1995/001114 priority patent/WO1996010486A1/en
Priority to AU36907/95A priority patent/AU3690795A/en
Publication of SE502457C2 publication Critical patent/SE502457C2/en
Publication of SE9403323L publication Critical patent/SE9403323L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Press Drives And Press Lines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to pressing under heat and pressure in a press, the press room of which is enclosed in a pressure chamber or the like and the pressing takes place at under-pressure in the pressure chamber. The product produced is cooled down at under-pressure in the pressure chamber by injecting water into the pressure chamber. The invention also relates to a press for the production of multilayer printed circuit boards and copper laminates, for instance.
SE9403323A 1994-10-03 1994-10-03 Pressing procedure and presses intended for use in the process SE9403323L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9403323A SE9403323L (en) 1994-10-03 1994-10-03 Pressing procedure and presses intended for use in the process
PCT/SE1995/001114 WO1996010486A1 (en) 1994-10-03 1995-10-02 Pressing process and a press used at the process
AU36907/95A AU3690795A (en) 1994-10-03 1995-10-02 Pressing process and a press used at the process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403323A SE9403323L (en) 1994-10-03 1994-10-03 Pressing procedure and presses intended for use in the process

Publications (3)

Publication Number Publication Date
SE9403323D0 SE9403323D0 (en) 1994-10-03
SE502457C2 SE502457C2 (en) 1995-10-23
SE9403323L true SE9403323L (en) 1995-10-23

Family

ID=20395447

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403323A SE9403323L (en) 1994-10-03 1994-10-03 Pressing procedure and presses intended for use in the process

Country Status (3)

Country Link
AU (1) AU3690795A (en)
SE (1) SE9403323L (en)
WO (1) WO1996010486A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336864B2 (en) * 1996-01-18 2002-10-21 松下電工株式会社 Laminated body manufacturing method and apparatus for manufacturing the same
DE19859613C2 (en) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Press pack construction and process for its production
CN102625586A (en) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 Novel oil pressure type copper foil electric conduction pressing machine
US9770841B2 (en) * 2014-05-30 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Hot press and method of using
JP2017525148A (en) * 2014-07-17 2017-08-31 セダル エクイプメント エッセエレエレＣｅｄａｌ Ｅｑｕｉｐｍｅｎｔ Ｓｒｌ Apparatus for producing multilayer sheet for printed circuit and related method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0254901A3 (en) * 1986-07-18 1990-05-23 Tektronix, Inc. Lamination method and apparatus
CH673435A5 (en) * 1987-05-27 1990-03-15 Fela Planungs Ag

Also Published As

Publication number Publication date
SE9403323D0 (en) 1994-10-03
WO1996010486A1 (en) 1996-04-11
AU3690795A (en) 1996-04-26
SE502457C2 (en) 1995-10-23

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