SE9102977D0 - BY IRRATION HARDWARE RESINTS, PROCEDURES FOR THEIR PREPARATION AND APPLICATION - Google Patents

BY IRRATION HARDWARE RESINTS, PROCEDURES FOR THEIR PREPARATION AND APPLICATION

Info

Publication number
SE9102977D0
SE9102977D0 SE9102977A SE9102977A SE9102977D0 SE 9102977 D0 SE9102977 D0 SE 9102977D0 SE 9102977 A SE9102977 A SE 9102977A SE 9102977 A SE9102977 A SE 9102977A SE 9102977 D0 SE9102977 D0 SE 9102977D0
Authority
SE
Sweden
Prior art keywords
resints
irration
procedures
hardware
preparation
Prior art date
Application number
SE9102977A
Other languages
Swedish (sv)
Other versions
SE9102977L (en
Inventor
A Mathes
Original Assignee
Ruetgerswerke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruetgerswerke Ag filed Critical Ruetgerswerke Ag
Publication of SE9102977D0 publication Critical patent/SE9102977D0/en
Publication of SE9102977L publication Critical patent/SE9102977L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to radiation-curable resins prepared by reacting hydroxymethylated phenols with diglycidyl ethers of bisphenols and esterification of the reaction products by means of acid esters of ethylenically unsaturated acids. These resins are suitable as photoresists for integrated circuits and for the production of printed multilayer wiring (circuitry, metallisation).
SE9102977A 1987-02-11 1991-10-14 BY IRRATION HARDWARE RESINTS, PROCEDURES FOR THEIR PREPARATION AND APPLICATION SE9102977L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873704149 DE3704149A1 (en) 1987-02-11 1987-02-11 Radiation-curable resins, process for their preparation, and their use

Publications (2)

Publication Number Publication Date
SE9102977D0 true SE9102977D0 (en) 1991-10-14
SE9102977L SE9102977L (en) 1993-04-15

Family

ID=6320703

Family Applications (2)

Application Number Title Priority Date Filing Date
SE8800023A SE469474B (en) 1987-02-11 1988-01-07 BY IRRAVING HARDWARE RESINTS, PROCEDURES FOR THE PREPARATION OF THESE RESINES AND APPLICATION THEREOF
SE9102977A SE9102977L (en) 1987-02-11 1991-10-14 BY IRRATION HARDWARE RESINTS, PROCEDURES FOR THEIR PREPARATION AND APPLICATION

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE8800023A SE469474B (en) 1987-02-11 1988-01-07 BY IRRAVING HARDWARE RESINTS, PROCEDURES FOR THE PREPARATION OF THESE RESINES AND APPLICATION THEREOF

Country Status (4)

Country Link
DE (1) DE3704149A1 (en)
DK (1) DK56288A (en)
NO (1) NO169720C (en)
SE (2) SE469474B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365844A3 (en) * 1988-10-28 1991-02-06 Siemens Aktiengesellschaft Easily curable photoresist
DE4038895C2 (en) * 1990-12-06 1998-07-02 Harald Dr Mueller Mixtures sensitive to light and radiation
JP3331222B2 (en) * 1992-02-27 2002-10-07 ジャパンエポキシレジン株式会社 Epoxy resin and epoxy resin composition
KR100342950B1 (en) * 1997-11-11 2002-10-19 가부시키가이샤 닛폰 쇼쿠바이 Curable Resin and Resin Composition
CN100358953C (en) * 2005-05-23 2008-01-02 容大油墨（惠州）有限公司 Liquid photosensitive welding resistant printing ink and its circuit board
JP6557155B2 (en) 2015-02-02 2019-08-07 株式会社日本触媒 Curable resin and method for producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3230560A1 (en) * 1981-08-20 1983-05-05 Hussain Kashif Dr. 8003 Zürich El-Ghatta Polymers, and a process for their preparation
DE3565546D1 (en) * 1984-06-29 1988-11-17 Siemens Ag Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation

Also Published As

Publication number Publication date
DK56288D0 (en) 1988-02-04
NO880592D0 (en) 1988-02-10
SE8800023D0 (en) 1988-01-07
NO169720B (en) 1992-04-21
NO169720C (en) 1992-07-29
SE9102977L (en) 1993-04-15
SE469474B (en) 1993-07-12
DK56288A (en) 1988-08-12
DE3704149C2 (en) 1990-09-27
DE3704149A1 (en) 1988-08-25
NO880592L (en) 1988-08-12

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