NO880592L - HARDENABLE RESINTS, PROCEDURE FOR THE MANUFACTURE OF THESE AND APPLICATION OF THESE. - Google Patents

HARDENABLE RESINTS, PROCEDURE FOR THE MANUFACTURE OF THESE AND APPLICATION OF THESE.

Info

Publication number
NO880592L
NO880592L NO880592A NO880592A NO880592L NO 880592 L NO880592 L NO 880592L NO 880592 A NO880592 A NO 880592A NO 880592 A NO880592 A NO 880592A NO 880592 L NO880592 L NO 880592L
Authority
NO
Norway
Prior art keywords
resints
hardenable
procedure
manufacture
application
Prior art date
Application number
NO880592A
Other languages
Norwegian (no)
Other versions
NO880592D0 (en
NO169720B (en
NO169720C (en
Inventor
Alfred Mathes
Original Assignee
Ruetgerswerke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruetgerswerke Ag filed Critical Ruetgerswerke Ag
Publication of NO880592D0 publication Critical patent/NO880592D0/en
Publication of NO880592L publication Critical patent/NO880592L/en
Publication of NO169720B publication Critical patent/NO169720B/en
Publication of NO169720C publication Critical patent/NO169720C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
NO880592A 1987-02-11 1988-02-10 PROCEDURE FOR THE MANUFACTURING OF HARDENABLE RESINES AND THE USE OF THESE NO169720C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873704149 DE3704149A1 (en) 1987-02-11 1987-02-11 Radiation-curable resins, process for their preparation, and their use

Publications (4)

Publication Number Publication Date
NO880592D0 NO880592D0 (en) 1988-02-10
NO880592L true NO880592L (en) 1988-08-12
NO169720B NO169720B (en) 1992-04-21
NO169720C NO169720C (en) 1992-07-29

Family

ID=6320703

Family Applications (1)

Application Number Title Priority Date Filing Date
NO880592A NO169720C (en) 1987-02-11 1988-02-10 PROCEDURE FOR THE MANUFACTURING OF HARDENABLE RESINES AND THE USE OF THESE

Country Status (4)

Country Link
DE (1) DE3704149A1 (en)
DK (1) DK56288A (en)
NO (1) NO169720C (en)
SE (2) SE469474B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365844A3 (en) * 1988-10-28 1991-02-06 Siemens Aktiengesellschaft Easily curable photoresist
DE4038895C2 (en) * 1990-12-06 1998-07-02 Harald Dr Mueller Mixtures sensitive to light and radiation
JP3331222B2 (en) * 1992-02-27 2002-10-07 ジャパンエポキシレジン株式会社 Epoxy resin and epoxy resin composition
KR100342950B1 (en) * 1997-11-11 2002-10-19 가부시키가이샤 닛폰 쇼쿠바이 Curable Resin and Resin Composition
CN100358953C (en) * 2005-05-23 2008-01-02 容大油墨（惠州）有限公司 Liquid photosensitive welding resistant printing ink and its circuit board
JP6557155B2 (en) 2015-02-02 2019-08-07 株式会社日本触媒 Curable resin and method for producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3230560A1 (en) * 1981-08-20 1983-05-05 Hussain Kashif Dr. 8003 Zürich El-Ghatta Polymers, and a process for their preparation
DE3565546D1 (en) * 1984-06-29 1988-11-17 Siemens Ag Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation

Also Published As

Publication number Publication date
DK56288D0 (en) 1988-02-04
NO880592D0 (en) 1988-02-10
SE8800023D0 (en) 1988-01-07
SE9102977D0 (en) 1991-10-14
NO169720B (en) 1992-04-21
NO169720C (en) 1992-07-29
SE9102977L (en) 1993-04-15
SE469474B (en) 1993-07-12
DK56288A (en) 1988-08-12
DE3704149C2 (en) 1990-09-27
DE3704149A1 (en) 1988-08-25

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