DK56288D0 - RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE - Google Patents
RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USEInfo
- Publication number
- DK56288D0 DK56288D0 DK56288A DK56288A DK56288D0 DK 56288 D0 DK56288 D0 DK 56288D0 DK 56288 A DK56288 A DK 56288A DK 56288 A DK56288 A DK 56288A DK 56288 D0 DK56288 D0 DK 56288D0
- Authority
- DK
- Denmark
- Prior art keywords
- resints
- producing
- radiated
- currently
- currently radiated
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873704149 DE3704149A1 (en) | 1987-02-11 | 1987-02-11 | Radiation-curable resins, process for their preparation, and their use |
Publications (2)
Publication Number | Publication Date |
---|---|
DK56288D0 true DK56288D0 (en) | 1988-02-04 |
DK56288A DK56288A (en) | 1988-08-12 |
Family
ID=6320703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK56288A DK56288A (en) | 1987-02-11 | 1988-02-04 | RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3704149A1 (en) |
DK (1) | DK56288A (en) |
NO (1) | NO169720C (en) |
SE (2) | SE469474B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0365844A3 (en) * | 1988-10-28 | 1991-02-06 | Siemens Aktiengesellschaft | Easily curable photoresist |
DE4038895C2 (en) * | 1990-12-06 | 1998-07-02 | Harald Dr Mueller | Mixtures sensitive to light and radiation |
JP3331222B2 (en) * | 1992-02-27 | 2002-10-07 | ジャパンエポキシレジン株式会社 | Epoxy resin and epoxy resin composition |
KR100342950B1 (en) * | 1997-11-11 | 2002-10-19 | 가부시키가이샤 닛폰 쇼쿠바이 | Curable Resin and Resin Composition |
CN100358953C (en) * | 2005-05-23 | 2008-01-02 | 容大油墨(惠州)有限公司 | Liquid photosensitive welding resistant printing ink and its circuit board |
JP6557155B2 (en) | 2015-02-02 | 2019-08-07 | 株式会社日本触媒 | Curable resin and method for producing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3230560A1 (en) * | 1981-08-20 | 1983-05-05 | Hussain Kashif Dr. 8003 Zürich El-Ghatta | Polymers, and a process for their preparation |
ATE37889T1 (en) * | 1984-06-29 | 1988-10-15 | Siemens Ag | THERMOSTABLE, RADIATION CROSSLINKABLE POLYMER SYSTEM BASED ON BISPHENOLS AND EPICHLORHYDRIN AND METHOD FOR ITS USE. |
-
1987
- 1987-02-11 DE DE19873704149 patent/DE3704149A1/en active Granted
-
1988
- 1988-01-07 SE SE8800023A patent/SE469474B/en not_active IP Right Cessation
- 1988-02-04 DK DK56288A patent/DK56288A/en not_active Application Discontinuation
- 1988-02-10 NO NO880592A patent/NO169720C/en unknown
-
1991
- 1991-10-14 SE SE9102977A patent/SE9102977L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NO880592L (en) | 1988-08-12 |
DK56288A (en) | 1988-08-12 |
NO880592D0 (en) | 1988-02-10 |
SE9102977L (en) | 1993-04-15 |
SE9102977D0 (en) | 1991-10-14 |
SE8800023D0 (en) | 1988-01-07 |
DE3704149A1 (en) | 1988-08-25 |
NO169720C (en) | 1992-07-29 |
SE469474B (en) | 1993-07-12 |
DE3704149C2 (en) | 1990-09-27 |
NO169720B (en) | 1992-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |