SE7415124L - - Google Patents

Info

Publication number
SE7415124L
SE7415124L SE7415124A SE7415124A SE7415124L SE 7415124 L SE7415124 L SE 7415124L SE 7415124 A SE7415124 A SE 7415124A SE 7415124 A SE7415124 A SE 7415124A SE 7415124 L SE7415124 L SE 7415124L
Authority
SE
Sweden
Application number
SE7415124A
Inventor
J F Krumme
Original Assignee
Raythem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raythem Corp filed Critical Raythem Corp
Publication of SE7415124L publication Critical patent/SE7415124L/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/15Containers comprising an insulating or insulated base
    • H10W76/157Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00Packaging processes not covered by the other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
SE7415124A 1973-12-03 1974-12-03 SE7415124L (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (1)

Publication Number Publication Date
SE7415124L true SE7415124L (https=) 1975-06-04

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7415124A SE7415124L (https=) 1973-12-03 1974-12-03

Country Status (15)

Country Link
JP (1) JPS5842622B2 (https=)
AT (1) ATA964874A (https=)
AU (1) AU502556B2 (https=)
BE (1) BE822904A (https=)
CA (1) CA1042116A (https=)
CH (1) CH580379A5 (https=)
DE (1) DE2457116A1 (https=)
ES (1) ES432527A1 (https=)
FR (1) FR2253283B1 (https=)
GB (1) GB1484177A (https=)
HK (1) HK18478A (https=)
IL (1) IL46173A (https=)
IT (1) IT1033109B (https=)
NL (1) NL7415764A (https=)
SE (1) SE7415124L (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (https=) * 1974-06-27 1979-09-08
JPS57175442U (https=) * 1981-04-30 1982-11-05
JPS58100446A (ja) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp 真空封止方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
DE2457116A1 (de) 1975-08-21
IL46173A (en) 1977-08-31
ES432527A1 (es) 1977-03-01
FR2253283A1 (https=) 1975-06-27
FR2253283B1 (https=) 1979-08-10
ATA964874A (de) 1980-04-15
CH580379A5 (https=) 1976-09-30
AU7601974A (en) 1976-06-03
IT1033109B (it) 1979-07-10
CA1042116A (en) 1978-11-07
JPS5842622B2 (ja) 1983-09-21
IL46173A0 (en) 1975-03-13
AU502556B2 (en) 1979-08-02
HK18478A (en) 1978-04-14
BE822904A (fr) 1975-06-03
GB1484177A (en) 1977-09-01
JPS5087586A (https=) 1975-07-14
NL7415764A (nl) 1975-06-05

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