SE7413605L - - Google Patents

Info

Publication number
SE7413605L
SE7413605L SE7413605A SE7413605A SE7413605L SE 7413605 L SE7413605 L SE 7413605L SE 7413605 A SE7413605 A SE 7413605A SE 7413605 A SE7413605 A SE 7413605A SE 7413605 L SE7413605 L SE 7413605L
Authority
SE
Sweden
Prior art keywords
tier
support members
thyristor
tiers
framework
Prior art date
Application number
SE7413605A
Other languages
English (en)
Inventor
H Felkel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7413605L publication Critical patent/SE7413605L/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
  • Ac-Ac Conversion (AREA)
SE7413605A 1973-10-31 1974-10-29 SE7413605L (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732354663 DE2354663C3 (de) 1973-10-31 1973-10-31 Stromrichter

Publications (1)

Publication Number Publication Date
SE7413605L true SE7413605L (ru) 1975-05-02

Family

ID=5896961

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7413605A SE7413605L (ru) 1973-10-31 1974-10-29

Country Status (15)

Country Link
US (1) US3913003A (ru)
JP (1) JPS5074139A (ru)
AR (1) AR203579A1 (ru)
AT (1) AT329676B (ru)
BE (1) BE821545A (ru)
BR (1) BR7408819D0 (ru)
CA (1) CA1011392A (ru)
CH (1) CH570703A5 (ru)
DE (1) DE2354663C3 (ru)
ES (1) ES431495A1 (ru)
FR (1) FR2250201A1 (ru)
GB (1) GB1484700A (ru)
IT (1) IT1025232B (ru)
NL (1) NL7412712A (ru)
SE (1) SE7413605L (ru)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU656559A3 (ru) * 1975-08-25 1979-04-05 Сименс Аг (Фирма) Двенадцатифазна выпр мительна установка
JPS5850029B2 (ja) * 1981-09-26 1983-11-08 株式会社東芝 サイリスタ変換器
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4710850A (en) * 1986-02-19 1987-12-01 Siemens Aktiengesellschaft Tower design for high-voltage systems
DE3802593A1 (de) * 1988-01-29 1989-08-10 Heidelberger Druckmasch Ag Umrichter mit gleichspannungs-zwischenkreis
US5119286A (en) * 1989-12-28 1992-06-02 Sundstrand Corporation Modular circuit board
US4975825A (en) * 1990-01-16 1990-12-04 Sundstrand Corporation Stacked power converter
GB2242580B (en) * 1990-03-30 1994-06-15 Mitsubishi Electric Corp Inverter unit with improved bus-plate configuration
SE520788C2 (sv) * 1997-03-24 2003-08-26 Abb Ab VSC-strömriktare
US6713898B2 (en) * 2001-12-05 2004-03-30 General Electric Company Internal reactor thyristor stack
BR0318080B1 (pt) * 2003-02-12 2013-02-19 instalaÇço de energia eàlica.
DE102008018790A1 (de) * 2008-04-15 2009-10-22 Wobben, Aloys Windenergieanlage mit Stromschienen
DE102008050487A1 (de) * 2008-10-01 2010-04-15 Siemens Aktiengesellschaft Elektrische Vorrichtung mit einem Haltegerüst
CN101452927B (zh) * 2008-12-31 2010-06-02 中国电力科学研究院 一种自冷式晶闸管阀
US10418814B2 (en) 2015-12-08 2019-09-17 Smart Wires Inc. Transformers with multi-turn primary windings for dynamic power flow control
US10180696B2 (en) 2015-12-08 2019-01-15 Smart Wires Inc. Distributed impedance injection module for mitigation of the Ferranti effect
US10903653B2 (en) 2015-12-08 2021-01-26 Smart Wires Inc. Voltage agnostic power reactor
US10008317B2 (en) 2015-12-08 2018-06-26 Smart Wires Inc. Voltage or impedance-injection method using transformers with multiple secondary windings for dynamic power flow control
US10199150B2 (en) 2015-12-10 2019-02-05 Smart Wires Inc. Power transmission tower mounted series injection transformer
US10097037B2 (en) 2016-02-11 2018-10-09 Smart Wires Inc. System and method for distributed grid control with sub-cyclic local response capability
US10218175B2 (en) 2016-02-11 2019-02-26 Smart Wires Inc. Dynamic and integrated control of total power system using distributed impedance injection modules and actuator devices within and at the edge of the power grid
US10651633B2 (en) 2016-04-22 2020-05-12 Smart Wires Inc. Modular, space-efficient structures mounting multiple electrical devices
US10468880B2 (en) 2016-11-15 2019-11-05 Smart Wires Inc. Systems and methods for voltage regulation using split-conductors with loop current reduction
FR3060243B1 (fr) * 2016-12-12 2019-08-23 Institut Vedecom Module de commutation de puissance, convertisseur integrant celui-ci et procede de fabrication
US10666038B2 (en) 2017-06-30 2020-05-26 Smart Wires Inc. Modular FACTS devices with external fault current protection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3265934A (en) * 1964-01-30 1966-08-09 Westinghouse Electric Corp Capacitor stacking unit

Also Published As

Publication number Publication date
BR7408819D0 (pt) 1975-08-26
ES431495A1 (es) 1976-11-01
IT1025232B (it) 1978-08-10
FR2250201A1 (ru) 1975-05-30
GB1484700A (en) 1977-09-01
JPS5074139A (ru) 1975-06-18
DE2354663A1 (de) 1975-05-22
CH570703A5 (ru) 1975-12-15
BE821545A (fr) 1975-02-17
NL7412712A (nl) 1975-05-02
CA1011392A (en) 1977-05-31
DE2354663C3 (de) 1976-07-15
DE2354663B2 (de) 1975-12-11
ATA749574A (de) 1975-08-15
US3913003A (en) 1975-10-14
AT329676B (de) 1976-05-25
AR203579A1 (es) 1975-09-22

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