SE539310C2 - Microfluidic fan - Google Patents

Microfluidic fan Download PDF

Info

Publication number
SE539310C2
SE539310C2 SE1550715A SE1550715A SE539310C2 SE 539310 C2 SE539310 C2 SE 539310C2 SE 1550715 A SE1550715 A SE 1550715A SE 1550715 A SE1550715 A SE 1550715A SE 539310 C2 SE539310 C2 SE 539310C2
Authority
SE
Sweden
Prior art keywords
electrode
flow
gaseous fluid
emitter
potential difference
Prior art date
Application number
SE1550715A
Other languages
English (en)
Other versions
SE1550715A1 (en
Inventor
Thorslund Robert
Nilsson Peter
Björneklett Are
Original Assignee
Rapkap Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rapkap Ab filed Critical Rapkap Ab
Priority to SE1550715A priority Critical patent/SE539310C2/sv
Priority to KR1020187000191A priority patent/KR102563941B1/ko
Priority to US15/578,643 priority patent/US11078894B2/en
Priority to CN201680032038.4A priority patent/CN107924895B/zh
Priority to EP16803851.1A priority patent/EP3304590B1/en
Priority to JP2018515757A priority patent/JP6859331B2/ja
Priority to PCT/SE2016/050466 priority patent/WO2016195571A1/en
Priority to TW105116921A priority patent/TWI732763B/zh
Publication of SE1550715A1 publication Critical patent/SE1550715A1/sv
Publication of SE539310C2 publication Critical patent/SE539310C2/sv

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006Micropumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/06Cooling; Heating; Prevention of freezing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/63Cooling arrangements characterised by the use of a forced flow of gas, e.g. air using electrically-powered vibrating means; using ionic wind

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE1550715A 2015-06-03 2015-06-03 Microfluidic fan SE539310C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE1550715A SE539310C2 (sv) 2015-06-03 2015-06-03 Microfluidic fan
KR1020187000191A KR102563941B1 (ko) 2015-06-03 2016-05-20 마이크로유체 팬
US15/578,643 US11078894B2 (en) 2015-06-03 2016-05-20 Microfluidic fan
CN201680032038.4A CN107924895B (zh) 2015-06-03 2016-05-20 微流体风扇
EP16803851.1A EP3304590B1 (en) 2015-06-03 2016-05-20 Microfluidic fan
JP2018515757A JP6859331B2 (ja) 2015-06-03 2016-05-20 マイクロ流体ファン
PCT/SE2016/050466 WO2016195571A1 (en) 2015-06-03 2016-05-20 Microfluidic fan
TW105116921A TWI732763B (zh) 2015-06-03 2016-05-30 微流體扇

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE1550715A SE539310C2 (sv) 2015-06-03 2015-06-03 Microfluidic fan

Publications (2)

Publication Number Publication Date
SE1550715A1 SE1550715A1 (en) 2016-12-04
SE539310C2 true SE539310C2 (sv) 2017-06-27

Family

ID=57441314

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1550715A SE539310C2 (sv) 2015-06-03 2015-06-03 Microfluidic fan

Country Status (8)

Country Link
US (1) US11078894B2 (sv)
EP (1) EP3304590B1 (sv)
JP (1) JP6859331B2 (sv)
KR (1) KR102563941B1 (sv)
CN (1) CN107924895B (sv)
SE (1) SE539310C2 (sv)
TW (1) TWI732763B (sv)
WO (1) WO2016195571A1 (sv)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4227894A (en) * 1978-10-10 1980-10-14 Proynoff John D Ion generator or electrostatic environmental conditioner
US4504446A (en) * 1981-11-25 1985-03-12 Opt Systems Ozone generator
US4689056A (en) 1983-11-23 1987-08-25 Nippon Soken, Inc. Air cleaner using ionic wind
US5964997A (en) * 1997-03-21 1999-10-12 Sarnoff Corporation Balanced asymmetric electronic pulse patterns for operating electrode-based pumps
US6544485B1 (en) * 2001-01-29 2003-04-08 Sharper Image Corporation Electro-kinetic device with enhanced anti-microorganism capability
JP2000222072A (ja) 1999-02-01 2000-08-11 Shingijutsu Management:Kk 冷却装置
EP2405019A1 (en) * 2001-09-10 2012-01-11 Meso Scale Technologies LLC Methods, reagents, kits and apparatus for protein function analysis
CN100554681C (zh) * 2004-03-23 2009-10-28 株式会社大阪真空机器制作所 泵装置及其泵单元
WO2006079111A2 (en) 2005-01-24 2006-07-27 Thorrn Micro Technologies, Inc. Electro-hydrodynamic pump and cooling apparatus comprising an electro-hydrodynamic pump
US20100177519A1 (en) 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
WO2007112763A1 (en) * 2006-04-03 2007-10-11 Aureola Swedish Engineering Ab Method and apparatus for cooling and ventilation
US20080060794A1 (en) * 2006-09-12 2008-03-13 Neng Tyi Precision Industries Co., Ltd. Heat sink device generating an ionic wind
EP2126956A1 (en) * 2007-01-23 2009-12-02 Ventiva, Inc. Contoured electrodes for an electrostatic gas pump
US20100116460A1 (en) * 2008-11-10 2010-05-13 Tessera, Inc. Spatially distributed ventilation boundary using electrohydrodynamic fluid accelerators
US20100155025A1 (en) * 2008-12-19 2010-06-24 Tessera, Inc. Collector electrodes and ion collecting surfaces for electrohydrodynamic fluid accelerators
US20110094710A1 (en) * 2009-10-23 2011-04-28 Ventiva, Inc. Redundant emitter electrodes in an ion wind fan
US20110116206A1 (en) * 2009-11-16 2011-05-19 Mentornics, Inc. Cooling of electronic components using self-propelled ionic wind
US20120007742A1 (en) 2010-07-09 2012-01-12 Ventiva, Inc. Consumer electronics device having replaceable ion wind fan
JP5423625B2 (ja) * 2010-09-09 2014-02-19 株式会社デンソー Ehd流体を用いた冷却装置
JP6048292B2 (ja) * 2013-04-18 2016-12-21 株式会社デンソー Ehdポンプ
JP2014212625A (ja) * 2013-04-18 2014-11-13 株式会社デンソー Ehdポンプ
US20150114608A1 (en) * 2013-10-30 2015-04-30 Forcecon Technology Co., Ltd. Electrostatic air-cooled heat sink

Also Published As

Publication number Publication date
TW201710603A (zh) 2017-03-16
EP3304590B1 (en) 2021-02-17
KR102563941B1 (ko) 2023-08-04
US11078894B2 (en) 2021-08-03
SE1550715A1 (en) 2016-12-04
CN107924895B (zh) 2021-05-11
WO2016195571A1 (en) 2016-12-08
CN107924895A (zh) 2018-04-17
KR20180021778A (ko) 2018-03-05
EP3304590A4 (en) 2019-05-08
JP2018525966A (ja) 2018-09-06
JP6859331B2 (ja) 2021-04-14
US20180135613A1 (en) 2018-05-17
EP3304590A1 (en) 2018-04-11
TWI732763B (zh) 2021-07-11

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