SE406023C - SET TO MAKE A COMPOSITE WRAP FOR USE IN PRINTED CIRCUITS - Google Patents

SET TO MAKE A COMPOSITE WRAP FOR USE IN PRINTED CIRCUITS

Info

Publication number
SE406023C
SE406023C SE7405449A SE7405449A SE406023C SE 406023 C SE406023 C SE 406023C SE 7405449 A SE7405449 A SE 7405449A SE 7405449 A SE7405449 A SE 7405449A SE 406023 C SE406023 C SE 406023C
Authority
SE
Sweden
Prior art keywords
make
printed circuits
composite wrap
wrap
composite
Prior art date
Application number
SE7405449A
Other languages
Swedish (sv)
Other versions
SE406023B (en
Inventor
A M Wolski
Original Assignee
Yates Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yates Industries filed Critical Yates Industries
Publication of SE406023B publication Critical patent/SE406023B/en
Publication of SE406023C publication Critical patent/SE406023C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
SE7405449A 1973-04-25 1974-04-23 SET TO MAKE A COMPOSITE WRAP FOR USE IN PRINTED CIRCUITS SE406023C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35419673A 1973-04-25 1973-04-25

Publications (2)

Publication Number Publication Date
SE406023B SE406023B (en) 1979-01-15
SE406023C true SE406023C (en) 1987-04-23

Family

ID=23392262

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7405449A SE406023C (en) 1973-04-25 1974-04-23 SET TO MAKE A COMPOSITE WRAP FOR USE IN PRINTED CIRCUITS

Country Status (9)

Country Link
JP (1) JPS542179B2 (en)
BE (1) BE813813A (en)
DE (1) DE2413932C2 (en)
FR (1) FR2227351B1 (en)
GB (1) GB1458260A (en)
IT (1) IT1004196B (en)
LU (1) LU69919A1 (en)
NL (1) NL155600B (en)
SE (1) SE406023C (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434259Y2 (en) * 1974-07-12 1979-10-20
JPS5266962U (en) * 1975-11-12 1977-05-18
DE2659625C3 (en) * 1976-12-30 1981-07-02 Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg Process for the production of base material for the production of printed circuits
US4293617A (en) * 1979-12-26 1981-10-06 Gould Inc. Process for producing strippable copper on an aluminum carrier and the article so obtained
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
GB2091634B (en) * 1981-01-22 1984-12-05 Gen Electric Transfer lamination of vapour deposited copper thin sheets and films
JPS58122865A (en) * 1982-01-14 1983-07-21 高安　清輝 Composite material
US4534831A (en) * 1982-09-27 1985-08-13 Inoue-Japax Research Incorporated Method of and apparatus for forming a 3D article
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
SE9203327L (en) 1992-11-06 1993-12-20 Metfoils Ab Process for the production of printed circuit boards and their use
US6270889B1 (en) 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6319620B1 (en) 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6183880B1 (en) 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
JP3670179B2 (en) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
CN102442025A (en) * 2011-09-08 2012-05-09 深圳市必事达电子有限公司 Manufacture method for heat dissipation aluminum substrate
KR101944784B1 (en) 2017-01-16 2019-02-08 일진머티리얼즈 주식회사 Copper foil attached to the carrier foil
CN112941478A (en) * 2021-01-29 2021-06-11 山东金宝电子股份有限公司 Ultra-thin copper foil taking micro-arc oxidation treatment aluminum foil as carrier and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2433441A (en) * 1947-12-30 Electrolytic production of thin
US880484A (en) * 1904-06-29 1908-02-25 Edison Storage Battery Co Process of producing very thin sheet metal.
US3468765A (en) * 1966-08-04 1969-09-23 Nasa Method of plating copper on aluminum
US3565771A (en) * 1967-10-16 1971-02-23 Shipley Co Etching and metal plating silicon containing aluminum alloys
US3551122A (en) * 1967-12-18 1970-12-29 Shipley Co Surface finished aluminum alloys
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
US3866022A (en) * 1972-12-26 1975-02-11 Nasa System for generating timing and control signals

Also Published As

Publication number Publication date
IT1004196B (en) 1976-07-10
DE2413932C2 (en) 1984-08-30
BE813813A (en) 1974-08-16
LU69919A1 (en) 1974-08-06
FR2227351A1 (en) 1974-11-22
FR2227351B1 (en) 1979-06-15
GB1458260A (en) 1976-12-15
JPS542179B2 (en) 1979-02-03
NL155600B (en) 1978-01-16
DE2413932A1 (en) 1974-11-14
SE406023B (en) 1979-01-15
NL7404748A (en) 1974-10-29
JPS502658A (en) 1975-01-11

Similar Documents

Publication Publication Date Title
SE406023C (en) SET TO MAKE A COMPOSITE WRAP FOR USE IN PRINTED CIRCUITS
IT1042001B (en) IMPROVEMENTS RELATING TO LAMINATES
IT1042000B (en) IMPROVEMENTS RELATING TO LAMINATES
IT1049810B (en) PRINTING EQUIPMENT IN PARTICULAR FOR CALCULATORS
SE419097B (en) SET TO MAKE A DETERGENT COMPOSITION IN GRANULAR FORM
IT1000374B (en) ADHESIVE COMPOSITION FOR PRINTED CIRCUITS AND PROCEDURE FOR PRODUCING LAMINATES WITH IT
SE404441B (en) WAY TO CREATE A SET OF DIGITAL SIGNALS IN THE CORRESPONDENCE OF A HAND PRINTED SIGN
BR7402795D0 (en) CHASSIS INTENDED TO RECEIVE ELECTRONIC CIRCUITS
SE408426B (en) WAY TO MAKE D-HOMO-20 KETO CALCULATORS
IT980896B (en) IMPROVEMENTS TO ELECTRONIC CALCULATORS
BR7603648A (en) PERFECTING IN A MACHINE TO FORM GALLICIFORM ITEMS
SE422245B (en) WAY TO LOCATE ERRORS IN A CORD
SE417507B (en) SET TO PREPARE 2-ARYLAMINO-2-IMIDAZOLINE DERIVATIVES
SE420602B (en) SET TO PREPARE PYRAZINE-3-METOXI-2-CARBOXAMIDE DERIVATIVES
NL7501181A (en) PRINTED CIRCUIT WITH A SLIGHT TEND TO EKING.
SE421519B (en) SET TO MAKE PARALLELLE PIPEDIC PACKAGING CONTAINERS
SE427655B (en) SET TO MAKE ABIETAMIDE DERIVATIVES
SE427930B (en) SET TO RECOVER ORGANOTENNHALOGENIDES
IT1008331B (en) COMPOSITE PANEL WITH PRINTED CIRCUIT
SE419647B (en) SET TO MAKE TIAZOLISOKINOLINE DERIVATIVES
ZA744218B (en) Improvements in or relating to arrangements for operating a printing element
SE428471B (en) SET TO MAKE IMIDAZOLD DERIVATIVES
SE413958B (en) SET TO MAKE A TYRISTOR
SE420722B (en) SET TO PREPARE BENZHYDRYLOXY-ALKYLAMINE DERIVATIVES
SE7514519L (en) WAY TO PRODUCE LAMINATE TILES

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7405449-5

Effective date: 19940510

Format of ref document f/p: F