SE402516B - Sett att forbinda en integrerad krets med yttre, elektriska anslutningar - Google Patents

Sett att forbinda en integrerad krets med yttre, elektriska anslutningar

Info

Publication number
SE402516B
SE402516B SE7004299A SE429970A SE402516B SE 402516 B SE402516 B SE 402516B SE 7004299 A SE7004299 A SE 7004299A SE 429970 A SE429970 A SE 429970A SE 402516 B SE402516 B SE 402516B
Authority
SE
Sweden
Prior art keywords
connect
external
way
integrated circuit
electrical connections
Prior art date
Application number
SE7004299A
Other languages
English (en)
Swedish (sv)
Inventor
R Wiesner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE402516B publication Critical patent/SE402516B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
SE7004299A 1969-03-26 1970-03-26 Sett att forbinda en integrerad krets med yttre, elektriska anslutningar SE402516B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1915501A DE1915501C3 (de) 1969-03-26 1969-03-26 Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen

Publications (1)

Publication Number Publication Date
SE402516B true SE402516B (sv) 1978-07-03

Family

ID=5729405

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7004299A SE402516B (sv) 1969-03-26 1970-03-26 Sett att forbinda en integrerad krets med yttre, elektriska anslutningar

Country Status (9)

Country Link
US (1) US3745648A (https=)
JP (1) JPS4916222B1 (https=)
AT (1) AT305375B (https=)
CH (1) CH503374A (https=)
DE (1) DE1915501C3 (https=)
FR (1) FR2039895A5 (https=)
GB (1) GB1240977A (https=)
NL (1) NL6918609A (https=)
SE (1) SE402516B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2057126C3 (de) * 1970-05-14 1975-11-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
US3823467A (en) * 1972-07-07 1974-07-16 Westinghouse Electric Corp Solid-state circuit module
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4218701A (en) * 1978-07-24 1980-08-19 Citizen Watch Co., Ltd. Package for an integrated circuit having a container with support bars
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
DE3627372C3 (de) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen
DE3914756A1 (de) * 1989-05-05 1990-11-22 Platzer Schwedenbau Gmbh Verfahren zur herstellung einer rohrflanschverbindung
DE19520676A1 (de) * 1995-06-07 1996-12-12 Deutsche Telekom Ag Hybridschaltung und Verfahren zur Herstellung derselben
US6571468B1 (en) * 2001-02-26 2003-06-03 Saturn Electronics & Engineering, Inc. Traceless flip chip assembly and method
AT523450B1 (de) 2020-01-27 2025-04-15 Univ Linz Durchdringbares Element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
GB1240977A (en) 1971-07-28
FR2039895A5 (https=) 1971-01-15
US3745648A (en) 1973-07-17
DE1915501B2 (de) 1975-02-27
NL6918609A (https=) 1970-09-29
AT305375B (de) 1973-02-26
DE1915501C3 (de) 1975-10-16
DE1915501A1 (de) 1970-10-01
JPS4916222B1 (https=) 1974-04-20
CH503374A (de) 1971-02-15

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