CH503374A - Verfahren zum Verbinden einer integrierten Schaltung mit äusseren elektrischen Zuleitungen - Google Patents
Verfahren zum Verbinden einer integrierten Schaltung mit äusseren elektrischen ZuleitungenInfo
- Publication number
- CH503374A CH503374A CH446070A CH446070A CH503374A CH 503374 A CH503374 A CH 503374A CH 446070 A CH446070 A CH 446070A CH 446070 A CH446070 A CH 446070A CH 503374 A CH503374 A CH 503374A
- Authority
- CH
- Switzerland
- Prior art keywords
- integrated circuit
- supply lines
- electrical supply
- external electrical
- external
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49558—Insulating layers on lead frames, e.g. bridging members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1915501A DE1915501C3 (de) | 1969-03-26 | 1969-03-26 | Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen |
Publications (1)
Publication Number | Publication Date |
---|---|
CH503374A true CH503374A (de) | 1971-02-15 |
Family
ID=5729405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH446070A CH503374A (de) | 1969-03-26 | 1970-03-24 | Verfahren zum Verbinden einer integrierten Schaltung mit äusseren elektrischen Zuleitungen |
Country Status (9)
Country | Link |
---|---|
US (1) | US3745648A (de) |
JP (1) | JPS4916222B1 (de) |
AT (1) | AT305375B (de) |
CH (1) | CH503374A (de) |
DE (1) | DE1915501C3 (de) |
FR (1) | FR2039895A5 (de) |
GB (1) | GB1240977A (de) |
NL (1) | NL6918609A (de) |
SE (1) | SE402516B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2057126C3 (de) * | 1970-05-14 | 1975-11-06 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen |
US3823467A (en) * | 1972-07-07 | 1974-07-16 | Westinghouse Electric Corp | Solid-state circuit module |
US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
US4300153A (en) * | 1977-09-22 | 1981-11-10 | Sharp Kabushiki Kaisha | Flat shaped semiconductor encapsulation |
US4218701A (en) * | 1978-07-24 | 1980-08-19 | Citizen Watch Co., Ltd. | Package for an integrated circuit having a container with support bars |
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
DE3627372C3 (de) * | 1986-08-12 | 1994-04-14 | Loewe Opta Gmbh | Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen |
DE3914756A1 (de) * | 1989-05-05 | 1990-11-22 | Platzer Schwedenbau Gmbh | Verfahren zur herstellung einer rohrflanschverbindung |
DE19520676A1 (de) * | 1995-06-07 | 1996-12-12 | Deutsche Telekom Ag | Hybridschaltung und Verfahren zur Herstellung derselben |
US6571468B1 (en) * | 2001-02-26 | 2003-06-03 | Saturn Electronics & Engineering, Inc. | Traceless flip chip assembly and method |
AT523450A1 (de) | 2020-01-27 | 2021-08-15 | Univ Linz | Durchdringbares Element |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271625A (en) * | 1962-08-01 | 1966-09-06 | Signetics Corp | Electronic package assembly |
GB1015909A (en) * | 1963-12-30 | 1966-01-05 | Gen Micro Electronics Inc | Method of and product for packaging electronic devices |
US3374537A (en) * | 1965-03-22 | 1968-03-26 | Philco Ford Corp | Method of connecting leads to a semiconductive device |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
US3559285A (en) * | 1968-01-08 | 1971-02-02 | Jade Corp | Method of forming leads for attachment to semi-conductor devices |
-
1969
- 1969-03-26 DE DE1915501A patent/DE1915501C3/de not_active Expired
- 1969-12-11 NL NL6918609A patent/NL6918609A/xx unknown
-
1970
- 1970-03-18 US US00020519A patent/US3745648A/en not_active Expired - Lifetime
- 1970-03-24 CH CH446070A patent/CH503374A/de not_active IP Right Cessation
- 1970-03-24 FR FR7010487A patent/FR2039895A5/fr not_active Expired
- 1970-03-24 AT AT271770A patent/AT305375B/de not_active IP Right Cessation
- 1970-03-25 GB GB04376/70A patent/GB1240977A/en not_active Expired
- 1970-03-26 SE SE7004299A patent/SE402516B/xx unknown
- 1970-03-26 JP JP45024960A patent/JPS4916222B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1915501C3 (de) | 1975-10-16 |
FR2039895A5 (de) | 1971-01-15 |
GB1240977A (en) | 1971-07-28 |
AT305375B (de) | 1973-02-26 |
DE1915501B2 (de) | 1975-02-27 |
DE1915501A1 (de) | 1970-10-01 |
US3745648A (en) | 1973-07-17 |
SE402516B (sv) | 1978-07-03 |
JPS4916222B1 (de) | 1974-04-20 |
NL6918609A (de) | 1970-09-29 |
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Legal Events
Date | Code | Title | Description |
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PL | Patent ceased |