SE400575B - Bad for betning av koppar och dess legeringar - Google Patents

Bad for betning av koppar och dess legeringar

Info

Publication number
SE400575B
SE400575B SE7415648A SE7415648A SE400575B SE 400575 B SE400575 B SE 400575B SE 7415648 A SE7415648 A SE 7415648A SE 7415648 A SE7415648 A SE 7415648A SE 400575 B SE400575 B SE 400575B
Authority
SE
Sweden
Prior art keywords
celling
alloys
bath
copper
Prior art date
Application number
SE7415648A
Other languages
English (en)
Swedish (sv)
Other versions
SE7415648L (sv
Inventor
H Ericson
C O Fredriksson
Original Assignee
Nordnero Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordnero Ab filed Critical Nordnero Ab
Priority to SE7415648A priority Critical patent/SE400575B/xx
Priority to CA241,156A priority patent/CA1050401A/en
Priority to GB50253/75A priority patent/GB1503376A/en
Priority to US05/638,697 priority patent/US4051057A/en
Priority to DE19752555809 priority patent/DE2555809A1/de
Priority to AU87474/75A priority patent/AU497023B2/en
Priority to JP50148326A priority patent/JPS5817266B2/ja
Publication of SE7415648L publication Critical patent/SE7415648L/xx
Publication of SE400575B publication Critical patent/SE400575B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10Other heavy metals
    • C23G1/103Other heavy metals copper or alloys of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • ing And Chemical Polishing (AREA)
SE7415648A 1974-12-13 1974-12-13 Bad for betning av koppar och dess legeringar SE400575B (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE7415648A SE400575B (sv) 1974-12-13 1974-12-13 Bad for betning av koppar och dess legeringar
CA241,156A CA1050401A (en) 1974-12-13 1975-12-05 Solutions for cleaning surfaces of copper and its alloys
GB50253/75A GB1503376A (en) 1974-12-13 1975-12-08 Solutions for cleaning surfaces of copper and its alloys
US05/638,697 US4051057A (en) 1974-12-13 1975-12-08 Solutions for cleaning surfaces of copper and its alloys
DE19752555809 DE2555809A1 (de) 1974-12-13 1975-12-11 Loesung zum reinigen von oberflaechen aus kupfer und seinen legierungen
AU87474/75A AU497023B2 (en) 1974-12-13 1975-12-11 Solutions for cleaning surfaces of copper & its alloys
JP50148326A JPS5817266B2 (ja) 1974-12-13 1975-12-12 ドウ オヨビ ドウゴウキンノセンジヨウヨウエキ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7415648A SE400575B (sv) 1974-12-13 1974-12-13 Bad for betning av koppar och dess legeringar

Publications (2)

Publication Number Publication Date
SE7415648L SE7415648L (sv) 1976-06-14
SE400575B true SE400575B (sv) 1978-04-03

Family

ID=20322990

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7415648A SE400575B (sv) 1974-12-13 1974-12-13 Bad for betning av koppar och dess legeringar

Country Status (7)

Country Link
US (1) US4051057A (ja)
JP (1) JPS5817266B2 (ja)
AU (1) AU497023B2 (ja)
CA (1) CA1050401A (ja)
DE (1) DE2555809A1 (ja)
GB (1) GB1503376A (ja)
SE (1) SE400575B (ja)

Families Citing this family (60)

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DE2847267C2 (de) * 1978-10-31 1993-12-23 Decker Gmbh & Co Kg Geb Stabilisator für eine wäßrige Lösung zum Beizen und/oder chemischen Glänzen von Gegenständen aus Kupfer oder Kupferlegierungen in einem mehrstufigen Verfahren und Verwendung des Stabilisators
GB2116579B (en) * 1982-01-07 1985-08-29 Albright & Wilson Composition and method for cleaning hydrocarbon oil from hard surfaces
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US4600443A (en) * 1984-10-01 1986-07-15 Kennecott Corporation Process for removing surface oxides from a copper-base alloy
DE3533886A1 (de) * 1985-04-16 1987-03-26 Kraftwerk Union Ag Reinigungsverfahren
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US4946520A (en) * 1987-02-02 1990-08-07 Phelps Dodge Industries, Inc. Copper rod manufactured by casting, hot rolling and chemically shaving and pickling
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
WO1990010732A1 (en) * 1989-03-09 1990-09-20 Ici Australia Operations Proprietary Limited Benzotriazole based corrosion inhibiting compositions
AU619393B2 (en) * 1989-03-09 1992-01-23 Huntsman Surfactants Technology Corporation Benzotriazole based corrosion inhibiting compositions
DE4119102A1 (de) * 1991-06-10 1992-12-17 Henkel Kgaa Verfahren zur vorbehandlung von buntmetall-oberflaechen vor einer galvanischen metallbeschichtung
IT1251431B (it) * 1991-10-25 1995-05-09 Costante Fontana Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali
DE19525521B4 (de) * 1994-07-15 2007-04-26 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Verfahren zum Reinigen von Substraten
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EP0842332B1 (en) 1995-08-03 2001-05-23 EUROPA METALLI S.p.A. Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same
JP3673357B2 (ja) * 1997-01-27 2005-07-20 メルテックス株式会社 めっき用の前処理洗浄剤
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
JPH1129883A (ja) * 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
US6461534B2 (en) 1997-11-19 2002-10-08 Europa Metalli S. P. A. Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same
TW470785B (en) 1998-02-03 2002-01-01 Atotech Deutschland Gmbh Process for preliminary treatment of copper surfaces
TW460622B (en) 1998-02-03 2001-10-21 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
US6649081B1 (en) 1998-03-24 2003-11-18 Henkel Corporation Aqueous liquid deoxidizing composition and process for aluminum, with low foaming tendency
SG83733A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
SG83734A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Process to pretreat copper surfaces
US6197210B1 (en) * 1998-08-17 2001-03-06 Gerber Plumbing Fixtures Corp. Process for treating brass components to substantially eliminate leachabale lead
CN1204602C (zh) 1998-08-31 2005-06-01 日立化成工业株式会社 金属用研磨液及研磨方法
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US6855266B1 (en) 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
JP4391715B2 (ja) * 1999-08-13 2009-12-24 キャボット マイクロエレクトロニクス コーポレイション 化学機械的研磨系
US6395693B1 (en) 1999-09-27 2002-05-28 Cabot Microelectronics Corporation Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP4180925B2 (ja) 2001-04-09 2008-11-12 エイケイ・スティール・プロパティーズ・インコーポレイテッド ケイ素含有電気用鋼等級の過酸化水素酸洗
BR0208747B1 (pt) 2001-04-09 2011-02-08 processo e aparelho para remoção de peróxido de hidrogênio.
ATE343663T1 (de) 2001-04-09 2006-11-15 Ak Properties Inc Verfharen zum beizen von rostfreiem stahl unter verwendung von wasserstoffperoxid
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
WO2004085707A1 (en) * 2003-03-21 2004-10-07 Swagelok Company Aqueous metal finishing solution, methods for finishing metal components, system for cleaning metal components and finished brass products
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
CN100419125C (zh) * 2004-11-19 2008-09-17 中国科学院金属研究所 铜合金材料酸洗液
US20070017902A1 (en) * 2005-07-22 2007-01-25 Stmicroelectronics S.A. Method for the chemical treatment of copper surfaces for the removal of carbonaceous residues
JP4901259B2 (ja) * 2006-03-28 2012-03-21 能美防災株式会社 消火設備
US20080041813A1 (en) * 2006-08-21 2008-02-21 Atmel Corporation Methods and compositions for wet etching
JP5396113B2 (ja) * 2009-03-13 2014-01-22 Dowaメタルテック株式会社 銅合金材の酸化スケールの除去方法
JP2011179085A (ja) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd 電気めっき用前処理剤、電気めっきの前処理方法及び電気めっき方法
EP2453041B1 (en) 2010-11-10 2014-02-12 Atotech Deutschland GmbH Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
US20120288335A1 (en) * 2011-05-11 2012-11-15 Rodney Green Soil Stabilization Composition and Methods for Use
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
CN102995033B (zh) * 2012-10-17 2014-11-12 张志明 用于铜合金的清洗方法
US9828574B2 (en) 2015-01-13 2017-11-28 Cabot Microelectronics Corporation Cleaning composition and method for cleaning semiconductor wafers after CMP
JP6354086B1 (ja) * 2017-01-21 2018-07-11 メック株式会社 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法
US11130690B2 (en) * 2019-12-12 2021-09-28 Biocide Solutions, LLC Compound solution and method for livestock
CN113846361B (zh) * 2021-12-01 2022-02-18 天津三环乐喜新材料有限公司 一种烧结钕铁硼永磁体的电镀前处理方法及设备

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US2318559A (en) * 1941-04-30 1943-05-04 Monsanto Chemicals Material for and process of pickling copper or its alloys
US2428804A (en) * 1945-09-07 1947-10-14 Esther M Terry Copper cleaning composition
US2894905A (en) * 1958-05-02 1959-07-14 Pure Oil Co Inhibiting precipitation of iron oxide from iron-containing waters
US3345217A (en) * 1964-06-01 1967-10-03 Fremont Ind Inc Method of cleaning and phosphatizing copper circuits
NL154561B (nl) * 1965-04-27 1977-09-15 Lancy Lab Werkwijze voor het verwijderen van koper(i)oxyde en koper(ii)oxyde van een voorwerp met een oppervlak van koper of een koperlegering, werkwijze voor het bereiden van een hiervoor toe te passen beitsvloeistof en de door toepassing van deze beitswerkwijze verkregen voorwerpen.
US3556883A (en) * 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
US3809588A (en) * 1969-11-03 1974-05-07 R Zeblisky Peroxy containing compositions
BE759430A (fr) 1969-11-27 1971-05-25 Unilever Nv Compositions detergentes
JPS5221460B1 (ja) * 1971-04-26 1977-06-10
JPS5120972B1 (ja) * 1971-05-13 1976-06-29
US3869401A (en) * 1972-12-04 1975-03-04 Du Pont Stabilized acidic hydrogen peroxide solutions
JPS526853B2 (ja) * 1972-12-22 1977-02-25
JPS5332341B2 (ja) * 1973-03-27 1978-09-07

Also Published As

Publication number Publication date
CA1050401A (en) 1979-03-13
JPS5186030A (en) 1976-07-28
DE2555809A1 (de) 1976-06-16
AU8747475A (en) 1977-06-16
SE7415648L (sv) 1976-06-14
GB1503376A (en) 1978-03-08
US4051057A (en) 1977-09-27
JPS5817266B2 (ja) 1983-04-06
AU497023B2 (en) 1978-11-23

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