SE397902B - Forfarande for att astadkomma ett skyddsskikt pa ytan pa halvledarkomponenter - Google Patents
Forfarande for att astadkomma ett skyddsskikt pa ytan pa halvledarkomponenterInfo
- Publication number
- SE397902B SE397902B SE7501979A SE7501979A SE397902B SE 397902 B SE397902 B SE 397902B SE 7501979 A SE7501979 A SE 7501979A SE 7501979 A SE7501979 A SE 7501979A SE 397902 B SE397902 B SE 397902B
- Authority
- SE
- Sweden
- Prior art keywords
- replacing
- procedure
- surface layer
- semiconductor components
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Local Oxidation Of Silicon (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2436600A DE2436600A1 (de) | 1974-07-30 | 1974-07-30 | Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7501979L SE7501979L (sv) | 1976-02-02 |
SE397902B true SE397902B (sv) | 1977-11-21 |
Family
ID=5921905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7501979A SE397902B (sv) | 1974-07-30 | 1975-02-21 | Forfarande for att astadkomma ett skyddsskikt pa ytan pa halvledarkomponenter |
Country Status (11)
Country | Link |
---|---|
US (1) | US3947303A (el) |
JP (1) | JPS5429345B2 (el) |
AR (1) | AR202062A1 (el) |
BR (1) | BR7504290A (el) |
CH (1) | CH590557A5 (el) |
DE (1) | DE2436600A1 (el) |
ES (1) | ES435343A1 (el) |
FR (1) | FR2280977A1 (el) |
GB (1) | GB1509227A (el) |
IT (1) | IT1037271B (el) |
SE (1) | SE397902B (el) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56138914A (en) * | 1980-03-31 | 1981-10-29 | Nichicon Capacitor Ltd | Electrolytic condenser |
US4624724A (en) * | 1985-01-17 | 1986-11-25 | General Electric Company | Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base |
US4680072A (en) * | 1985-04-30 | 1987-07-14 | Wedco Inc. | Method and apparatus for producing multilayered plastic containing sheets |
DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
EP1593163B1 (en) * | 2003-01-30 | 2015-06-17 | PST Sensors (Pty) Limited | A thin film semiconductor device and method of manufacturing a thin film semiconductor device |
US7400037B2 (en) | 2004-12-30 | 2008-07-15 | Advanced Chip Engineering Tachnology Inc. | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3690984A (en) * | 1967-10-09 | 1972-09-12 | Western Electric Co | Releasable mounting method of placing an oriented array of semiconductor devices on the mounting |
US3706409A (en) * | 1970-02-26 | 1972-12-19 | Gen Electric | Semiconductor lead attachment system including a semiconductor pellet orientation plate |
US3766638A (en) * | 1970-08-31 | 1973-10-23 | Hugle Ind Inc | Wafer spreader |
US3739463A (en) * | 1971-10-18 | 1973-06-19 | Gen Electric | Method for lead attachment to pellets mounted in wafer alignment |
US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
-
1974
- 1974-07-30 DE DE2436600A patent/DE2436600A1/de active Pending
-
1975
- 1975-02-04 CH CH135075A patent/CH590557A5/xx not_active IP Right Cessation
- 1975-02-21 SE SE7501979A patent/SE397902B/xx unknown
- 1975-02-24 AR AR257737A patent/AR202062A1/es active
- 1975-03-06 ES ES435343A patent/ES435343A1/es not_active Expired
- 1975-03-10 US US05/556,867 patent/US3947303A/en not_active Expired - Lifetime
- 1975-03-20 FR FR7508680A patent/FR2280977A1/fr active Granted
- 1975-04-11 JP JP4347575A patent/JPS5429345B2/ja not_active Expired
- 1975-04-14 IT IT22297/75A patent/IT1037271B/it active
- 1975-05-15 GB GB20500/75A patent/GB1509227A/en not_active Expired
- 1975-07-08 BR BR5500/75D patent/BR7504290A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
SE7501979L (sv) | 1976-02-02 |
GB1509227A (en) | 1978-05-04 |
JPS5429345B2 (el) | 1979-09-22 |
CH590557A5 (el) | 1977-08-15 |
BR7504290A (pt) | 1976-07-13 |
JPS5117670A (el) | 1976-02-12 |
DE2436600A1 (de) | 1976-02-19 |
IT1037271B (it) | 1979-11-10 |
FR2280977B1 (el) | 1979-03-02 |
FR2280977A1 (fr) | 1976-02-27 |
AR202062A1 (es) | 1975-05-09 |
US3947303A (en) | 1976-03-30 |
ES435343A1 (es) | 1976-12-16 |
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