SE396846B - ELECTRICAL DEVICES INCLUDING A BODY OF SINGLE CRYSTAL SUMMER MATERIAL AND METHODS OF ITS MANUFACTURE - Google Patents
ELECTRICAL DEVICES INCLUDING A BODY OF SINGLE CRYSTAL SUMMER MATERIAL AND METHODS OF ITS MANUFACTUREInfo
- Publication number
- SE396846B SE396846B SE7413675A SE7413675A SE396846B SE 396846 B SE396846 B SE 396846B SE 7413675 A SE7413675 A SE 7413675A SE 7413675 A SE7413675 A SE 7413675A SE 396846 B SE396846 B SE 396846B
- Authority
- SE
- Sweden
- Prior art keywords
- manufacture
- methods
- single crystal
- devices including
- electrical devices
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41129573A | 1973-10-30 | 1973-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7413675L SE7413675L (en) | 1975-05-02 |
SE396846B true SE396846B (en) | 1977-10-03 |
Family
ID=23628360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7413675A SE396846B (en) | 1973-10-30 | 1974-10-30 | ELECTRICAL DEVICES INCLUDING A BODY OF SINGLE CRYSTAL SUMMER MATERIAL AND METHODS OF ITS MANUFACTURE |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5080788A (en) |
CA (1) | CA1020290A (en) |
DE (1) | DE2450902A1 (en) |
FR (1) | FR2249443B1 (en) |
GB (1) | GB1493814A (en) |
SE (1) | SE396846B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4042448A (en) * | 1975-11-26 | 1977-08-16 | General Electric Company | Post TGZM surface etch |
JPS57153446A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Semiconductor device for integrated circuit |
JPS5853859A (en) * | 1981-09-26 | 1983-03-30 | Matsushita Electric Ind Co Ltd | Integrated thin film element |
JPS5857015U (en) * | 1981-10-14 | 1983-04-18 | 東芝テック株式会社 | Straight tube fluorescent lamp fixture |
GB2136203B (en) * | 1983-03-02 | 1986-10-15 | Standard Telephones Cables Ltd | Through-wafer integrated circuit connections |
-
1974
- 1974-10-25 DE DE19742450902 patent/DE2450902A1/en not_active Withdrawn
- 1974-10-28 GB GB46514/74A patent/GB1493814A/en not_active Expired
- 1974-10-29 CA CA212,555A patent/CA1020290A/en not_active Expired
- 1974-10-30 FR FR7436242A patent/FR2249443B1/fr not_active Expired
- 1974-10-30 JP JP49124498A patent/JPS5080788A/ja active Pending
- 1974-10-30 SE SE7413675A patent/SE396846B/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPS5080788A (en) | 1975-07-01 |
FR2249443A1 (en) | 1975-05-23 |
SE7413675L (en) | 1975-05-02 |
GB1493814A (en) | 1977-11-30 |
CA1020290A (en) | 1977-11-01 |
FR2249443B1 (en) | 1978-09-29 |
DE2450902A1 (en) | 1975-05-07 |
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