SE374225B - - Google Patents
Info
- Publication number
- SE374225B SE374225B SE7106467A SE646771A SE374225B SE 374225 B SE374225 B SE 374225B SE 7106467 A SE7106467 A SE 7106467A SE 646771 A SE646771 A SE 646771A SE 374225 B SE374225 B SE 374225B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3993770A | 1970-05-22 | 1970-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE374225B true SE374225B (xx) | 1975-02-24 |
Family
ID=21908173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7106467A SE374225B (xx) | 1970-05-22 | 1971-05-18 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3643136A (xx) |
DE (2) | DE7119982U (xx) |
FR (1) | FR2090208A1 (xx) |
GB (1) | GB1356158A (xx) |
SE (1) | SE374225B (xx) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1553243A (en) * | 1975-08-04 | 1979-09-26 | Gen Electric | Semiconductor |
US4161746A (en) * | 1978-03-28 | 1979-07-17 | Westinghouse Electric Corp. | Glass sealed diode |
US4329707A (en) * | 1978-09-15 | 1982-05-11 | Westinghouse Electric Corp. | Glass-sealed power thyristor |
JPS5936430B2 (ja) * | 1980-01-17 | 1984-09-04 | 株式会社東芝 | 半導体装置 |
US4546376A (en) * | 1983-09-30 | 1985-10-08 | Citizen Watch Co., Ltd. | Device for semiconductor integrated circuits |
US4745455A (en) * | 1986-05-16 | 1988-05-17 | General Electric Company | Silicon packages for power semiconductor devices |
US5133795A (en) * | 1986-11-04 | 1992-07-28 | General Electric Company | Method of making a silicon package for a power semiconductor device |
US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
US5034044A (en) * | 1988-05-11 | 1991-07-23 | General Electric Company | Method of bonding a silicon package for a power semiconductor device |
US7560739B2 (en) * | 2004-06-29 | 2009-07-14 | Intel Corporation | Micro or below scale multi-layered heterostructure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL280849A (xx) * | 1961-07-12 | 1900-01-01 | ||
NL286978A (xx) * | 1961-12-27 | |||
US3320495A (en) * | 1963-07-02 | 1967-05-16 | Atomic Energy Commission | Surface-barrier diode for detecting high energy particles and method for preparing same |
US3343048A (en) * | 1964-02-20 | 1967-09-19 | Westinghouse Electric Corp | Four layer semiconductor switching devices having a shorted emitter and method of making the same |
US3337781A (en) * | 1965-06-14 | 1967-08-22 | Westinghouse Electric Corp | Encapsulation means for a semiconductor device |
US3505571A (en) * | 1965-09-30 | 1970-04-07 | Gen Electric | Glass covered semiconductor device |
-
1970
- 1970-05-22 US US39937A patent/US3643136A/en not_active Expired - Lifetime
-
1971
- 1971-05-18 SE SE7106467A patent/SE374225B/xx unknown
- 1971-05-19 FR FR7118102A patent/FR2090208A1/fr not_active Withdrawn
- 1971-05-22 DE DE19717119982U patent/DE7119982U/de not_active Expired
- 1971-05-22 DE DE19712125468 patent/DE2125468A1/de active Pending
- 1971-05-24 GB GB1675771A patent/GB1356158A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2125468A1 (de) | 1971-12-09 |
GB1356158A (en) | 1974-06-12 |
FR2090208A1 (xx) | 1972-01-14 |
US3643136A (en) | 1972-02-15 |
DE7119982U (de) | 1971-09-30 |