SE366776B - - Google Patents

Info

Publication number
SE366776B
SE366776B SE01310/70A SE131070A SE366776B SE 366776 B SE366776 B SE 366776B SE 01310/70 A SE01310/70 A SE 01310/70A SE 131070 A SE131070 A SE 131070A SE 366776 B SE366776 B SE 366776B
Authority
SE
Sweden
Application number
SE01310/70A
Inventor
F Schneble
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of SE366776B publication Critical patent/SE366776B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE01310/70A 1969-02-04 1970-02-02 SE366776B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79654269A 1969-02-04 1969-02-04

Publications (1)

Publication Number Publication Date
SE366776B true SE366776B (de) 1974-05-06

Family

ID=25168439

Family Applications (1)

Application Number Title Priority Date Filing Date
SE01310/70A SE366776B (de) 1969-02-04 1970-02-02

Country Status (9)

Country Link
US (1) US3607317A (de)
JP (1) JPS4834975B1 (de)
AT (1) AT313017B (de)
CH (1) CH533690A (de)
DK (1) DK139590B (de)
FR (1) FR2033925A5 (de)
GB (1) GB1263445A (de)
NL (1) NL165507C (de)
SE (1) SE366776B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (de) * 1975-03-14 1981-06-25
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
US4171225A (en) * 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
DE2635457C2 (de) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
DE3121015C2 (de) * 1981-05-27 1986-12-04 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben
US4405663A (en) * 1982-03-29 1983-09-20 Republic Steel Corporation Tin plating bath composition and process
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
DE3239090A1 (de) * 1982-10-22 1984-04-26 Bayer Ag, 5090 Leverkusen Schwarz-metallisierte substratoberflaechen
JPS6033358A (ja) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd 無電解銅めっき液
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
DE3622090C1 (de) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3246995A (en) * 1962-02-19 1966-04-19 Aerojet General Co Metal marking composition
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating

Also Published As

Publication number Publication date
US3607317A (en) 1971-09-21
DK139590B (da) 1979-03-12
AT313017B (de) 1974-01-25
NL165507C (nl) 1981-04-15
DK139590C (de) 1979-09-03
DE2005032B2 (de) 1975-06-12
JPS4834975B1 (de) 1973-10-25
NL7001599A (de) 1970-08-06
CH533690A (de) 1973-02-15
GB1263445A (en) 1972-02-09
DE2005032A1 (de) 1970-08-20
FR2033925A5 (de) 1970-12-04

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