SE363428B - - Google Patents
Info
- Publication number
- SE363428B SE363428B SE553071A SE553071A SE363428B SE 363428 B SE363428 B SE 363428B SE 553071 A SE553071 A SE 553071A SE 553071 A SE553071 A SE 553071A SE 363428 B SE363428 B SE 363428B
- Authority
- SE
- Sweden
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01041—Niobium [Nb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01058—Cerium [Ce]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H01L2924/01063—Europium [Eu]
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- H01L2924/01068—Erbium [Er]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
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- H01L2924/01084—Polonium [Po]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01088—Radium [Ra]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12035—Zener diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25503763A | 1963-01-30 | 1963-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE363428B true SE363428B (xx) | 1974-01-14 |
Family
ID=22966575
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE112264A SE325959B (xx) | 1963-01-30 | 1964-01-30 | |
SE112272A SE371043B (xx) | 1963-01-30 | 1964-01-30 | |
SE553071A SE363428B (xx) | 1963-01-30 | 1964-01-30 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE112264A SE325959B (xx) | 1963-01-30 | 1964-01-30 | |
SE112272A SE371043B (xx) | 1963-01-30 | 1964-01-30 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3491272A (xx) |
DE (1) | DE1281584B (xx) |
FR (1) | FR1386650A (xx) |
GB (1) | GB1052661A (xx) |
SE (3) | SE325959B (xx) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433601A (en) * | 1992-03-21 | 1995-07-18 | Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. | Deposit-free burner |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6603372A (xx) * | 1965-03-25 | 1966-09-26 | ||
DE1589496A1 (de) * | 1967-01-26 | 1970-03-26 | Bbc Brown Boveri & Cie | Halbleiterelement mit abgeschraegter Seitenflaeche und Verfahren zum Herstellen |
GB1230368A (xx) * | 1968-12-05 | 1971-04-28 | ||
US3628107A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with peripheral protective junction |
US3800190A (en) * | 1970-11-02 | 1974-03-26 | Bbc Brown Boveri & Cie | Cooling system for power semiconductor devices |
US3943547A (en) * | 1970-12-26 | 1976-03-09 | Hitachi, Ltd. | Semiconductor device |
DE7328984U (de) * | 1973-07-06 | 1975-05-15 | Bbc Ag Brown Boveri & Cie | Leistungshalbleiterbauelement |
US4110780A (en) * | 1973-07-06 | 1978-08-29 | Bbc Brown Boveri & Company, Limited | Semiconductor power component |
NL180265C (nl) * | 1976-06-21 | 1987-01-16 | Gen Electric | Halfgeleiderinrichting voor hoge spanning. |
DE3867371D1 (en) * | 1987-08-11 | 1992-02-13 | Bbc Brown Boveri & Cie | Gate-turn-off-thyristor. |
US5398630A (en) * | 1992-11-10 | 1995-03-21 | Us Shipbuilding Corporation, Inc. | Simplified midbody section for marine vessels and method and apparatus for construction |
DE19981343B4 (de) * | 1998-07-13 | 2004-03-18 | Infineon Technologies Ag | Asymmetrisch sperrendes Leistungshalbleiterbauelement |
US7268339B1 (en) * | 2005-09-27 | 2007-09-11 | Radiation Monitoring Devices, Inc. | Large area semiconductor detector with internal gain |
JP6336220B2 (ja) * | 2015-12-04 | 2018-06-06 | 三菱電機株式会社 | パワー半導体装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA509126A (en) * | 1949-05-28 | 1955-01-11 | Western Electric Company, Incorporated | Semiconductor translating devices |
US2980830A (en) * | 1956-08-22 | 1961-04-18 | Shockley William | Junction transistor |
NL113266C (xx) * | 1957-01-18 | |||
US2989424A (en) * | 1958-03-31 | 1961-06-20 | Westinghouse Electric Corp | Method of providing an oxide protective coating for semiconductors |
NL240714A (xx) * | 1958-07-02 | |||
NL242556A (xx) * | 1958-08-27 | |||
FR1228285A (fr) * | 1959-03-11 | 1960-08-29 | Structures à semi-conducteurs pour amplificateur paramétrique à micro-ondes | |
FR1243865A (fr) * | 1959-09-08 | 1960-10-21 | Telecommunications Sa | Perfectionnement à la réalisation des diodes de commutation p-n-p-n au silicium |
FR1273633A (fr) * | 1959-11-21 | 1961-10-13 | Siemens Ag | Procédé d'obtention d'éléments semi-conducteurs |
US3260634A (en) * | 1961-02-17 | 1966-07-12 | Motorola Inc | Method of etching a semiconductor wafer to provide tapered dice |
US3189799A (en) * | 1961-06-14 | 1965-06-15 | Microwave Ass | Semiconductor devices and method of fabricating them |
NL280641A (xx) * | 1961-07-07 | |||
US3255055A (en) * | 1963-03-20 | 1966-06-07 | Hoffman Electronics Corp | Semiconductor device |
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0
- GB GB1052661D patent/GB1052661A/en not_active Expired
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1963
- 1963-01-30 US US3491272D patent/US3491272A/en not_active Expired - Lifetime
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1964
- 1964-01-25 DE DEG39696A patent/DE1281584B/de active Pending
- 1964-01-30 SE SE112264A patent/SE325959B/xx unknown
- 1964-01-30 SE SE112272A patent/SE371043B/xx unknown
- 1964-01-30 SE SE553071A patent/SE363428B/xx unknown
- 1964-01-30 FR FR962077A patent/FR1386650A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5433601A (en) * | 1992-03-21 | 1995-07-18 | Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. | Deposit-free burner |
Also Published As
Publication number | Publication date |
---|---|
FR1386650A (fr) | 1965-01-22 |
SE371043B (xx) | 1974-11-04 |
SE325959B (xx) | 1970-07-13 |
US3491272A (en) | 1970-01-20 |
GB1052661A (xx) | 1900-01-01 |
DE1281584B (de) | 1968-10-31 |