SE363425B - - Google Patents

Info

Publication number
SE363425B
SE363425B SE16736/69A SE1673669A SE363425B SE 363425 B SE363425 B SE 363425B SE 16736/69 A SE16736/69 A SE 16736/69A SE 1673669 A SE1673669 A SE 1673669A SE 363425 B SE363425 B SE 363425B
Authority
SE
Sweden
Application number
SE16736/69A
Inventor
N Schink
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681812556 external-priority patent/DE1812556C/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE363425B publication Critical patent/SE363425B/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/91Controlling charging state at semiconductor-insulator interface
SE16736/69A 1968-12-04 1969-12-04 SE363425B (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681812556 DE1812556C (de) 1968-12-04 Halbleiterbauelement mit einem Überzug aus bleihaltigem Isolierstoff am pnÜbergang
DE19681816841 DE1816841A1 (de) 1968-12-04 1968-12-24 Verfahren zum Stabilisieren der Kennlinie eines Halbleiterbauelements

Publications (1)

Publication Number Publication Date
SE363425B true SE363425B (enExample) 1974-01-14

Family

ID=25756537

Family Applications (1)

Application Number Title Priority Date Filing Date
SE16736/69A SE363425B (enExample) 1968-12-04 1969-12-04

Country Status (7)

Country Link
US (1) US3751306A (enExample)
CH (1) CH539341A (enExample)
DE (1) DE1816841A1 (enExample)
FR (1) FR2025208B1 (enExample)
GB (2) GB1298800A (enExample)
NL (1) NL6917325A (enExample)
SE (1) SE363425B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369280A (en) * 1981-08-04 1983-01-18 General Electric Company Polybutylene terephthalate molding compositions and articles molded therefrom
JP3307918B2 (ja) * 1997-09-03 2002-07-29 オイペツク オイロペーイツシエ ゲゼルシヤフト フユール ライスツングスハルプライター エムベーハー ウント コンパニイ コマンデイートゲゼルシヤフト ホウ酸ガラス不動態化層のための防湿層

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259748A (enExample) * 1960-04-30
DE1182353C2 (de) * 1961-03-29 1973-01-11 Siemens Ag Verfahren zum Herstellen eines Halbleiter-bauelements, wie Halbleiterstromtor oder Flaechentransistor, mit einer hochohmigen n-Zone zwischen zwei p-Zonen im Halbleiter-koerper
FR1324553A (fr) * 1961-05-11 1963-04-19 Motorola Inc Procédé de protection des surfaces des matières semi-conductrices utilisées dansles dispositifs électroniques à conduction en phase solide, tels que les transistors et les diodes
NL131157C (enExample) * 1963-08-01
FR1443304A (fr) * 1965-05-11 1966-06-24 Comp Generale Electricite Procédé d'obtention d'un dépôt vitreux
US3447975A (en) * 1965-09-13 1969-06-03 Westinghouse Electric Corp Bilayer protective coating for exposed p-n junction surfaces
US3460003A (en) * 1967-01-30 1969-08-05 Corning Glass Works Metallized semiconductor device with fired-on glaze consisting of 25-35% pbo,10-15% b2o3,5-10% al2o3,and the balance sio2
US3506502A (en) * 1967-06-05 1970-04-14 Sony Corp Method of making a glass passivated mesa semiconductor device

Also Published As

Publication number Publication date
NL6917325A (enExample) 1970-06-08
FR2025208A1 (enExample) 1970-09-04
DE1812556A1 (de) 1970-06-11
US3751306A (en) 1973-08-07
CH539341A (de) 1973-07-15
DE1812556B2 (de) 1971-02-18
GB1298800A (en) 1972-12-06
GB1294889A (enExample) 1972-11-01
DE1816841A1 (de) 1970-07-02
FR2025208B1 (enExample) 1975-01-10

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