SE358511B - - Google Patents
Info
- Publication number
- SE358511B SE358511B SE14033/70A SE1403370A SE358511B SE 358511 B SE358511 B SE 358511B SE 14033/70 A SE14033/70 A SE 14033/70A SE 1403370 A SE1403370 A SE 1403370A SE 358511 B SE358511 B SE 358511B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691952216 DE1952216A1 (de) | 1969-10-16 | 1969-10-16 | Verfahren zum Trennen von aus einem Halbleitergrundkoerper herzustellenden Halbleiterchips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE358511B true SE358511B (https=) | 1973-07-30 |
Family
ID=5748393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE14033/70A SE358511B (https=) | 1969-10-16 | 1970-10-16 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3668774A (https=) |
| JP (1) | JPS4926741B1 (https=) |
| AT (1) | AT311421B (https=) |
| CH (1) | CH514936A (https=) |
| DE (1) | DE1952216A1 (https=) |
| FR (1) | FR2064378B1 (https=) |
| GB (1) | GB1265458A (https=) |
| NL (1) | NL7015236A (https=) |
| SE (1) | SE358511B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5463970A (en) * | 1977-10-31 | 1979-05-23 | Nakamasa Ezawa | Soap box for washing and arranging hair |
| DE19613561C2 (de) * | 1996-04-04 | 2002-04-11 | Micronas Gmbh | Verfahren zum Vereinzeln von in einem Körper miteinander verbundenen, elektrisch getesteten elektronischen Elementen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3513022A (en) * | 1967-04-26 | 1970-05-19 | Rca Corp | Method of fabricating semiconductor devices |
| USB355026I5 (https=) * | 1967-11-13 | |||
| US3590478A (en) * | 1968-05-20 | 1971-07-06 | Sony Corp | Method of forming electrical leads for semiconductor device |
-
1969
- 1969-10-16 DE DE19691952216 patent/DE1952216A1/de active Pending
-
1970
- 1970-10-12 CH CH1504270A patent/CH514936A/de not_active IP Right Cessation
- 1970-10-13 US US80400A patent/US3668774A/en not_active Expired - Lifetime
- 1970-10-14 AT AT928570A patent/AT311421B/de not_active IP Right Cessation
- 1970-10-15 FR FR7037301A patent/FR2064378B1/fr not_active Expired
- 1970-10-15 GB GB1265458D patent/GB1265458A/en not_active Expired
- 1970-10-16 JP JP9062670A patent/JPS4926741B1/ja active Pending
- 1970-10-16 SE SE14033/70A patent/SE358511B/xx unknown
- 1970-10-16 NL NL7015236A patent/NL7015236A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3668774A (en) | 1972-06-13 |
| DE1952216A1 (de) | 1971-04-29 |
| FR2064378A1 (https=) | 1971-07-23 |
| GB1265458A (https=) | 1972-03-01 |
| FR2064378B1 (https=) | 1974-09-06 |
| AT311421B (de) | 1973-11-12 |
| NL7015236A (https=) | 1971-04-20 |
| JPS4926741B1 (https=) | 1974-07-11 |
| CH514936A (de) | 1971-10-31 |