SE358072B - - Google Patents

Info

Publication number
SE358072B
SE358072B SE09234/70A SE923470A SE358072B SE 358072 B SE358072 B SE 358072B SE 09234/70 A SE09234/70 A SE 09234/70A SE 923470 A SE923470 A SE 923470A SE 358072 B SE358072 B SE 358072B
Authority
SE
Sweden
Application number
SE09234/70A
Inventor
H Duell
Original Assignee
Beyschlag B Apparatebau Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beyschlag B Apparatebau Gmbh filed Critical Beyschlag B Apparatebau Gmbh
Publication of SE358072B publication Critical patent/SE358072B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Insulating Bodies (AREA)
  • Thermistors And Varistors (AREA)
  • Structure Of Printed Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
SE09234/70A 1969-07-05 1970-07-02 SE358072B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691934238 DE1934238B2 (de) 1969-07-05 1969-07-05 Netzwerk mit elektrischen bauteilen und verfahren zu seiner herstellung

Publications (1)

Publication Number Publication Date
SE358072B true SE358072B (xx) 1973-07-16

Family

ID=5739022

Family Applications (1)

Application Number Title Priority Date Filing Date
SE09234/70A SE358072B (xx) 1969-07-05 1970-07-02

Country Status (8)

Country Link
US (1) US3697816A (xx)
AT (1) AT303166B (xx)
CA (1) CA953821A (xx)
DE (1) DE1934238B2 (xx)
DK (1) DK127360B (xx)
FR (1) FR2054086A5 (xx)
GB (1) GB1289019A (xx)
SE (1) SE358072B (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (de) * 1994-08-30 1996-03-07 Siemens Ag Stanzgitter zur Verbindung von elektrischen Bauelementen
JPS5826540Y2 (ja) * 1979-07-20 1983-06-08 富士通株式会社 プリント板パタ−ン
DE3148382A1 (de) * 1981-12-07 1983-06-09 Black & Decker, Inc., 19711 Newark, Del. Elektrogeraet, insbesondere elektrowerkzeug, mit steckbaren bauteilen
EP0105841A1 (fr) * 1982-10-05 1984-04-18 Ebauches Electroniques S.A. Bande de travail destinée à la fabrication de supports de composants pour montre
JPS627109A (ja) * 1985-07-03 1987-01-14 アルプス電気株式会社 ネツトワ−ク電子部品の製造方法
DE3810963C2 (de) * 1988-03-31 1995-11-23 Schunk Motorensysteme Gitter aus elektrisch leitendem Blechmaterial sowie Verfahren zur Herstellung eines Gitters
KR0165544B1 (ko) * 1990-03-05 1999-03-20 야마다 로꾸이찌 전자발음장치
DE19604614A1 (de) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Elektronisches Steuergerät mit einem Gehäuse
DE102011109609B3 (de) 2011-08-05 2013-01-17 Peter Fischer Verfahren zum Herstellen eines induktionsarmen Busbar
CN103388805B (zh) * 2013-07-01 2015-03-18 临安市新三联照明电器有限公司 一种基于支架料板的led灯丝支架成型方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2613252A (en) * 1947-09-23 1952-10-07 Erie Resistor Corp Electric circuit and component
US3216089A (en) * 1961-10-23 1965-11-09 Lockheed Aircraft Corp Method of connecting electrical components to spaced frame containing circuits and removing the frames
US3302066A (en) * 1961-11-06 1967-01-31 Litton Systems Inc Standardized welded wire modules
FR1344911A (fr) * 1962-07-18 1963-12-06 Bull Sa Machines Perfectionnements aux blocs modulaires de composants électriques
US3193611A (en) * 1963-01-28 1965-07-06 Mallory & Co Inc P R Electronic pellet with end terminals
US3284671A (en) * 1964-10-09 1966-11-08 Mallory & Co Inc P R Electronic assembly with dipsoldered leads

Also Published As

Publication number Publication date
GB1289019A (xx) 1972-09-13
DE1934238B2 (de) 1972-03-02
DE1934238A1 (de) 1971-01-28
CA953821A (en) 1974-08-27
DK127360B (da) 1973-10-22
AT303166B (de) 1972-11-10
US3697816A (en) 1972-10-10
FR2054086A5 (xx) 1971-04-16

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