SE357847B - - Google Patents
Info
- Publication number
- SE357847B SE357847B SE13134/70A SE1313470A SE357847B SE 357847 B SE357847 B SE 357847B SE 13134/70 A SE13134/70 A SE 13134/70A SE 1313470 A SE1313470 A SE 1313470A SE 357847 B SE357847 B SE 357847B
- Authority
- SE
- Sweden
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Wire Bonding (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86436769A | 1969-10-07 | 1969-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE357847B true SE357847B (de) | 1973-07-09 |
Family
ID=25343116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE13134/70A SE357847B (de) | 1969-10-07 | 1970-09-28 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3604108A (de) |
JP (1) | JPS4842386B1 (de) |
BE (1) | BE757111A (de) |
DE (1) | DE2049077A1 (de) |
FR (1) | FR2064181B1 (de) |
GB (1) | GB1325016A (de) |
NL (1) | NL7014656A (de) |
SE (1) | SE357847B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4873785A (de) * | 1971-12-31 | 1973-10-04 | ||
US3920949A (en) * | 1974-03-13 | 1975-11-18 | Mallory & Co Inc P R | Beam leaded device welding machine |
JPS5158617U (de) * | 1974-10-30 | 1976-05-08 | ||
US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
US4552300A (en) * | 1983-05-09 | 1985-11-12 | Pace, Incorporated | Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards |
US4593820A (en) * | 1984-03-28 | 1986-06-10 | International Business Machines Corporation | Robotic, in-transit, device tester/sorter |
US4934309A (en) * | 1988-04-15 | 1990-06-19 | International Business Machines Corporation | Solder deposition system |
US5148003A (en) * | 1990-11-28 | 1992-09-15 | International Business Machines Corporation | Modular test oven |
KR0175267B1 (ko) * | 1995-09-30 | 1999-04-01 | 김광호 | 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치 |
KR100392229B1 (ko) * | 2001-01-09 | 2003-07-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 인덱스헤드 |
WO2004106953A1 (ja) * | 2003-05-30 | 2004-12-09 | Advantest Corporation | 電子部品試験装置 |
CN112061919B (zh) * | 2020-08-31 | 2022-04-22 | 杭州临安森源电缆有限公司 | 一种电梯计时计数器测试方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3083291A (en) * | 1960-10-18 | 1963-03-26 | Kulicke & Soffa Mfg Co | Device for mounting and bonding semiconductor wafers |
US3230338A (en) * | 1962-07-02 | 1966-01-18 | Ibm | Selective heating apparatus |
US3271555A (en) * | 1965-03-29 | 1966-09-06 | Int Resistance Co | Handling and bonding apparatus |
US3333274A (en) * | 1965-04-21 | 1967-07-25 | Micro Tech Mfg Inc | Testing device |
US3337941A (en) * | 1965-05-27 | 1967-08-29 | Ibm | Recycle control circuit for a chip positioning machine |
US3534462A (en) * | 1967-08-31 | 1970-10-20 | Western Electric Co | Simultaneous multiple lead bonding |
-
0
- BE BE757111D patent/BE757111A/xx unknown
-
1969
- 1969-10-07 US US864367A patent/US3604108A/en not_active Expired - Lifetime
-
1970
- 1970-09-28 SE SE13134/70A patent/SE357847B/xx unknown
- 1970-10-06 FR FR707036093A patent/FR2064181B1/fr not_active Expired
- 1970-10-06 NL NL7014656A patent/NL7014656A/xx unknown
- 1970-10-06 GB GB4739270A patent/GB1325016A/en not_active Expired
- 1970-10-06 DE DE19702049077 patent/DE2049077A1/de active Pending
- 1970-10-07 JP JP45087603A patent/JPS4842386B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1325016A (en) | 1973-08-01 |
JPS4842386B1 (de) | 1973-12-12 |
DE2049077A1 (de) | 1971-04-08 |
FR2064181B1 (de) | 1974-03-01 |
FR2064181A1 (de) | 1971-07-16 |
BE757111A (fr) | 1971-03-16 |
US3604108A (en) | 1971-09-14 |
NL7014656A (de) | 1971-04-13 |