SE350874B - - Google Patents
Info
- Publication number
- SE350874B SE350874B SE02909/70A SE290970A SE350874B SE 350874 B SE350874 B SE 350874B SE 02909/70 A SE02909/70 A SE 02909/70A SE 290970 A SE290970 A SE 290970A SE 350874 B SE350874 B SE 350874B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE02909/70A SE350874B (US20110158925A1-20110630-C00042.png) | 1970-03-05 | 1970-03-05 | |
| US115289A US3649738A (en) | 1970-03-05 | 1971-02-16 | Semiconductor device |
| SU1630418A SU503563A3 (ru) | 1970-03-05 | 1971-02-25 | Полупроводниковое устройство |
| DE2109116A DE2109116C3 (de) | 1970-03-05 | 1971-02-26 | Halbleiteranordnung mit einem Halbleiterbauelement und einem Kühlmittelbehälter |
| GB2306071*A GB1333190A (en) | 1970-03-05 | 1971-04-19 | Semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE02909/70A SE350874B (US20110158925A1-20110630-C00042.png) | 1970-03-05 | 1970-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE350874B true SE350874B (US20110158925A1-20110630-C00042.png) | 1972-11-06 |
Family
ID=20260980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE02909/70A SE350874B (US20110158925A1-20110630-C00042.png) | 1970-03-05 | 1970-03-05 |
Country Status (5)
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2160001C2 (de) * | 1971-12-03 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Halbleiteranordnung, insbesondere Thyristorbaugruppe |
| US3800191A (en) * | 1972-10-26 | 1974-03-26 | Borg Warner | Expandible pressure mounted semiconductor assembly |
| CS159563B1 (US20110158925A1-20110630-C00042.png) * | 1972-12-28 | 1975-01-31 | ||
| US3989095A (en) * | 1972-12-28 | 1976-11-02 | Ckd Praha, Oborovy Podnik | Semi conductor cooling system |
| US3972063A (en) * | 1973-10-19 | 1976-07-27 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
| US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
| US4009423A (en) * | 1975-07-02 | 1977-02-22 | Honeywell Information Systems, Inc. | Liquid cooled heat exchanger for electronic power supplies |
| CS179822B1 (en) * | 1975-09-08 | 1977-11-30 | Petr Novak | Cooling and pressuring equipment esp. for power semiconductive elements |
| US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
| US4167031A (en) * | 1978-06-21 | 1979-09-04 | Bell Telephone Laboratories, Incorporated | Heat dissipating assembly for semiconductor devices |
| US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
| US4296455A (en) * | 1979-11-23 | 1981-10-20 | International Business Machines Corporation | Slotted heat sinks for high powered air cooled modules |
| US4532426A (en) * | 1983-06-17 | 1985-07-30 | Hughes Aircraft Company | Wafer height correction system for focused beam system |
| JPS60160149A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路装置の冷却方式 |
| CA1227886A (en) * | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
| US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
| DE3575206D1 (de) * | 1984-09-21 | 1990-02-08 | Siemens Ag | Einrichtung fuer die funktionspruefung integrierter schaltkreise. |
| US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
| US4721996A (en) * | 1986-10-14 | 1988-01-26 | Unisys Corporation | Spring loaded module for cooling integrated circuit packages directly with a liquid |
| US5040053A (en) * | 1988-05-31 | 1991-08-13 | Ncr Corporation | Cryogenically cooled integrated circuit apparatus |
| US4865331A (en) * | 1988-09-15 | 1989-09-12 | Ncr Corporation | Differential temperature seal |
| US5050036A (en) * | 1989-10-24 | 1991-09-17 | Amdahl Corporation | Liquid cooled integrated circuit assembly |
| EP0560478B1 (en) * | 1992-02-10 | 1998-10-14 | Nec Corporation | Cooling structure for electronic circuit package |
| US5369550A (en) * | 1992-09-02 | 1994-11-29 | Vlsi Technology, Inc. | Method and apparatus for cooling a molded-plastic integrated-circuit package |
| US6035523A (en) * | 1995-06-16 | 2000-03-14 | Apple Computer, Inc. | Method and apparatus for supporting a component on a substrate |
| SE524204C2 (sv) * | 2001-07-19 | 2004-07-06 | Denso Corp | Värmeansamlare med ett membran vilket tar emot ett fluidtryck |
| DE10164522B4 (de) * | 2001-12-17 | 2005-05-25 | Siemens Ag | Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung |
| DE10207873A1 (de) * | 2002-02-23 | 2003-09-04 | Modine Mfg Co | Kühlvorrichtung für elektronische/elektrische Komponenten |
| US20050039884A1 (en) * | 2003-08-20 | 2005-02-24 | Ivan Pawlenko | Conformal heat sink |
| ATE464524T1 (de) * | 2005-02-18 | 2010-04-15 | Ebm Papst St Georgen Gmbh & Co | Wärmetauscher |
| US8176972B2 (en) * | 2006-08-31 | 2012-05-15 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
| KR101799485B1 (ko) * | 2007-12-07 | 2017-11-20 | 필립스 라이팅 홀딩 비.브이. | 내부 합성 제트를 이용한 냉각 장치 |
| RU2449417C2 (ru) * | 2009-06-01 | 2012-04-27 | Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) | Способ охлаждения полупроводниковых тепловыделяющих электронных компонентов через биметаллические термоэлектрические электроды |
| JP5481680B2 (ja) * | 2010-04-28 | 2014-04-23 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US20110303403A1 (en) * | 2010-06-11 | 2011-12-15 | International Business Machines Corporation | Flexible Heat Exchanger |
| US9721870B2 (en) * | 2014-12-05 | 2017-08-01 | International Business Machines Corporation | Cooling structure for electronic boards |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB787383A (en) * | 1952-05-14 | 1957-12-04 | Onera (Off Nat Aerospatiale) | Process for producing superficial protective layers |
| DE1714910U (de) * | 1953-10-19 | 1956-01-12 | Licentia Gmbh | Elektrisch unsymmetrisch leitendes system. |
| NL96864C (US20110158925A1-20110630-C00042.png) * | 1954-01-14 | 1900-01-01 | ||
| BE555902A (US20110158925A1-20110630-C00042.png) * | 1956-03-22 | |||
| US2958021A (en) * | 1958-04-23 | 1960-10-25 | Texas Instruments Inc | Cooling arrangement for transistor |
| NL281641A (US20110158925A1-20110630-C00042.png) * | 1961-08-04 | 1900-01-01 | ||
| DE1976270U (de) * | 1965-02-20 | 1968-01-04 | Siemens Ag | Halbleiteranordnung. |
| DE1539325A1 (de) * | 1966-08-04 | 1969-12-11 | Siemens Ag | Druckstueck zur oertlichen Fixierung eines thermoelektrischen Bauelements |
| US3400543A (en) * | 1966-10-31 | 1968-09-10 | Peter G. Ross | Semi-conductor cooling means |
| US3581163A (en) * | 1968-04-09 | 1971-05-25 | Gen Electric | High-current semiconductor rectifier assemblies |
| DE1914790A1 (de) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
| DE2348207A1 (de) * | 1973-09-25 | 1975-04-17 | Siemens Ag | Thyristorsaeule |
-
1970
- 1970-03-05 SE SE02909/70A patent/SE350874B/xx unknown
-
1971
- 1971-02-16 US US115289A patent/US3649738A/en not_active Expired - Lifetime
- 1971-02-25 SU SU1630418A patent/SU503563A3/ru active
- 1971-02-26 DE DE2109116A patent/DE2109116C3/de not_active Expired
- 1971-04-19 GB GB2306071*A patent/GB1333190A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2109116A1 (de) | 1971-09-16 |
| SU503563A3 (ru) | 1976-02-15 |
| DE2109116C3 (de) | 1982-06-03 |
| GB1333190A (en) | 1973-10-10 |
| DE2109116B2 (de) | 1974-08-29 |
| US3649738A (en) | 1972-03-14 |
