SE337432B - - Google Patents

Info

Publication number
SE337432B
SE337432B SE12160/67A SE1216067A SE337432B SE 337432 B SE337432 B SE 337432B SE 12160/67 A SE12160/67 A SE 12160/67A SE 1216067 A SE1216067 A SE 1216067A SE 337432 B SE337432 B SE 337432B
Authority
SE
Sweden
Application number
SE12160/67A
Inventor
F Sias
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE337432B publication Critical patent/SE337432B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SE12160/67A 1966-09-02 1967-09-01 SE337432B (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57703466A 1966-09-02 1966-09-02
US76860568A 1968-09-25 1968-09-25

Publications (1)

Publication Number Publication Date
SE337432B true SE337432B (xx) 1971-08-09

Family

ID=27077139

Family Applications (1)

Application Number Title Priority Date Filing Date
SE12160/67A SE337432B (xx) 1966-09-02 1967-09-01

Country Status (4)

Country Link
US (1) US3471757A (xx)
DE (2) DE1589847B2 (xx)
GB (1) GB1191887A (xx)
SE (1) SE337432B (xx)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3581160A (en) * 1968-12-23 1971-05-25 Gen Electric Semiconductor rectifier assembly having high explosion rating
US3573569A (en) * 1969-08-12 1971-04-06 Gen Motors Corp Controlled rectifier mounting assembly
US3661013A (en) * 1969-12-23 1972-05-09 Electric Regulator Corp Semiconductor assembly
US3626271A (en) * 1969-12-29 1971-12-07 Gen Electric Hvdc matrix design
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US3718841A (en) * 1971-07-09 1973-02-27 Gen Electric Modular rectifier holding assembly with heat sink supporting circuit protecting means
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
US3936704A (en) * 1974-11-18 1976-02-03 Chrysler Corporation Mounting arrangement for electronic semi-conductor devices
CH601918A5 (xx) * 1976-09-29 1978-07-14 Schlatter Ag
US4243894A (en) * 1978-10-02 1981-01-06 Eaton Corporation Solid state motor control universal assembly means and method
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
EP0064383A3 (en) * 1981-05-06 1984-06-27 LUCAS INDUSTRIES public limited company A semi-conductor package
JPS589349A (ja) * 1981-07-10 1983-01-19 Hitachi Ltd Ｇｔｏスタツク
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
US4583005A (en) * 1984-07-23 1986-04-15 Sundstrand Corporation Solid state switch assembly
GB2189343B (en) * 1986-04-02 1990-11-14 Int Rectifier Co Ltd Semi-conductor modules
US4777560A (en) * 1987-09-02 1988-10-11 Microelectronics And Computer Technology Corporation Gas heat exchanger
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US7350561B2 (en) * 2006-03-15 2008-04-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with combined fins
US20090103342A1 (en) * 2007-10-17 2009-04-23 Saul Lin Silicon-controlled rectifier with a heat-dissipating structure
US7839642B2 (en) * 2008-04-04 2010-11-23 Liebert Corporation Heat-sink brace for fault-force support

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1862936A (en) * 1930-01-11 1932-06-14 Int Precipitation Co Rectifying apparatus
US2153434A (en) * 1934-11-15 1939-04-04 Mallory & Co Inc P R Rectifier
NL94441C (xx) * 1951-09-15
US2803791A (en) * 1952-07-31 1957-08-20 Philips Corp Blocking layer rectifier cells
GB806596A (en) * 1955-04-01 1958-12-31 Gen Electric Co Ltd Improvements in or relating to semi-conductor devices
BE620870A (xx) * 1961-08-04 1900-01-01
GB1001269A (xx) * 1960-09-30 1900-01-01
BE623873A (xx) * 1961-10-24 1900-01-01

Also Published As

Publication number Publication date
US3471757A (en) 1969-10-07
DE1589847A1 (de) 1971-02-18
DE1589847B2 (de) 1972-07-20
DE6609863U (de) 1972-10-19
GB1191887A (en) 1970-05-13

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