SE332327B - - Google Patents
Info
- Publication number
- SE332327B SE332327B SE132567A SE132567A SE332327B SE 332327 B SE332327 B SE 332327B SE 132567 A SE132567 A SE 132567A SE 132567 A SE132567 A SE 132567A SE 332327 B SE332327 B SE 332327B
- Authority
- SE
- Sweden
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52389766A | 1966-02-01 | 1966-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE332327B true SE332327B (de) | 1971-02-01 |
Family
ID=24086884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE132567A SE332327B (de) | 1966-02-01 | 1967-01-30 |
Country Status (8)
| Country | Link |
|---|---|
| CH (1) | CH491206A (de) |
| DE (1) | DE1621307B2 (de) |
| DK (1) | DK129661B (de) |
| ES (1) | ES336273A1 (de) |
| FR (1) | FR1509788A (de) |
| GB (1) | GB1176051A (de) |
| NL (1) | NL153604C (de) |
| SE (1) | SE332327B (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1135903A (en) * | 1978-09-13 | 1982-11-23 | John F. Mccormack | Electroless copper deposition process having faster plating rates |
| DE102010012204B4 (de) | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
-
1967
- 1967-01-25 DE DE19671621307 patent/DE1621307B2/de active Pending
- 1967-01-25 CH CH108467A patent/CH491206A/de not_active IP Right Cessation
- 1967-01-30 SE SE132567A patent/SE332327B/xx unknown
- 1967-01-30 GB GB437867A patent/GB1176051A/en not_active Expired
- 1967-01-31 DK DK53867A patent/DK129661B/da unknown
- 1967-01-31 ES ES0336273A patent/ES336273A1/es not_active Expired
- 1967-02-01 FR FR93312A patent/FR1509788A/fr not_active Expired
- 1967-02-01 NL NL6701525A patent/NL153604C/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CH491206A (de) | 1970-05-31 |
| NL6701525A (de) | 1967-08-02 |
| DE1621307B2 (de) | 1972-01-05 |
| ES336273A1 (es) | 1967-12-16 |
| FR1509788A (fr) | 1968-01-12 |
| GB1176051A (en) | 1970-01-01 |
| NL153604C (nl) | 1980-05-16 |
| NL153604B (nl) | 1977-06-15 |
| DK129661B (da) | 1974-11-04 |
| DK129661C (de) | 1975-04-01 |
| DE1621307A1 (de) | 1971-06-03 |