SE323570B - - Google Patents
Info
- Publication number
- SE323570B SE323570B SE12047/67A SE1204767A SE323570B SE 323570 B SE323570 B SE 323570B SE 12047/67 A SE12047/67 A SE 12047/67A SE 1204767 A SE1204767 A SE 1204767A SE 323570 B SE323570 B SE 323570B
- Authority
- SE
- Sweden
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
- H01L2224/78282—Resistance welding electrodes, i.e. for ohmic heating in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85238—Applying energy for connecting using electric resistance welding, i.e. ohmic heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42374665A | 1965-01-06 | 1965-01-06 | |
US59106866A | 1966-08-31 | 1966-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE323570B true SE323570B (ko) | 1970-05-04 |
Family
ID=24364928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE12047/67A SE323570B (ko) | 1965-01-06 | 1967-08-30 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3507033A (ko) |
BE (1) | BE703110A (ko) |
DE (1) | DE1627658A1 (ko) |
ES (1) | ES344740A2 (ko) |
FR (1) | FR93437E (ko) |
GB (1) | GB1181280A (ko) |
NL (1) | NL6711844A (ko) |
SE (1) | SE323570B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60223149A (ja) * | 1984-04-19 | 1985-11-07 | Hitachi Ltd | 半導体装置 |
GB2193672B (en) * | 1984-04-19 | 1988-09-28 | Hitachi Ltd | Semiconductor device |
JP2001267355A (ja) * | 2000-03-17 | 2001-09-28 | Murata Mfg Co Ltd | ワイヤボンディング方法およびこのワイヤボンディング方法を用いた弾性表面波装置 |
US7175722B2 (en) * | 2002-08-16 | 2007-02-13 | Walker Donna M | Methods and apparatus for stress relief using multiple energy sources |
DE102005045100A1 (de) * | 2005-09-21 | 2007-03-29 | Infineon Technologies Ag | Verfahren zum Herstellen eines Leistungshalbleitermoduls |
WO2012099771A1 (en) * | 2011-01-17 | 2012-07-26 | Orthodyne Electronics Corporation | Systems and methods for processing ribbon and wire in ultrasonic bonding systems |
US9314869B2 (en) * | 2012-01-13 | 2016-04-19 | Asm Technology Singapore Pte. Ltd. | Method of recovering a bonding apparatus from a bonding failure |
FR2999290B1 (fr) * | 2012-12-12 | 2016-01-01 | Areva | Procede et dispositif de controle volumique par ultrasons de la presence de defauts dans une soudure |
EP3570318A1 (en) * | 2018-05-15 | 2019-11-20 | Infineon Technologies AG | Method for bonding an electrically conductive element to a bonding partner |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2946119A (en) * | 1956-04-23 | 1960-07-26 | Aeroprojects Inc | Method and apparatus employing vibratory energy for bonding metals |
NL261280A (ko) * | 1960-02-25 | 1900-01-01 | ||
US3125803A (en) * | 1960-10-24 | 1964-03-24 | Terminals | |
US3101404A (en) * | 1962-01-29 | 1963-08-20 | Joseph M Hill | Welding method employing ultrasonic energy |
US3256465A (en) * | 1962-06-08 | 1966-06-14 | Signetics Corp | Semiconductor device assembly with true metallurgical bonds |
US3235959A (en) * | 1962-06-25 | 1966-02-22 | Alloys Res & Mfg Corp | Brazing aluminum based parts |
US3316628A (en) * | 1964-12-30 | 1967-05-02 | United Aircraft Corp | Bonding of semiconductor devices to substrates |
-
1966
- 1966-08-31 US US591068A patent/US3507033A/en not_active Expired - Lifetime
-
1967
- 1967-07-05 GB GB30935/67A patent/GB1181280A/en not_active Expired
- 1967-08-25 BE BE703110D patent/BE703110A/xx unknown
- 1967-08-26 ES ES344740A patent/ES344740A2/es not_active Expired
- 1967-08-28 DE DE19671627658 patent/DE1627658A1/de active Pending
- 1967-08-29 NL NL6711844A patent/NL6711844A/xx unknown
- 1967-08-30 FR FR119453A patent/FR93437E/fr not_active Expired
- 1967-08-30 SE SE12047/67A patent/SE323570B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3507033A (en) | 1970-04-21 |
FR93437E (fr) | 1969-03-28 |
BE703110A (ko) | 1968-01-15 |
ES344740A2 (es) | 1968-10-16 |
DE1627658A1 (de) | 1970-12-03 |
NL6711844A (ko) | 1968-03-01 |
GB1181280A (en) | 1970-02-11 |