GB2193672B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB2193672B
GB2193672B GB08720643A GB8720643A GB2193672B GB 2193672 B GB2193672 B GB 2193672B GB 08720643 A GB08720643 A GB 08720643A GB 8720643 A GB8720643 A GB 8720643A GB 2193672 B GB2193672 B GB 2193672B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08720643A
Other versions
GB8720643D0 (en
GB2193672A (en
Inventor
Susumu Okikawa
Hiroshi Mikino
Hiromichi Suzuki
Wahei Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59079113A external-priority patent/JPS60223149A/en
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8720643D0 publication Critical patent/GB8720643D0/en
Publication of GB2193672A publication Critical patent/GB2193672A/en
Application granted granted Critical
Publication of GB2193672B publication Critical patent/GB2193672B/en
Expired legal-status Critical Current

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
GB08720643A 1984-04-19 1987-09-02 Semiconductor device Expired GB2193672B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59079113A JPS60223149A (en) 1984-04-19 1984-04-19 Semiconductor device
GB08503143A GB2157607B (en) 1984-04-19 1985-02-07 Semiconductor device

Publications (3)

Publication Number Publication Date
GB8720643D0 GB8720643D0 (en) 1987-10-07
GB2193672A GB2193672A (en) 1988-02-17
GB2193672B true GB2193672B (en) 1988-09-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB08720643A Expired GB2193672B (en) 1984-04-19 1987-09-02 Semiconductor device

Country Status (1)

Country Link
GB (1) GB2193672B (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507033A (en) * 1965-01-06 1970-04-21 Western Electric Co Ultrasonic bonding method

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Publication number Publication date
GB8720643D0 (en) 1987-10-07
GB2193672A (en) 1988-02-17

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