SE323436B - - Google Patents

Info

Publication number
SE323436B
SE323436B SE8323/67A SE832367A SE323436B SE 323436 B SE323436 B SE 323436B SE 8323/67 A SE8323/67 A SE 8323/67A SE 832367 A SE832367 A SE 832367A SE 323436 B SE323436 B SE 323436B
Authority
SE
Sweden
Application number
SE8323/67A
Inventor
T Palfi
J Butler
S Im
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SE323436B publication Critical patent/SE323436B/xx

Links

Classifications

    • H10W40/47—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
SE8323/67A 1966-06-13 1967-06-13 SE323436B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US557086A US3365620A (en) 1966-06-13 1966-06-13 Circuit package with improved modular assembly and cooling apparatus

Publications (1)

Publication Number Publication Date
SE323436B true SE323436B (index.php) 1970-05-04

Family

ID=24224001

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8323/67A SE323436B (index.php) 1966-06-13 1967-06-13

Country Status (10)

Country Link
US (1) US3365620A (index.php)
JP (1) JPS4421015B1 (index.php)
BE (1) BE696771A (index.php)
CH (1) CH456706A (index.php)
DE (1) DE1591199B1 (index.php)
ES (1) ES341637A1 (index.php)
FR (1) FR1521039A (index.php)
GB (1) GB1178566A (index.php)
NL (1) NL151611B (index.php)
SE (1) SE323436B (index.php)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
JPS4826069B1 (index.php) * 1968-03-04 1973-08-04
US3619734A (en) * 1969-12-17 1971-11-09 Rca Corp Assembly of series connected semiconductor elements having good heat dissipation
US3621338A (en) * 1970-01-02 1971-11-16 Fairchild Camera Instr Co Diaphragm-connected, leadless package for semiconductor devices
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US3697817A (en) * 1971-01-25 1972-10-10 Rca Corp Mounting attachment for a modular substrate
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4193081A (en) * 1978-03-24 1980-03-11 Massachusetts Institute Of Technology Means for effecting cooling within elements for a solar cell array
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
DE3146504A1 (de) * 1981-11-24 1983-06-01 Siemens AG, 1000 Berlin und 8000 München Kuehlkonzept fuer bausteine mit hoher verlustleistung
GB2136212B (en) * 1983-01-06 1986-10-15 Welwyn Electronics Ltd Cooling components on printed circuit boards
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
GB2135525B (en) * 1983-02-22 1986-06-18 Smiths Industries Plc Heat-dissipating chip carrier substrates
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
US4463409A (en) * 1983-03-22 1984-07-31 Westinghouse Electric Corp. Attitude independent evaporative cooling system
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4603345A (en) * 1984-03-19 1986-07-29 Trilogy Computer Development Partners, Ltd. Module construction for semiconductor chip
US4722914A (en) * 1984-05-30 1988-02-02 Motorola Inc. Method of making a high density IC module assembly
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
US4652065A (en) * 1985-02-14 1987-03-24 Prime Computer, Inc. Method and apparatus for providing a carrier termination for a semiconductor package
US4956749A (en) * 1987-11-20 1990-09-11 Hewlett-Packard Company Interconnect structure for integrated circuits
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
ATE105458T1 (de) * 1990-08-03 1994-05-15 Siemens Nixdorf Inf Syst Einbausystem fuer elektrische funktionseinheiten insbesondere fuer die datentechnik.
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
US6270262B1 (en) 1999-11-10 2001-08-07 Harris Corporation Optical interconnect module
JP3730968B2 (ja) * 2003-03-26 2006-01-05 Ｔｄｋ株式会社 スイッチング電源
US7538425B2 (en) * 2004-07-28 2009-05-26 Delphi Technologies, Inc. Power semiconductor package having integral fluid cooling
AT13232U1 (de) * 2011-12-28 2013-08-15 Austria Tech & System Tech Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte
US9721870B2 (en) 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178165B (nl) * 1953-05-07 1900-01-01 Bristol Myers Co Werkwijze voor het bereiden of vervaardigen van een geneesmiddel met bloeddrukverlagende en/of bloedplaatjesaggregatie tegenwerkende activiteit; werkwijze voor het bereiden van een verbinding met een dergelijke activiteit.
DE1778242U (de) * 1958-09-23 1958-11-27 Metz Transformatoren & App Traegerplatte fuer gedruckte schaltungen.
NL250171A (index.php) * 1959-06-23
DE1139894B (de) * 1960-06-20 1962-11-22 Siemens Ag Einschubrahmen zur Aufnahme mehrerer Schaltungsplatten fuer Fernmeldeanlagen, insbesondere Fernsprechvermittlungsanlagen
US3157828A (en) * 1960-08-11 1964-11-17 Gen Motors Corp Encapsulated printed circuit module with heat transfer means
DE1150724B (de) * 1961-02-27 1963-06-27 Siemens Ag Blockfoermige Vorrichtung zum Halt fuer elektrische Bauelemente
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
DE1895660U (de) * 1963-11-13 1964-07-02 Siemens Ag Schutzkappe fuer elektrische bauelemente fuer fernmelde-, insbesondere fernsprechanlagen.

Also Published As

Publication number Publication date
JPS4421015B1 (index.php) 1969-09-09
GB1178566A (en) 1970-01-21
ES341637A1 (es) 1968-07-01
NL6708155A (index.php) 1967-12-14
CH456706A (de) 1968-07-31
FR1521039A (fr) 1968-04-12
DE1591199B1 (de) 1970-12-10
BE696771A (index.php) 1967-09-18
NL151611B (nl) 1976-11-15
US3365620A (en) 1968-01-23

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