SE318950B - - Google Patents

Info

Publication number
SE318950B
SE318950B SE3671/66A SE367166A SE318950B SE 318950 B SE318950 B SE 318950B SE 3671/66 A SE3671/66 A SE 3671/66A SE 367166 A SE367166 A SE 367166A SE 318950 B SE318950 B SE 318950B
Authority
SE
Sweden
Application number
SE3671/66A
Inventor
F Beyerlein
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE318950B publication Critical patent/SE318950B/xx

Links

Classifications

    • H10P72/0441
    • H10W74/01
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SE3671/66A 1965-03-18 1966-03-18 SE318950B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0096025 1965-03-18

Publications (1)

Publication Number Publication Date
SE318950B true SE318950B (index.php) 1969-12-22

Family

ID=7519772

Family Applications (1)

Application Number Title Priority Date Filing Date
SE3671/66A SE318950B (index.php) 1965-03-18 1966-03-18

Country Status (7)

Country Link
BE (1) BE678041A (index.php)
DE (1) DE1514418A1 (index.php)
ES (1) ES324264A1 (index.php)
FR (1) FR1473478A (index.php)
GB (1) GB1115105A (index.php)
NL (1) NL6601942A (index.php)
SE (1) SE318950B (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2549291B2 (fr) * 1982-10-29 1986-05-09 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
FR2535526B1 (fr) * 1982-10-29 1986-03-28 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
US10542978B2 (en) 2011-05-27 2020-01-28 Covidien Lp Method of internally potting or sealing a handheld medical device

Also Published As

Publication number Publication date
GB1115105A (en) 1968-05-29
FR1473478A (fr) 1967-03-17
BE678041A (index.php) 1966-09-19
DE1514418A1 (de) 1969-06-26
NL6601942A (index.php) 1966-09-19
ES324264A1 (es) 1967-02-01

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