SE316238B - - Google Patents
Info
- Publication number
- SE316238B SE316238B SE2605/66A SE260566A SE316238B SE 316238 B SE316238 B SE 316238B SE 2605/66 A SE2605/66 A SE 2605/66A SE 260566 A SE260566 A SE 260566A SE 316238 B SE316238 B SE 316238B
- Authority
- SE
- Sweden
- Prior art keywords
- layer
- wafer
- electrode
- bumps
- silver
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 5
- 239000004332 silver Substances 0.000 abstract 5
- 229910052709 silver Inorganic materials 0.000 abstract 5
- 238000005530 etching Methods 0.000 abstract 4
- 230000000873 masking effect Effects 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0231—Manufacturing methods of the redistribution layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05541—Structure
- H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0616—Random array, i.e. array with no symmetry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
- H01L2224/13024—Disposition the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43591865A | 1965-03-01 | 1965-03-01 | |
| US511780A US3408271A (en) | 1965-03-01 | 1965-12-06 | Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE316238B true SE316238B (de) | 1969-10-20 |
Family
ID=27030742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE2605/66A SE316238B (de) | 1965-03-01 | 1966-02-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3408271A (de) |
| DE (1) | DE1564066B2 (de) |
| GB (1) | GB1100718A (de) |
| NL (1) | NL6602549A (de) |
| SE (1) | SE316238B (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1175667A (en) * | 1966-04-07 | 1969-12-23 | Associated Semiconductor Mft | Improvements in the Electrodeposition of Metals using a Composite Mask |
| US3484341A (en) * | 1966-09-07 | 1969-12-16 | Itt | Electroplated contacts for semiconductor devices |
| NL6701136A (de) * | 1967-01-25 | 1968-07-26 | ||
| US3623961A (en) * | 1968-01-12 | 1971-11-30 | Philips Corp | Method of providing an electric connection to a surface of an electronic device and device obtained by said method |
| US3625837A (en) * | 1969-09-18 | 1971-12-07 | Singer Co | Electroplating solder-bump connectors on microcircuits |
| GB1337283A (en) * | 1969-12-26 | 1973-11-14 | Hitachi Ltd | Method of manufacturing a semiconductor device |
| US4113578A (en) * | 1973-05-31 | 1978-09-12 | Honeywell Inc. | Microcircuit device metallization |
| US4011143A (en) * | 1973-06-25 | 1977-03-08 | Honeywell Inc. | Material deposition masking for microcircuit structures |
| US3987226A (en) * | 1974-11-27 | 1976-10-19 | The Bendix Corporation | Face plate for an acoustical optical image tube |
| JPH03142934A (ja) * | 1989-10-30 | 1991-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置の配線接続構造 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2834723A (en) * | 1953-12-31 | 1958-05-13 | Northern Engraving & Mfg Co | Method of electroplating printed circuits |
| US2861029A (en) * | 1955-12-14 | 1958-11-18 | Western Electric Co | Methods of making printed wiring circuits |
| US3253320A (en) * | 1959-02-25 | 1966-05-31 | Transitron Electronic Corp | Method of making semi-conductor devices with plated area |
| US3208921A (en) * | 1962-01-02 | 1965-09-28 | Sperry Rand Corp | Method for making printed circuit boards |
| NL287926A (de) * | 1962-01-19 | 1900-01-01 |
-
1965
- 1965-12-06 US US511780A patent/US3408271A/en not_active Expired - Lifetime
-
1966
- 1966-02-04 GB GB5010/66A patent/GB1100718A/en not_active Expired
- 1966-02-21 DE DE1564066A patent/DE1564066B2/de active Pending
- 1966-02-25 NL NL6602549A patent/NL6602549A/xx unknown
- 1966-02-28 SE SE2605/66A patent/SE316238B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1564066B2 (de) | 1974-07-04 |
| NL6602549A (de) | 1966-09-02 |
| US3408271A (en) | 1968-10-29 |
| GB1100718A (en) | 1968-01-24 |
| DE1564066A1 (de) | 1970-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1143148A (en) | Air gap isolated semiconductor device | |
| GB1230421A (de) | ||
| FR2097133A1 (de) | ||
| GB938181A (en) | Improvements in or relating to semiconductor devices | |
| GB1377601A (en) | Semiconductor structure with projecting pillars or the like and method for making the same | |
| GB1082317A (en) | Semiconductor devices and methods of making them | |
| SE316238B (de) | ||
| GB988367A (en) | Semiconductor devices and method of fabricating same | |
| GB1237099A (en) | Method of making electrical contact to one or more semiconductor components | |
| GB1127070A (en) | Electroplated contacts for semiconductor devices | |
| US4023260A (en) | Method of manufacturing semiconductor diodes for use in millimeter-wave circuits | |
| US3716765A (en) | Semiconductor device with protective glass sealing | |
| GB1515184A (en) | Semiconductor device manufacture | |
| GB1166659A (en) | A method of Forming Metallic Patterns on Substrate Bodies | |
| GB1283376A (en) | A method of producing a semiconductor device or a circuit with layer-type components | |
| GB1233139A (de) | ||
| US4023258A (en) | Method of manufacturing semiconductor diodes for use in millimeter-wave circuits | |
| GB1246414A (en) | Diffusion barrier for semiconductor contacts | |
| GB1368190A (en) | Monolithic integrated circuit | |
| GB1110993A (en) | Semiconductors | |
| GB1294516A (en) | Improvements in or relating to the fabrication of semiconductor devices | |
| US3514848A (en) | Method of making a semiconductor device with protective glass sealing | |
| ES365276A1 (es) | Un procedimiento para fabricar un dispositivo semiconduc- tor. | |
| GB1416650A (en) | Method of depositing electrode leads | |
| JPS5749252A (en) | Manufacture of semiconductor device |