SE316238B - - Google Patents

Info

Publication number
SE316238B
SE316238B SE2605/66A SE260566A SE316238B SE 316238 B SE316238 B SE 316238B SE 2605/66 A SE2605/66 A SE 2605/66A SE 260566 A SE260566 A SE 260566A SE 316238 B SE316238 B SE 316238B
Authority
SE
Sweden
Prior art keywords
layer
wafer
electrode
bumps
silver
Prior art date
Application number
SE2605/66A
Other languages
English (en)
Inventor
K Reissmueller
R Alexander
M Reissmueller
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of SE316238B publication Critical patent/SE316238B/xx

Links

Classifications

    • H10P95/00—
    • H10P14/47—
    • H10W20/40—
    • H10W72/012—
    • H10W70/05—
    • H10W72/019—
    • H10W72/244—
    • H10W72/922—
    • H10W72/9445—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
SE2605/66A 1965-03-01 1966-02-28 SE316238B (Direct)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43591865A 1965-03-01 1965-03-01
US511780A US3408271A (en) 1965-03-01 1965-12-06 Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates

Publications (1)

Publication Number Publication Date
SE316238B true SE316238B (Direct) 1969-10-20

Family

ID=27030742

Family Applications (1)

Application Number Title Priority Date Filing Date
SE2605/66A SE316238B (Direct) 1965-03-01 1966-02-28

Country Status (5)

Country Link
US (1) US3408271A (Direct)
DE (1) DE1564066B2 (Direct)
GB (1) GB1100718A (Direct)
NL (1) NL6602549A (Direct)
SE (1) SE316238B (Direct)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3484341A (en) * 1966-09-07 1969-12-16 Itt Electroplated contacts for semiconductor devices
NL6701136A (Direct) * 1967-01-25 1968-07-26
US3623961A (en) * 1968-01-12 1971-11-30 Philips Corp Method of providing an electric connection to a surface of an electronic device and device obtained by said method
US3625837A (en) * 1969-09-18 1971-12-07 Singer Co Electroplating solder-bump connectors on microcircuits
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US4113578A (en) * 1973-05-31 1978-09-12 Honeywell Inc. Microcircuit device metallization
US4011143A (en) * 1973-06-25 1977-03-08 Honeywell Inc. Material deposition masking for microcircuit structures
US3987226A (en) * 1974-11-27 1976-10-19 The Bendix Corporation Face plate for an acoustical optical image tube
JPH03142934A (ja) * 1989-10-30 1991-06-18 Mitsubishi Electric Corp 半導体集積回路装置の配線接続構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2834723A (en) * 1953-12-31 1958-05-13 Northern Engraving & Mfg Co Method of electroplating printed circuits
US2861029A (en) * 1955-12-14 1958-11-18 Western Electric Co Methods of making printed wiring circuits
US3253320A (en) * 1959-02-25 1966-05-31 Transitron Electronic Corp Method of making semi-conductor devices with plated area
US3208921A (en) * 1962-01-02 1965-09-28 Sperry Rand Corp Method for making printed circuit boards
NL287926A (Direct) * 1962-01-19 1900-01-01

Also Published As

Publication number Publication date
US3408271A (en) 1968-10-29
GB1100718A (en) 1968-01-24
NL6602549A (Direct) 1966-09-02
DE1564066A1 (de) 1970-01-15
DE1564066B2 (de) 1974-07-04

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