SE312610B - - Google Patents

Info

Publication number
SE312610B
SE312610B SE5642/66A SE564266A SE312610B SE 312610 B SE312610 B SE 312610B SE 5642/66 A SE5642/66 A SE 5642/66A SE 564266 A SE564266 A SE 564266A SE 312610 B SE312610 B SE 312610B
Authority
SE
Sweden
Application number
SE5642/66A
Inventor
H Vogt
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE312610B publication Critical patent/SE312610B/xx

Links

Classifications

    • H10W90/00
    • H10W40/613
SE5642/66A 1965-06-10 1966-04-24 SE312610B (ref)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0097542 1965-06-10
DES0098953 1965-08-20

Publications (1)

Publication Number Publication Date
SE312610B true SE312610B (ref) 1969-07-21

Family

ID=25998114

Family Applications (1)

Application Number Title Priority Date Filing Date
SE5642/66A SE312610B (ref) 1965-06-10 1966-04-24

Country Status (9)

Country Link
US (1) US3436603A (ref)
AT (1) AT258418B (ref)
BE (1) BE681710A (ref)
CH (1) CH446536A (ref)
DE (2) DE1514477C3 (ref)
ES (1) ES327711A1 (ref)
FR (1) FR1484076A (ref)
GB (1) GB1144582A (ref)
SE (1) SE312610B (ref)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3523215A (en) * 1968-03-19 1970-08-04 Westinghouse Electric Corp Stack module for flat package semiconductor device assemblies
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
US4604529A (en) * 1984-09-28 1986-08-05 Cincinnati Microwave, Inc. Radar warning receiver with power plug
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4943686A (en) * 1988-04-18 1990-07-24 Andrzej Kucharek Seal frame and method of use
US4896062A (en) * 1988-06-03 1990-01-23 Westinghouse Electric Corp. Rotating rectifier assembly
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
RU2133523C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
EP2244289B1 (en) * 2000-04-19 2014-03-26 Denso Corporation Coolant cooled type semiconductor device
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
DE102010013165A1 (de) * 2010-03-27 2011-09-29 Converteam Technology Ltd. Vorrichtung zur Positionierung eines Leistungshalbleiters

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA456532A (en) * 1943-08-11 1949-05-10 Canadian Westinghouse Company Rectifier assembly
BE620870A (ref) * 1961-08-04 1900-01-01

Also Published As

Publication number Publication date
DE1514539A1 (de) 1969-07-03
AT258418B (de) 1967-11-27
DE1514477A1 (de) 1969-04-24
DE1514477C3 (de) 1975-06-26
FR1484076A (fr) 1967-06-09
BE681710A (ref) 1966-10-31
US3436603A (en) 1969-04-01
GB1144582A (en) 1969-03-05
CH446536A (de) 1967-11-15
DE1514539B2 (de) 1975-03-06
DE1514539C3 (de) 1975-11-06
DE1514477B2 (de) 1974-11-07
ES327711A1 (es) 1967-08-01

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