SE307620B - - Google Patents

Info

Publication number
SE307620B
SE307620B SE12237/64A SE1223764A SE307620B SE 307620 B SE307620 B SE 307620B SE 12237/64 A SE12237/64 A SE 12237/64A SE 1223764 A SE1223764 A SE 1223764A SE 307620 B SE307620 B SE 307620B
Authority
SE
Sweden
Application number
SE12237/64A
Inventor
T Moore
Original Assignee
American Mach & Foundry
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Mach & Foundry filed Critical American Mach & Foundry
Publication of SE307620B publication Critical patent/SE307620B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49787—Obtaining plural composite product pieces from preassembled workpieces
SE12237/64A 1963-10-11 1964-10-12 SE307620B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US315647A US3295089A (en) 1963-10-11 1963-10-11 Semiconductor device

Publications (1)

Publication Number Publication Date
SE307620B true SE307620B (xx) 1969-01-13

Family

ID=23225411

Family Applications (1)

Application Number Title Priority Date Filing Date
SE12237/64A SE307620B (xx) 1963-10-11 1964-10-12

Country Status (4)

Country Link
US (1) US3295089A (xx)
DE (1) DE1254251B (xx)
GB (1) GB1040876A (xx)
SE (1) SE307620B (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368122A (en) * 1965-10-14 1968-02-06 Gen Electric Semiconductor devices
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
JPS5116302B2 (xx) * 1973-10-22 1976-05-22
US4107515A (en) * 1976-09-09 1978-08-15 Texas Instruments Incorporated Compact PTC resistor
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4204628A (en) * 1978-07-24 1980-05-27 General Electric Company Method for thermo-compression diffusion bonding
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
US4257156A (en) * 1979-03-09 1981-03-24 General Electric Company Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers
WO1980001967A1 (en) * 1979-03-08 1980-09-18 Gen Electric Thermo-compression bonding a semiconductor to strain buffer
US4315591A (en) * 1979-03-08 1982-02-16 General Electric Company Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer
US4290080A (en) * 1979-09-20 1981-09-15 General Electric Company Method of making a strain buffer for a semiconductor device
US4252263A (en) * 1980-04-11 1981-02-24 General Electric Company Method and apparatus for thermo-compression diffusion bonding
US4361717A (en) * 1980-12-05 1982-11-30 General Electric Company Fluid cooled solar powered photovoltaic cell
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
US4366713A (en) * 1981-03-25 1983-01-04 General Electric Company Ultrasonic bond testing of semiconductor devices
US4444352A (en) * 1981-09-17 1984-04-24 General Electric Company Method of thermo-compression diffusion bonding together metal surfaces
DE3212592C2 (de) * 1982-04-03 1984-01-12 Philips Kommunikations Industrie AG, 8500 Nürnberg Kühleinrichtung für Geräte der Nachrichtentechnik
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
EP1182701A1 (de) * 2000-08-21 2002-02-27 Abb Research Ltd. Verfahren zur Herstellung eines Pufferelementes zur Verminderung von mechanischen Spannungen
WO2019053256A1 (en) * 2017-09-15 2019-03-21 Finar Module Sagl PACKAGING METHOD AND ASSEMBLY TECHNOLOGY FOR AN ELECTRONIC DEVICE

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2321071A (en) * 1941-06-18 1943-06-08 Bell Telephone Labor Inc Method of assembling dry rectifiers and the like with solder
FR1094755A (xx) * 1955-01-20 1955-05-24
NL212349A (xx) * 1955-04-22 1900-01-01
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
DE1057241B (de) * 1955-12-12 1959-05-14 Siemens Ag Gleichrichteranordnung mit Halbleiterelement
US2977558A (en) * 1958-06-19 1961-03-28 Cutler Hammer Inc Thermal responsive resistance devices
FR1213484A (fr) * 1958-08-04 1960-04-01 Thomson Houston Comp Francaise Milieu conducteur non isotrope pour flux thermique intense
US2978661A (en) * 1959-03-03 1961-04-04 Battelle Memorial Institute Semiconductor devices
NL263391A (xx) * 1960-06-21
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
AT222227B (de) * 1960-06-23 1962-07-10 Siemens Ag Halbleiteranordnung
NL274434A (xx) * 1961-02-06 1900-01-01

Also Published As

Publication number Publication date
DE1254251B (de) 1967-11-16
GB1040876A (en) 1966-09-01
US3295089A (en) 1966-12-27

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