SE0203370L - Anordning - Google Patents

Anordning

Info

Publication number
SE0203370L
SE0203370L SE0203370A SE0203370A SE0203370L SE 0203370 L SE0203370 L SE 0203370L SE 0203370 A SE0203370 A SE 0203370A SE 0203370 A SE0203370 A SE 0203370A SE 0203370 L SE0203370 L SE 0203370L
Authority
SE
Sweden
Application number
SE0203370A
Other languages
English (en)
Swedish (sv)
Other versions
SE0203370D0 (sv
SE524893C2 (sv
Inventor
Anders Elo
Joergen Eriksson
Niclas Sonesson
Original Assignee
Packetfront Sweden Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Packetfront Sweden Ab filed Critical Packetfront Sweden Ab
Priority to SE0203370A priority Critical patent/SE524893C2/sv
Publication of SE0203370D0 publication Critical patent/SE0203370D0/xx
Priority to US10/385,210 priority patent/US6839232B2/en
Priority to AU2003279658A priority patent/AU2003279658A1/en
Priority to JP2004551340A priority patent/JP2006506808A/ja
Priority to CA002505313A priority patent/CA2505313A1/en
Priority to CNA2003801031717A priority patent/CN1711814A/zh
Priority to RU2005118082/09A priority patent/RU2005118082A/ru
Priority to EP03772998A priority patent/EP1566084A1/en
Priority to KR1020057008676A priority patent/KR20050086649A/ko
Priority to PCT/SE2003/001759 priority patent/WO2004045264A1/en
Publication of SE0203370L publication Critical patent/SE0203370L/xx
Publication of SE524893C2 publication Critical patent/SE524893C2/sv
Priority to NO20052486A priority patent/NO20052486D0/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE0203370A 2002-11-14 2002-11-14 Värmeavledande hölje med diagonalformade flänsade profiler SE524893C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE0203370A SE524893C2 (sv) 2002-11-14 2002-11-14 Värmeavledande hölje med diagonalformade flänsade profiler
US10/385,210 US6839232B2 (en) 2002-11-14 2003-03-10 Fan-less housing
PCT/SE2003/001759 WO2004045264A1 (en) 2002-11-14 2003-11-13 A housing for electronic circuits and components
CA002505313A CA2505313A1 (en) 2002-11-14 2003-11-13 A housing for electronic circuits and components
JP2004551340A JP2006506808A (ja) 2002-11-14 2003-11-13 電子回路およびコンポーネント用ハウジング
AU2003279658A AU2003279658A1 (en) 2002-11-14 2003-11-13 A housing for electronic circuits and components
CNA2003801031717A CN1711814A (zh) 2002-11-14 2003-11-13 一种用于电子电路和元件的外壳
RU2005118082/09A RU2005118082A (ru) 2002-11-14 2003-11-13 Корпус для электронных схем и элементов
EP03772998A EP1566084A1 (en) 2002-11-14 2003-11-13 A housing for electronic circuits and components
KR1020057008676A KR20050086649A (ko) 2002-11-14 2003-11-13 전자 회로 및 전자 부품용 하우징
NO20052486A NO20052486D0 (no) 2002-11-14 2005-05-24 Hus for elektroniske kretser og komponenter.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0203370A SE524893C2 (sv) 2002-11-14 2002-11-14 Värmeavledande hölje med diagonalformade flänsade profiler

Publications (3)

Publication Number Publication Date
SE0203370D0 SE0203370D0 (sv) 2002-11-14
SE0203370L true SE0203370L (sv) 2004-05-15
SE524893C2 SE524893C2 (sv) 2004-10-19

Family

ID=20289567

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0203370A SE524893C2 (sv) 2002-11-14 2002-11-14 Värmeavledande hölje med diagonalformade flänsade profiler

Country Status (11)

Country Link
US (1) US6839232B2 (xx)
EP (1) EP1566084A1 (xx)
JP (1) JP2006506808A (xx)
KR (1) KR20050086649A (xx)
CN (1) CN1711814A (xx)
AU (1) AU2003279658A1 (xx)
CA (1) CA2505313A1 (xx)
NO (1) NO20052486D0 (xx)
RU (1) RU2005118082A (xx)
SE (1) SE524893C2 (xx)
WO (1) WO2004045264A1 (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7447147B2 (en) 2003-02-28 2008-11-04 Cisco Technology, Inc. Ethernet switch with configurable alarms
US7268690B2 (en) * 2003-02-28 2007-09-11 Cisco Technology, Inc. Industrial ethernet switch
US7277295B2 (en) * 2003-02-28 2007-10-02 Cisco Technology, Inc. Industrial ethernet switch
KR100558065B1 (ko) * 2004-03-15 2006-03-10 삼성전자주식회사 방열체가 구비된 반도체 모듈
US7136286B2 (en) * 2005-01-10 2006-11-14 Aaeon Technology Inc. Industrial computer with aluminum case having fins as radiating device
KR101424136B1 (ko) * 2007-09-06 2014-08-04 삼성전자주식회사 발열핀을 갖는 전자부품용 열교환장치
JP4550919B2 (ja) * 2008-05-20 2010-09-22 ファナック株式会社 モータ駆動装置
CA2666014C (en) 2009-05-15 2016-08-16 Ruggedcom Inc. Open frame electronic chassis for enclosed modules
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
CN101998807A (zh) * 2009-08-19 2011-03-30 富瑞精密组件（昆山）有限公司 散热装置
TWI468912B (zh) * 2009-09-04 2015-01-11 Foxconn Tech Co Ltd 散熱裝置
CN102427708B (zh) * 2012-01-09 2016-03-16 北京柏瑞安科技有限责任公司 风光逆变蓄电控制器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2530157A1 (de) * 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
JPS63292696A (ja) * 1987-05-26 1988-11-29 Mitsubishi Electric Corp 電子回路モジュ−ル
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
DE4242944C2 (de) * 1992-12-18 2002-04-25 Bosch Gmbh Robert Elektrisches Steuergerät
EP0669651A1 (en) * 1994-02-28 1995-08-30 AT&T Corp. Method and apparatus for cooling electronic components
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
US5812372A (en) * 1996-06-07 1998-09-22 International Business Machines Corporation Tube in plate heat sink
JPH10200022A (ja) * 1997-01-14 1998-07-31 Matsushita Electric Ind Co Ltd 半導体発熱素子の放熱器
US6175501B1 (en) * 1998-12-31 2001-01-16 Lucent Technologies Inc. Method and arrangement for cooling an electronic assembly
US6680849B2 (en) * 2002-03-29 2004-01-20 Nortel Networks Corporation Extruded heatsink and EMC enclosure

Also Published As

Publication number Publication date
NO20052486L (no) 2005-05-24
CN1711814A (zh) 2005-12-21
SE0203370D0 (sv) 2002-11-14
SE524893C2 (sv) 2004-10-19
RU2005118082A (ru) 2006-01-20
AU2003279658A1 (en) 2004-06-03
US20040095720A1 (en) 2004-05-20
NO20052486D0 (no) 2005-05-24
JP2006506808A (ja) 2006-02-23
KR20050086649A (ko) 2005-08-30
US6839232B2 (en) 2005-01-04
EP1566084A1 (en) 2005-08-24
WO2004045264A1 (en) 2004-05-27
CA2505313A1 (en) 2004-05-27

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Legal Events

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