SE0202392D0 - Mirrors for polymer waveguides - Google Patents

Mirrors for polymer waveguides

Info

Publication number
SE0202392D0
SE0202392D0 SE0202392A SE0202392A SE0202392D0 SE 0202392 D0 SE0202392 D0 SE 0202392D0 SE 0202392 A SE0202392 A SE 0202392A SE 0202392 A SE0202392 A SE 0202392A SE 0202392 D0 SE0202392 D0 SE 0202392D0
Authority
SE
Sweden
Prior art keywords
plate
waveguide
substrate
optical
mirror structure
Prior art date
Application number
SE0202392A
Other languages
Swedish (sv)
Other versions
SE525405C2 (en
SE0202392L (en
Inventor
Mats Robertsson
Original Assignee
Acreo Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acreo Ab filed Critical Acreo Ab
Priority to SE0202392A priority Critical patent/SE525405C2/en
Publication of SE0202392D0 publication Critical patent/SE0202392D0/en
Priority to PCT/SE2003/001252 priority patent/WO2004015463A1/en
Priority to AU2003248585A priority patent/AU2003248585A1/en
Publication of SE0202392L publication Critical patent/SE0202392L/en
Publication of SE525405C2 publication Critical patent/SE525405C2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

In a substrate (15) such as a printed circuit board having optical wave guides (11, 7, 9) in its surface layers a mirror structure (17) is directly attached to a plate (1) and has a reflective, tilted surface (25). The mirror structure projects from an inner portion of the surface of the plate into a recess (13) in the substrate surface, the recess being made in the optical waveguide. The reflective surface thereby deflects light travelling in the waveguide. It can deflect light issued from the plate, in the case where the plate is e.g. a laser chip, to be injected into the waveguide. The reflective surface can also deflect light travelling in the waveguide to be received by the plate in the case where the plate has a photodetecting capability. The plate, e.g. a semiconductor chip, can be surface mounted to the substrate. For that purpose the plate has solder pads (21) cooperating with solder bumps (19) and such mounting can give the plate a very accurate position at the substrate surface. The plate can also be a dummy plate acting only as a carrier of the mirror structure that then can contain a plurality of reflecting surfaces placed on top of each other for deflecting light from one level of optical waveguides to another level and thus acts as an optical via.
SE0202392A 2002-08-09 2002-08-09 Mirrors for polymeric guides, process for their preparation, and optical waveguide device SE525405C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0202392A SE525405C2 (en) 2002-08-09 2002-08-09 Mirrors for polymeric guides, process for their preparation, and optical waveguide device
PCT/SE2003/001252 WO2004015463A1 (en) 2002-08-09 2003-08-06 Mirrors for polymer waveguides
AU2003248585A AU2003248585A1 (en) 2002-08-09 2003-08-06 Mirrors for polymer waveguides

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0202392A SE525405C2 (en) 2002-08-09 2002-08-09 Mirrors for polymeric guides, process for their preparation, and optical waveguide device

Publications (3)

Publication Number Publication Date
SE0202392D0 true SE0202392D0 (en) 2002-08-09
SE0202392L SE0202392L (en) 2004-04-13
SE525405C2 SE525405C2 (en) 2005-02-15

Family

ID=20288698

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0202392A SE525405C2 (en) 2002-08-09 2002-08-09 Mirrors for polymeric guides, process for their preparation, and optical waveguide device

Country Status (3)

Country Link
AU (1) AU2003248585A1 (en)
SE (1) SE525405C2 (en)
WO (1) WO2004015463A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004043001B3 (en) * 2004-09-02 2006-02-16 Siemens Ag Substrate component with embedded optical fibre and radiation deflection, with optical fibre accessible via hole in assembly side, with hole available for radiation deflection in assembly side direction
DE102006001429A1 (en) * 2006-01-10 2007-03-22 Infineon Technologies Ag Semiconductor component functional unit and production process has rows and columns of chips on a connection plate and a multi-layer wiring structure insulated by a hybrid organic-inorganic polymer dielectric
DE102006041378A1 (en) * 2006-08-29 2008-03-13 Siemens Ag Conductor plate has optical layer, in which optical wave guide is formed, and has support for optical component, in which optical interface of optical wave guide is formed for optical component
JP2011033876A (en) 2009-08-03 2011-02-17 Nitto Denko Corp Method of manufacturing optical sensor module and optical sensor module obtained thereby
JP5308408B2 (en) 2010-07-27 2013-10-09 日東電工株式会社 Optical sensor module
JP5325184B2 (en) 2010-08-31 2013-10-23 日東電工株式会社 Optical sensor module
JP5693986B2 (en) 2011-02-03 2015-04-01 日東電工株式会社 Optical sensor module
US8968987B2 (en) * 2012-01-11 2015-03-03 International Business Machines Corporation Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
CN103676039A (en) * 2012-08-29 2014-03-26 华通电脑股份有限公司 Photoelectric circuit board capable of enabling light source to be accurately aligned
JP6361298B2 (en) * 2014-06-09 2018-07-25 新光電気工業株式会社 Optical waveguide device and manufacturing method thereof
JP6437875B2 (en) * 2015-04-21 2018-12-12 新光電気工業株式会社 Optical waveguide device and manufacturing method thereof
US10180548B2 (en) * 2015-04-27 2019-01-15 Kyocera Corporation Optical transmission substrate and optical transmission module
JP6842377B2 (en) * 2017-06-20 2021-03-17 日本電信電話株式会社 Planar optical circuit laminated device
CN111913163A (en) * 2019-05-07 2020-11-10 苏州旭创科技有限公司 Optical signal transmitter and laser radar

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295937A (en) * 1993-03-26 1994-10-21 Nec Corp Mounting method of photoelectric element
US5479426A (en) * 1994-03-04 1995-12-26 Matsushita Electronics Corporation Semiconductor laser device with integrated reflector on a (511) tilted lattice plane silicon substrate
US5793785A (en) * 1994-03-04 1998-08-11 Matsushita Electronics Corporation Semiconductor laser device
DE19845227A1 (en) * 1998-10-01 2000-04-06 Daimler Chrysler Ag Arrangement for adjusting optical components
JP4429564B2 (en) * 1999-09-09 2010-03-10 富士通株式会社 Mounting structure and method of optical component and electric component

Also Published As

Publication number Publication date
SE525405C2 (en) 2005-02-15
AU2003248585A1 (en) 2004-02-25
SE0202392L (en) 2004-04-13
WO2004015463A1 (en) 2004-02-19

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Legal Events

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