SE0001367D0 - Apparatus and method for electrochemical processing of substrates - Google Patents

Apparatus and method for electrochemical processing of substrates

Info

Publication number
SE0001367D0
SE0001367D0 SE0001367A SE0001367A SE0001367D0 SE 0001367 D0 SE0001367 D0 SE 0001367D0 SE 0001367 A SE0001367 A SE 0001367A SE 0001367 A SE0001367 A SE 0001367A SE 0001367 D0 SE0001367 D0 SE 0001367D0
Authority
SE
Sweden
Prior art keywords
chamber
substrate
electrochemical processing
electrolyte
container
Prior art date
Application number
SE0001367A
Other languages
Swedish (sv)
Other versions
SE0001367L (en
Inventor
Mats Haallberg
Lennart Olsson
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE0001367A priority Critical patent/SE0001367L/en
Publication of SE0001367D0 publication Critical patent/SE0001367D0/en
Priority to AU48968/01A priority patent/AU4896801A/en
Priority to PCT/SE2001/000824 priority patent/WO2001079592A1/en
Publication of SE0001367L publication Critical patent/SE0001367L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Abstract

In a method for electrochemical processing of a substrate (S), use is made of an apparatus which comprises a container (1) having a chamber for holding an electrolyte, an electrode member (8) arranged in the chamber, and a substrate holder (60) arranged in the chamber and adapted to carry the substrate (S). A voltage source is connected to the electrode member (8) and the substrate holder (60) to establish, during processing, an electrical field in the electrolyte between the electrode member (8) and the substrate (S) carried by the substrate holder (60). A pressure control means is adapted to establish a subatmospheric pressure in the chamber during the electrochemical processing so that leakage of electrolyte from the container (1) to the surroundings is eliminated and so that the parts of the container (1) are automatically held together by the subatmospheric pressure in the chamber.
SE0001367A 2000-04-13 2000-04-13 Apparatus and method for electrochemical processing of substrates SE0001367L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001367A SE0001367L (en) 2000-04-13 2000-04-13 Apparatus and method for electrochemical processing of substrates
AU48968/01A AU4896801A (en) 2000-04-13 2001-04-12 Apparatus and method for electrochemical processing of substrates
PCT/SE2001/000824 WO2001079592A1 (en) 2000-04-13 2001-04-12 Apparatus and method for electrochemical processing of substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001367A SE0001367L (en) 2000-04-13 2000-04-13 Apparatus and method for electrochemical processing of substrates

Publications (2)

Publication Number Publication Date
SE0001367D0 true SE0001367D0 (en) 2000-04-13
SE0001367L SE0001367L (en) 2001-10-14

Family

ID=20279303

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001367A SE0001367L (en) 2000-04-13 2000-04-13 Apparatus and method for electrochemical processing of substrates

Country Status (3)

Country Link
AU (1) AU4896801A (en)
SE (1) SE0001367L (en)
WO (1) WO2001079592A1 (en)

Families Citing this family (26)

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Publication number Priority date Publication date Assignee Title
KR100827741B1 (en) 2000-07-17 2008-05-07 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 Method and system of automatic fluid dispensing for imprint lithography processes
US7037639B2 (en) 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US6951173B1 (en) 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US6805054B1 (en) 2003-05-14 2004-10-19 Molecular Imprints, Inc. Method, system and holder for transferring templates during imprint lithography processes
US7730834B2 (en) 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
US7676088B2 (en) 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7490547B2 (en) 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US7922474B2 (en) 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US7523701B2 (en) 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
US7611348B2 (en) 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7762186B2 (en) 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
US7442029B2 (en) 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US7692771B2 (en) 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7708924B2 (en) 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
US7377764B2 (en) 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7878791B2 (en) 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US8015939B2 (en) 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7603626L (en) * 1975-03-27 1977-01-04 Otto Alfred Becker DEVICE FOR GALVANIZING METAL SURFACES, SEPARATELY AT CUTTING EDGE WITH STACKING CUTTING PLATES
US4163705A (en) * 1975-05-06 1979-08-07 Korpi Teuvo Tapio Apparatus for chemical and electrochemical treatment
IT1177925B (en) * 1984-07-24 1987-08-26 Centro Speriment Metallurg PROCEDURE FOR CONTINUOUS ELECTRODEPOSITION OF METALS WITH HIGH CURRENT DENISTA OF VERTICAL CELLS AND RELEVANT IMPLEMENTATION DEVICE
FR2648157A1 (en) * 1989-06-13 1990-12-14 Traitement Surface Mecanique Device making it possible to ensure homogeneous electrolytic deposition on cylindrical surfaces of large dimensions
US5180438A (en) * 1989-10-11 1993-01-19 Hockh Metall-Reinigungsanlagen Gmbh Cleaning and drying system
SE467976B (en) * 1991-02-20 1992-10-12 Dcm Innovation Ab DEVICE FOR ELECTRICAL PLATING, IN THE MANUFACTURE OF MATRISTS FOR THE MANUFACTURE OF EX EX CDS AND PROCEDURES FOR THE MANUFACTURE OF MATRICES BY THE DEVICE
US5660699A (en) * 1995-02-20 1997-08-26 Kao Corporation Electroplating apparatus
JPH08283995A (en) * 1995-04-13 1996-10-29 Seikosha Co Ltd Plating device
US5522975A (en) * 1995-05-16 1996-06-04 International Business Machines Corporation Electroplating workpiece fixture
US5683564A (en) * 1996-10-15 1997-11-04 Reynolds Tech Fabricators Inc. Plating cell and plating method with fluid wiper

Also Published As

Publication number Publication date
AU4896801A (en) 2001-10-30
WO2001079592A1 (en) 2001-10-25
SE0001367L (en) 2001-10-14

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